DLA SMD-5962-76012 REV H-2010 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL LATCH MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Add vendor, FSCM 04713. Delete min. limits from all propagation delays. Editorial changes throughout. 85-12-10 N. A. Hauck E Added approved source of supply. Updated boilerplate. 95-03-27 M. L. Poelking F Update to reflect latest changes in forma

2、t and requirements. Editorial changes throughout. -les 03-01-23 Raymond Monnin G Add class “V“ to document. Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-01-20 Raymond Monnin H Update drawing to current requirements. Editorial changes throughout.

3、- gap 10-05-06 Charles F. Saffle CURRENT CAGE CODE 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY W. A. Denick DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 ht

4、tp:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY R. F. Gonzales APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, LATCH, MONOLITHIC SILICON DRAWING APPROVAL DATE 76-03-23

5、AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 76012 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E153-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

6、0 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected i

7、n the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 76012 01 E X Drawing number Device type (see 1.2.2) Case outline (see 1.2.4)Lead

8、finish (see 1.2.5)For device class V: 5962 - 76012 01 V E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked d

9、evices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device typ

10、e(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS75 4-bit bistable latch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class

11、designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, no

12、n-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER CO

13、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line package F GDFP2-F16 or C

14、DFP3-F16 16 flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Sto

15、rage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 66 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum t

16、o 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbook

17、s form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DE

18、FENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are

19、 available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

20、of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrad

21、e performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-39

22、90 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modifica

23、tion in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions.

24、 The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The

25、 terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradi

26、ation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marki

27、ng. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA p

28、roduct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device c

29、lasses Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufa

30、cturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to

31、 DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of c

32、onformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notificat

33、ion to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manu

34、facturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 10 (see MIL-PRF-

35、38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance cha

36、racteristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max High-level output voltage VOH VCC = 4.5 V, IOH = -400 A VIN= 0.5 V, VIH =1.9 V 1, 2, 3 2.5 V Low-level output voltage VOL VCC= 4.5 V, IOL= 4 mA 1, 2, 3 0.4 V Input clamp voltage VIC VCC

37、= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V High level input current IIH1 VCC= 5.5 V, D input 1, 2, 3 20 A IH= 2.7 V G Input 1, 2, 3 80 AIIH2 VCC= 5.5 V, D input 1, 2, 3 100 A IH= 5.5 V G input 1, 2, 3 400 ALow level input current IIL VCC= 5.5 V, D input 1, 2, 3 -400 A IL= 0.4 V G input 1, 2, 3 -1600 A

38、Short circuit output current IOS VCC= 5.5 V 1/ 1, 2, 3 -6 -130 mA Supply current ICCLVCC= 5.5 V 1, 2, 3 12 mA Functional tests See 4.4.1b 7, 8 Propagation delay time, high to low level, D to Q tPHL1VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 17 ns 10, 11 242/ CL= 50 pF 10% 9 22 ns 11 31Propagation delay t

39、ime, low to high level, D to Q tPLH1CL= 15 pF 10% 9 27 ns 10, 11 38CL= 50 pF 10% 9 32 ns 11 45Propagation delay time, high to low level, D to Q%tPHL2CL= 15 pF 10% 9 15 ns 10, 11 21CL= 50 pF 10% 9 20 ns 11 28Propagation delay time, low to high level, D to Q%tPLH2CL= 15 pF 10% 9 20 ns 10, 11 28CL= 50

40、pF 10% 9 25 ns 10, 11 35See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97

41、TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Limits Unit Min Max Propagation delay time, high to low level, G to Q tPHL3VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 25 ns 10, 11 352/ CL= 50 pF 10% 9 30 ns 10, 1

42、1 42Propagation delay time, low to high level, G to Q tPLH3CL= 15 pF 10% 9 27 ns 10, 11 38CL= 50 pF 10% 9 32 ns 10, 11 45Propagation delay time, high to low level, G to Q%tPHL4CL= 15 pF 10% 9 15 ns 10, 11 21CL= 50 pF 10% 9 20 ns 10, 11 28Propagation delay time, low to high level, G to Q%tPLH4CL= 15

43、pF 10% 9 30 ns 10, 11 42CL= 50 pF 10% 9 35 ns 10, 11 491/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufactu

44、rer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

45、43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 (Logic: See Truth Table) FIGURE 1. Terminal connections and logic diagram. (Each latch) INPUTS OUTPUTS D G Q Q%L H L H H H H L X L Q0 Q%0H = High level. L = Low level. X = Irrelevant. Q0= The level of Q before the high to low transition of G.

46、 FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling an

47、d inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device

48、class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Bu