DLA SMD-5962-76040 REV F-2005 MICROCIRCUIT DIGITAL SCHOTTKY TTL SHIFT REGISTERS MONOLITHIC SILICON《硅单片移位寄存器肖脱基小功率TTL数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Device 01 inactive for new design. Change fMAXat temp. extremes. Delete min. limits from all propagation delays. 85-09-25 N. A. Hauck C Change IIHtest conditions. Remove vendor FSCM 18324. Editorial changes throughout. 86-03-25 N. A. Hauck D Add

2、approved source of supply. Updated boilerplate. 95-03-24 M. L. Poelking E Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-09-08 Raymond Monnin F Update to reflect latest changes in format and requirements. Correct paragraph in 3.5. Editorial changes

3、 throughout. les 05-08-16 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY T. E. Gordon DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING

4、CHECKED BY R. F. Gonzales COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, SCHOTTKY TTL, SHIFT REGISTERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 AM

5、SC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 76040 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E461-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R

6、EVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the followin

7、g example: 76040 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54S194 4-bit directional shift register 1.2.2 Case outlines. The ca

8、se outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum

9、ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage -1.2 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 743 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction te

10、mperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimim to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipa

11、tion is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI

12、SION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are t

13、hose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case

14、 Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document

15、 Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws a

16、nd regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Q

17、ualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with M

18、IL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification m

19、ark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines sh

20、all be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performa

21、nce characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Markin

22、g. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

23、 DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indica

24、tor “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MI

25、L-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate

26、of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent

27、, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

28、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limi

29、ts Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA VIN= 0.8 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 20 mA VIN= 0.8 V or 2.0 V 1, 2, 3 All 0.5 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA TC= +25C 1 All -1.2 V High level input current IIH1VCC=

30、 5.5 V, VIN= 2.7 V 1, 2, 3 All 50 A IIH2VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 1.0 mA Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 All -2.0 mA Short circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 All -40 -100 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 135 mA Functional tests See 4.3.1c 7

31、All Maximum clock frequency FMAX9 All 70 MHz VCC= 5.0 V, RL= 280 5% CL= 15 pF 10% 10, 11 All 42 MHz 2/ 9 All 65 MHz CL= 50 pF 10% 10, 11 All 41 MHz Propagation delay time tPHL19 16.5 ns high to low level CL= 15 pF 10% 10, 11 All 23 ns clock to output 2/ 9 All 21.5 ns CL= 50 pF 10% 10, 11 All 30 ns P

32、ropagation delay time tPLH19 12 low to high level CL= 15 pF 10% 10, 11 All 17 ns clock to output 2/ 9 All 17 ns CL= 50 pF 10% 10, 11 All 24 ns Propagation delay time 9 All 18.5 ns high to low level tPHL2CL= 15 pF 10% 10, 11 All 26 ns clear to output 2/ 9 All 23.5 ns CL= 50 pF 10% 10, 11 All 33 ns 1/

33、 Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits mee

34、t the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97

35、 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 CLEAR 2 SHIFT RIGHT 3 A 4 B 5 C 6 D 7 SHIFT LEFT 8 GND 9 S0 10 S1 11 CLOCK 12 QD13 QC14 QB15 QA16 VCCFIGURE 1. Terminal connections. INPUTS OUTPUTS MODE SERIAL PARALLEL CLEAR S1 S0 CLOCK LEFT RIGHT A B C D QAQBQCQDL X X X X X X

36、X X X L L L L H X X L X X X X X X QA0QB0QC0QD0 H H H X X a b c d a b c d H L H X H X X X X H QAnQBnQCnH L H X L X X X X L QAnQBnQCnH H L H X X X X X QBnQCnQDnH H H L L X X X X X QBnQCnQDnL H L L X X X X X X X QA0QB0QC0 QD0H = High level. L = Low level. = from low to high level. X = Irrelevant (any i

37、nput, including transition). a, b, c, d = The level of steady state input at inputs A, B, C, or D, respectively. QAO, QBO, QCO, QDO= The level of QA, QB, QC, or QD, respectively, before the indicated steady state input conditions were established. QAn, QBn, QCn, QDn= The level of QA, QB, QC, or QD,

38、respectively, before the most recent transition of the clock. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F

39、SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality

40、 conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquir

41、ing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table I

42、I herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004)

43、- - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3, 10*, 11* * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specifie

44、d limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table

45、 II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76040 D

46、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A

47、, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordanc

48、e with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will