DLA SMD-5962-04228-2004 MICROCIRCUITS DIGITAL ADVANCED CMOS UP DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK TTL COMPLATIBLE INPUTS MONOLITHIC SILICON《硅单片互补晶体管-晶体管逻辑电路 装有预先装置及脉冲.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 19 20 21 REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432

2、18-3990 http:/www.dscc.dla.mil APPROVED BY Thomas M. Hess THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 04-11-18 MICROCIRCUITS, DIGITAL, ADVANCED CMOS, UP/DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK, TTL COMPLATIBLE INPUTS,

3、MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-04228 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E362-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMB

4、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are avai

5、lable and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. 5962 F 04228 01 V X A Federal RHA Device Device Case Lead stock class designator ty

6、pe class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M

7、RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC

8、T191 Up/down binary counter with preset and ripple clock, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this

9、drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3

10、8535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 3 D

11、SCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDFP4-F16 16 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or M

12、IL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) 20 mA DC output curre

13、nt (IOUT) (per pin) 50 mA DC VCCor GND current (ICC, IGND) (per pin) 100 mA Maximum power dissipation (PD) 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C

14、 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) 4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMinimum high level input voltage (VIH). 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Case operating temperat

15、ure range (TC). -55C to +125C Input rise and fall rate (t/V) maximum: (From VIN= 0.8 V to 2.0 V, 2.0 V to 0.8 V). 10 ns/V Maximum high level output current (IOH) . -24 mA Maximum low level output current (IOL) . +24 mA 1.5 Radiation features. Device type 01: Maximum total dose available (dose rate =

16、 50 300 rads (Si)/s) 300 krads (Si) Single Event Latch-up (SEL) . 93 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exc

17、eeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ Unless otherwise specified, all values listed above shall apply over the full VCCand TCrecommended operating range. Provide

18、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, stand

19、ards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integr

20、ated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-

21、HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publica

22、tions. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXX

23、X and 54/74ACTXXXX Advanced High-Speed CMOS Devices (Copies of these documents are available online at http:/www.jedec.org or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order of precedence. In the event of a conflict between the text of this drawin

24、g and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and

25、V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be i

26、n accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, a

27、ppendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagra

28、m. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

29、UIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.7 Radiation exposure circuit. The radiation

30、exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the elec

31、trical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests fo

32、r each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of

33、 not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/com

34、pliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance

35、 shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 he

36、rein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-3

37、8535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change

38、for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquir

39、ing activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall

40、 be in microcircuit group number 40 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC

41、FORM 2234 APR 97 Table I. Electrical performance characteristics. Limits 4/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V Unless otherwise specified Devicetype and device class VCCGroup A subgroups Min Max Unit Positive input clamp voltage 3022 VIC+

42、For input under test, IIN= 1.0 mA All Q, V 0.0 V 1 0.4 1.5 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -1.0 mA All Q, V Open 1 -0.4 -1.5 V 4.5 V 4.4 IOH= -50 A 5.5 V 1, 2, 3 5.4 4.5 V 1, 2, 3 3.7 IOH= -24 mA 5.5 V 1, 2, 3 4.7 High level output voltage 3006 VOH For all inputs a

43、ffecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -50 mA 5/ All All 5.5 V 1, 2, 3 3.85 V 4.5 V 0.1 IOL= 50 A 5.5 V 1, 2, 3 0.1 1 0.36 4.5 V 2, 3 0.5 1 0.36 IOL= 24 mA 5.5 V 2, 3 0.5 Low level output voltage 3007 VOL For all inputs affecting output under test VIN

44、= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 50 mA 5/ All All 5.5 V 1, 2, 3 1.65 V 1 -0.1 Input leakage current low 3009 IILFor inputs under test, VIN= GND For all other inputs, VIN= VCCor GND All All 5.5 V 2, 3 -1.0 A 1 0.1 Input leakage current high 3010 IIHFor inputs under test, VIN=

45、 5.5 V For all other inputs, VIN= VCCor GND All All 5.5 V 2, 3 1.0 A Quiescent supply current delta, TTL input levels 3005 ICC 6/ For input under test VIN= VCC- 2.1 V For all other inputs VIN= VCCor GND All All 5.5 V 1, 2, 3 1.6 mA See footnotes at end of table. Provided by IHSNot for ResaleNo repro

46、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Limits 4/ Test and MIL-STD-883

47、 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V Unless otherwise specified Device type and device class VCCGroup A subgroups Min Max Unit 1 4 For all inputs, VIN= VCCor GND All All 5.5 V 2, 3 80 Quiescent supply current, output high 3005 ICCHM, D, P, L, R, F 7/ All All 5

48、.5 V 1 50 A 1 4 For all inputs, VIN= VCCor GND All All 5.5 V 2, 3 80 Quiescent supply current, output low 3005 ICCLM, D, P, L, R, F 7/ All All 5.5 V 1 50 A Low level ground bounce noise VGBL8/ VLD= 2.5 V IOL= +24 mA See figure 4 All Q, V 4.5 V 4 1200 mV High level ground bounce noise VGBH8/ VLD= 2.5

49、 V IOH= -24 mA See figure 4 All Q, V 4.5 V 4 1000 mV Input capacitance 3012 CINSee 4.4.1c TC= +25C All All 5.0 V 4 10 pF Power dissipation capacitance CPD9/ See 4.4.1c TC= +25C, f = 1 MHz All All 5.0 V 4 85 pF 4.5 V 7, 8 L H Functional tests 3014 10/ VIN= 2.0 V or 0.8 V Verify output VOUTSee 4.4.1b All All