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本文(DLA SMD-5962-10235 REV A-2012 MICROCIRCUIT HYBRID LINEAR POSITIVE ULTRA LOW DROPOUT ADJUSTABLE AND FIXED OUTPUT VOLTAGE AGE REGULATOR.pdf)为本站会员(bonesoil321)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-10235 REV A-2012 MICROCIRCUIT HYBRID LINEAR POSITIVE ULTRA LOW DROPOUT ADJUSTABLE AND FIXED OUTPUT VOLTAGE AGE REGULATOR.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outlines 4, 5, and 6. Add paragraphs and tables for RHA devices. gc 12-04-02 Charles F. Saffle REV SHEET REV A A A A SHEET 15 16 17 18 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A P

2、REPARED BY Steve L. Duncan DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Greg Cecil COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY Charles F. Saffle MICROCIRCUIT, HYBRID, LINEAR, POSITIVE, ULTRA LOW DROPOUT, ADJUSTABL

3、E AND FIXED OUTPUT, VOLTAGE REGULATOR DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 10-08-29 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-10235 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E186-12Provided by IHSNot for ResaleNo reproduction or networking permitted

4、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A cho

5、ice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 10235 01 K X X Federal R

6、HA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels a

7、nd shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 IRUH3301A1 3.3 V Input, Adjustable Output (0.8 V min) 02 IRUH3301A2 5.0 V I

8、nput, Adjustable Output (0.8 V min) 03 IRUH330118 3.3 V Input, 1.8 V Fixed Output 04 IRUH330125 3.3 V Input, 2.5 V Fixed Output 05 IRUH330133 5.0 V Input, 3.3 V Fixed Output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.

9、All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. Thi

10、s level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening an

11、d In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) wi

12、th exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality

13、 class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITI

14、ME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Flat pack with gull wing leads, glass sealed Y See figur

15、e 1 8 Flat pack with straight leads, glass sealed 4 See figure 1 5 MO-078 with straight leads, glass sealed 5 See figure 1 5 MO-078 with leads bent down, glass sealed 6 See figure 1 5 MO-078 with leads bent up, glass sealed 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1

16、.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 0 V dc to +8.0 V dc Output current (IOUT) 3 A Junction temperature (TJ) +150C Power Stage Thermal Resistance(RJ-C) 1C/W Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) +300C 1.4 Recommended operating conditions. Supply v

17、oltage range (VCC) Device types 01, 03, 04 +2.97 V dc to +3.8 V dc Device types 02, 05 +3.8 V dc to +5.8 V dcCase operating temperature range (TC). -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 - 300 rads(Si)/s) 300 krads (Si) Maximum total dose available (dose r

18、ate 10 mrads(Si)/s) LDR: 100 krads(Si) 2/ Neutron Irradiation (1 MeV equivalent neutrons) . 1.0 X 1011(n/cm2) 3/ Single event phenomenon (SEP) effective linear energy threshold (LET): SEL, SEFI . 84 MeV-cm2/mg 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The fol

19、lowing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Spec

20、ification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels

21、 may degrade performance and affect reliability. 2/ The devices have been tested for Enhanced Low Dose Rate Sensitivity (ELDRS) in accordance with method 1019 paragraph 3.13.1.1 of MIL-STD-883 initial qualification. No ELDRS was observed. The devices will be re-tested after design or process changes

22、 that can affect RHA response of these devices. 3/ The measured neutrons to gamma ratio for the Fast Neutron, Irradiator facility at UMass, Lowell is 3.69 X 109n/cm2per rad(Si). 4/ Single event performance is tested with minor transients only; no dropouts, shutdowns, latch up or burn out. Provided b

23、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro

24、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the

25、event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The ind

26、ividual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the appli

27、cable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or func

28、tion of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.

29、2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upo

30、n request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements sha

31、ll be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar

32、PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type

33、listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) u

34、pon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers product meets the performance req

35、uirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in acc

36、ordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND

37、ARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min

38、Max Reference voltage (Measured at Adjust Pin) 2/ VREF2.97 V VIN 3.8 V 50 mA IOUT 3.0 A TC= 25C 1 01 0.788 0.812 V 2, 3 0.776 0.824 F 3/ 1 0.772 0.816 VREF3.8 V VIN 5.5 V 50 mA IOUT 3.0 A TC= 25C 1 02 0.788 0.812 V 2, 3 0.776 0.824 F 3/ 1 0.772 0.816 Output Voltage VOUT2.97 V VIN 3.8 V 50 mA IOUT 3.

39、0 A TC= 25C 1 03 1.773 1.827 V 2, 3 1.746 1.854 F 3/ 1 1.737 1.836 2.97 V VIN 3.8 V 50 mA IOUT 3.0 A TC= 25C 1 04 2.463 2.538 2,3 2.425 2.575 F 3/ 1 2.412 2.550 3.8 V VIN 5.8 V 50 mA IOUT 3.0 A TC= 25C 1 05 3.250 3.349 2, 3 3.201 3.399 F 3/ 1 3.184 3.366 Dropout voltage VDROPIO= 3.0 A, VINlowered un

40、til VOUTdecreases by 1% 4/ 1,2,3 01, 02 0 0.4 V F 3/ 1 IO= 3.0 A, VINlowered until VOUTdecreases by 1% 123 04,05 0 0.4 F 3/ 1 Current limit ILATCHVIN 3.3 V 1,2,3 01,03,04 3.5 A F 3/ 1 VIN 5.0 V 1,2,3 02, 05 F 3/ 1 Maximum Shutdown Temperature 4/ TLATCH 2 All 125 C Ripple Rejection 4/ PSRR f = 120 Hz

41、, IO= 50 mA 1, 2, 3 All 65 dB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 9

42、7 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Shutdown Threshold “Off” VSHDN VIN= 3.3 V, Ramp from VSHDN1.2 V, monitor for a 1% drop below nominal VOUT1,2,3 01,03,04

43、 0.8 1.2 V F 3/ 1 VIN= 5.0 V, Ramp from VSHDN1.2 V, monitor for a 1% drop below nominal VOUT1,2,3 02,05 F 3/ 1 Shutdown Threshold “On” VIN= 3.3 V, Ramp from VSHDN1.2 V to VSHDN500mV 1,2,3 01,03,04 F 3/ 1 VIN= 5.0 V, Ramp from VSHDN1.2 V to VSHDN500mV 1,2,3 02,05 F 3/ 1 Output Voltage at Shutdown VOU

44、TRLOAD 36 Ohms, VSHDN 1.2 V, VIN3.3 V 1,2,3 01,03,04 -0.1 0.1 V F 3/ 1 RLOAD 36 Ohms, VSHDN 1.2 V, VIN5.0 V 1,2,3 02,05 F 3/ 1 SHDN Pin Leakage Current 4/ ISHDNVSHDN= 3.3 V 1, 2, 3 All -10 10 A SHDN Pin Pull-Up Current 4/ ISHDNVSHDN= 0.4 V 1 All -98 -56 A 2, 3 -140 -30 Quiescent Current 4/ IQNo load

45、 1, 2, 3 All 15 mA IO= 3.0 A 1, 2, 3 All 90 1/ When measured at the junction of the VOUTand Adjust pins for Adjustable (Device Type 01 and 02) or VOUT and Sense pins for Fixed (Device Type 03, 04 and 05). 2/ This parameter tested at a fixed output voltage of Vout=2.5 V using external 1060 Ohm resist

46、or, and test limits of Device type 04. 3/ The device that is supplied to this drawing has been characterized and tested through RHA level F at the initial qualification per the manufacturers approved RHA program. The RHA testing on the hybrid is only repeated when a change is made as defined by MIL-

47、PRF-38534, Appendix A. The configuration control guidelines of MIL-PRF-38534, Appendix E shall apply. Each active element used in a hybrid manufacturing lot shall be limited to a single wafer and each wafer shall be qualified for RHA at element evaluation to the manufacturers approved RHA program an

48、d MIL-PRF-38534, Appendix G. 4/ Under normal closed-loop operation. Guaranteed by design, but not tested in production or post radiation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10235 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE IB. SEP test limits. 1/ Device types SEP Temperature (TC) Effective li

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