DLA SMD-5962-10244 REV B-2011 MICROCIRCUIT DIGITAL 16 BIT REGISTERED TRANSCEIVER (TREG) MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHET REV SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MI

2、CROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Phu H. Nguyen APPROVED BY David J. Corbett MICROCIRCUIT, DIGITAL, 16 BIT REGISTERED TRANSCEIVER (TREG), MONOLITHIC SILICON DRAWING APPROVAL DATE 11-03-14 AMSC N/A REVISION LEV

3、EL SIZE A CAGE CODE 67268 5962-10244 SHEET 1 OF 30 DSCC FORM 2233 APR 97 5962-E283-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET

4、 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifyin

5、g Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 10244 01 V X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase out

6、line (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

7、specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 22028036 Digital, 16-Bit Registered Transceiver 1.2.3 Devi

8、ce class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL

9、-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 56 Ceramic Quad Flat Pack 1.2.5 Lead finish. The le

10、ad finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIME COLUMBUS, OHI

11、O 43218-3990 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ DC supply voltage (VDD) . -0.5 V to +6.0 V DC supply voltage (VDD2) . -0.5 V to +6.5 V 2/ Input signal voltage (VIN) -0.5 V to VDD(or VDD2) +0.5 V 3/ Output signal voltage (VO) -0.5 V to VDD(or VDD2) +0.5 V 3/

12、 DC input signal current (Output driver disabled (if appropriate) -50 mA to +50 mA DC or average output signal current (Output driver enabled) -50 mA to +50 mA Thermal Junction temperature, JC, 3.2oC/W Storage temperature range (Ts) . -65oC to +150oC Maximum junction temperature (TJ) +175oC 1.4 Reco

13、mmended operating conditions. DC supply voltage (VDD = VDD2= 3.3 V) . +3.0 V to +3.6 V DC supply voltage (VDD2 = 5 V) +4.5 V to +5.5 V 2/ Input signal voltage (VIN) -0.3 V to VDD(or VDD2) +0.3 V 3/ Output signal voltage (VO) -0.3 V to VDD(or VDD2) +0.3 V 3/ DC input signal current (Output driver dis

14、abled (if appropriate) -1 mA to +1 mA DC or average output signal current (Output driver enabled): High level output current IOH(Bus A) VDD= 3.0 V . -8.0 mA High level output current IOH(Bus B) VDD2= 4.5 V -22.1 mA High level output current IOH(Bus B) VDD2= 3.0 V -18.6 mA Low level output current IO

15、L(Bus A) VDD= 3.0 V . 8.0 mA Low level output current IOL(Bus B) VDD2= 4.5 V 22.3 mA Low level output current IOL(Bus B) VDD2= 3.0 V 18.8 mA Case operating temperature (TC) . -55oC to +125oC 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads(Si)/s) 1Mrads(Si) Transient dos

16、e rate upset . 1E9 rads(Si)/s Single Event Upset (SEU) . 1E-10 upset/ff- day Dose rate burnout . 1E12 rads(Si)/s Neutron fluence 1E13 N/cm2_ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and af

17、fect reliability. 2/ For VDD2= 5.0 V operation. 3/ In Cold Spare mode, device VDD= VDD2= 0 V, and I/O signal voltage can be as shown. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIM

18、E COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i

19、ssues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Stan

20、dard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Docume

21、nt Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the s

22、olicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org/ or from ASTM International, P. O. Box C700

23、, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations u

24、nless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification

25、 in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The

26、 design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connec

27、tions. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Block diagram. The block diagram(s) shall be as specified on figure 4. 3.2.5 Timing diagram. The timing diagram(s) shall be as specified on figure 5 Pr

28、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 3.2.6 Radiation exposure circuit. The radiation exposure circui

29、t shall be as specified on figure 6. 3.2.7 Burn-in circuit. The burn-in circuit shall be as specified on figure 7. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parame

30、ter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The p

31、art shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product us

32、ing this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q

33、and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in

34、 order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land

35、 and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certific

36、ate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, n

37、otification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and

38、 the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

39、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TC+125C unless otherwise specified Group A subgroups Limits Unit Min M

40、ax Input Leakage Current Low Inputs without pulldowns or pullups 4/ IIL1_33VDD= 3.60 V, VIN= 0.0V VDD2= 3.60V or 5.50V 1,2,3 -5 5 A Input Leakage Current High Inputs without pulldowns or pullups 4/ IIH1_33VDD= 3.60V, VIN= VDDVDD2= 3.60V or 5.50V 1,2,3 -5 5 A Cold Spare Input Leakage Current 4/ 5/ CI

41、ZL_33VDD= 0.0V, VDD2= 0.0V VIN= 3.60V 1,2,3 -5 5 A Cold Spare Input Leakage Current 6/ CIZL_50VDD= 0.0 V, VDD2= 0.0 V VIN= 5.50V 1,2,3 -5 5 A Cold Spare Input Leakage Current 6/ CIZL_V33VDD= 0.0 V, VDD2= 0.0V VIN= 3.60V 1,2,3 -5 5 A Tri-State Low Level Output Leakage Current Bidirectional I/O withou

42、t pulldowns or pull-ups 5/ 7/ IOZL1_33VDD= 3.60V, VDD2= 3.60V VIH= VDDor VDD2VIL= 0.0V, VOL= 0.0V 1,2,3 -5 5 A Tri-State High Level Output Leakage Current Bidirectional I/O without pulldowns or pull-ups 5/ 7/ IOZH1_33VDD= 3.60V, VDD2= 3.60V VIH= VDDor VDD2VIL= 0.0V, VOH= VDD1,2,3 -5 5 A Tri-State Lo

43、w Level Output Leakage Current Bidirectional I/O without pulldowns or pull-ups 6/ 7/ IOZL1_50VDD= 3.60V, VDD2= 5.50V VIH= VDD2or VDDVIL= 0.0V, VOL= 0.0V 1,2,3 -5 5 A Tri-State High Level Output Leakage Current Bidirectional I/O without pulldowns or pull-ups 6/ 7/ IOZH1_50VDD= 3.60V, VDD2= 5.50V VIH=

44、 VDD2or VDDVIL= 0.0V, VOH= VDD21,2,3 -5 5 A Tri-State Low Level Output Leakage Current Bidirectional I/O without pulldowns or pull-ups 6/ 7/ IOZL1_V33VDD= 3.60V, VDD2= 3.60V VIH= VDD2or VDDVIL= 0.0V, VOL= 0.0V 1,2,3 -5 5 A Tri-State High Level Output Leakage Current Bidirectional I/O without pulldow

45、ns or pull-ups 6/ 7/ IOZH1_V33VDD= 3.60V, VDD2= 3.60V VIH= VDD2or VDDVIL= 0.0V, VOH= VDD21,2,3 -5 5 A Output Voltage Low 12 mA Output Drivers 5/ 7/ VOL4_33VDD= 3.00V, VDD2= 3.00V IOL= 8.0 mA 1,2,3 0.5 V Output Voltage High 12 mA Output Drivers 5/ 7/ VOH4_33VDD= 3.00V, VDD2= 3.00V IOH= -8.0 mA 1,2,3

46、2.47 V Output Voltage Low 30 mA Output Drivers 6/ 7/ VOL10_50VDD= 3.00V, VDD2= 4.5V IOL= 22.3 mA 1,2,3 0.5 V Output Voltage High 30 mA Output Drivers 6/ 7/ VOH10_50VDD= 3.00V, VDD2= 4.5V IOH= -22.1 mA 1,2,3 4.0 V See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networkin

47、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10244 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TC+125C unless othe

48、rwise specified Group A subgroups Limits Unit Min Max Output Voltage Low 30 mA Output Drivers 6/ 7/ VOL10_V33VDD= 3.00V, VDD2= 3.00V IOL= 18.8 mA 1,2,3 0.5 V Output Voltage High 30 mA Output Drivers 6/ 7/ VOH10_V33VDD= 3.00V, VDD2= 3.00V IOH= -18.6 mA 1,2,3 2.47 V Positive-Going Threshold Voltage Schmitt Inputs 4/ 5/ VT+VDD= 3.60V, VDD2= 3.60V 1,2,3 2.52 V Negative-Going Threshold Voltage Schmitt Inputs 4/ 5/ VT-VDD= 3.00V, VDD2= 3.00V 1,2,3 0.9 V Hysteresis Schmitt Inputs 4/ 5/ VHYSVDD= 3.00V, VDD2= 3.00V 1,2,3 0.25 V Input Threshold V