DLA SMD-5962-76014 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL ADDER MONOLITHIC SILICON《硅单片先行加法器肖脱基小功率TTL双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Delete vendor CAGES 18324, 07263, and 27014. Revise to Military Drawing format. Add logic diagram. Change tPHL1, tPHL2, and tPLH2. Change Code Ident. No. to 67268. 87-10-23 Michael A. Frye F Update to reflect latest changes in format and requirem

2、ents. Editorial changes throughout. - les 03-02-20 Raymond Monnin G Change 3.5 marking paragraph to remove “5962-“. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-18 Thomas M. Hess Current CAGE Code is 67268. THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET

3、 REV STATUS REV G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Di Cenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS

4、APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, ADDER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-03-23 MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 76014 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E469-05 Provided by I

5、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for M

6、IL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76014 01 F X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1

7、 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS83A 4-bit binary full adder with fast carry 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designa

8、tor Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA

9、to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 54 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4

10、.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction

11、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif

12、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe

13、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings

14、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the tex

15、t of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be

16、in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to M

17、IL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifica

18、tions shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimension

19、s. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tab

20、le. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over

21、 the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without l

22、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herei

23、n. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in

24、accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted

25、 to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be pro

26、vided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufac

27、turers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CEN

28、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A

29、 VIL= 0.7 V, VIH =2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4 mA VIL= 0.7 V, VIH =2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1VCC= 5.5 V, 1, 2, 3 All 40 A at any A or B VIN= 2.7 V High level inp

30、ut current IIH21, 2, 3 All 20 A at C0 High level input current IIH3VCC= 5.5 V, 1, 2, 3 All 200 A at any A or B VIN= 5.5 V High level input current IIH41, 2, 3 All 100 A at C0 Low level input current IIL1VCC= 5.5 V, 1, 2, 3 All -800 A at any A or B VIN= 0.4 V Low level input current IIL21, 2, 3 All -

31、400 A at C0 Short circuit output current IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 39 mA Functional tests See 4.3.1c 7 All tPHL19 All 24 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 3/ 10, 11 All 34 ns 35 Propagation delay time, C0 to any 2/ CL= 50 pF 1

32、0% 10, 11 All 41 ns tPLH19 24 CL= 15 pF 10% 3/ 10, 11 All 34 ns 30 CL= 50 pF 10% 10, 11 All 41 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS

33、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL29 All 24 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10

34、% 3/ 10, 11 All 34 ns 35 Propagation delay time, A Ior B Ito i2/ CL= 50 pF 10% 10, 11 All 41 ns tPLH29 24 CL= 15 pF 10% 3/ 10, 11 All 34 ns 30 CL= 50 pF 10% 10, 11 All 41 ns tPHL39 22 VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 3/ 10, 11 All 31 ns 27 Propagation delay time, C0 to C4 2/ CL= 50 pF 10% 10, 11

35、 All 38 ns tPLH39 17 VCC= 5.0 V, RL= 5 k 5% CL= 15 pF 10% 3/ 10, 11 All 24 ns 27 2/ CL= 50 pF 10% 10, 11 All 38 ns tPHL49 17 VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 3/ 10, 11 All 24 ns 22 Propagation delay time, A Ior B Ito C4 2/ CL= 50 pF 10% 10, 11 All 31 ns tPLH49 17 VCC= 5.0 V, RL= 5 k 5% CL= 15 pF

36、 10% 3/ 10, 11 All 24 ns 22 2/ CL= 50 pF 10% 10, 11 All 31 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the ma

37、nufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. 3/ These parameters are guaranteed if not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI

38、ZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device types 01 Case outlines E, F Terminal number Terminal symbols 1 A4 2 3 3 A3 4 B3 5 VCC6 2 7 B2 8 A2 9 1 10 A1 11 B1 12 GND 13 C0 14 C4 15 4 16 B4 FIGURE 1. Terminal connections. O

39、UTPUTS WHEN C0 = L WHEN C0 = H INPUTS WHEN C2 = L WHEN C2 = H A1 B1 A2 B2 1 2 C2 1 2 C2 A3 B3 A4 B4 3 4 C4 3 4 C4 L L L L L L L H L L H L L L H L L L H L L H L L H L L L H L H H L L L H L H H L L L H L L H L H H L H L H L H H L L L H L H H L H H L L L H H H H L L L H H L H L L L H L H L H H L H L L

40、H H H L L L H L H L H H H L L L H H H L H L L H H L H L L H H L L H H L H H L H H H L H L H H L H H H H L H L H H H H H H L H H H H H H = High level. L = Low level. NOTE: Input conditions at A1, B1, A2, B2, and C0 are used to determine outputs 1 and 2 and the value of the internal carry C2. The valu

41、es at C2, A3, B3, A4, and B4 are then used to determine outputs 3, 4 and C4. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE

42、VISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FO

43、RM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance in

44、spection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity up

45、on request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, excep

46、t interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional cr

47、iteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c, Subgroup 7 shall include verification of the truth table. TABLE II. Electrical test requirements. MIL-STD-883 test

48、requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens