DLA SMD-5962-76041 REV H-2005 MICROCIRCUIT DIGITAL SCHOTTKY TTL DECODERS MONOLITHIC SILICON《硅单片译码器肖脱基小功率TTL数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Change IOSlimit from 100 mA to 110 mA Change VILlimit from 0.8 V dc to 0.7 V dc. Change to Military Drawing. Add 02 package. Remove vendors 07263 and 27014. Remove inactive label from page 1 and add information to last page on QPL parts. 87-04-02

2、 N. A. Hauck F Change input voltage range from 1.5 V dc to 1.2 V dc. Remove footnote 1/ and its reference from table I. Change (VIL) limits for +25C and -55C to 0.8 V dc for VOHand VOL. Change code ident. no. to 67268. 87-09-17 N. A. Hauck G Update to reflect latest changes in format and requirement

3、s. Editorial changes throughout. - les 03-07-14 Raymond Monnin H Change 3.5 marking paragraph to remove “5962-”. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-16 Thomas M. Hess CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV ST

4、ATUS REV H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joe Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N.

5、A. Hauck MICROCIRCUIT, DIGITAL, SCHOTTKY TTL, DECODERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 76041 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E475-05 Provided by IHSNot for ResaleNo reproduction or

6、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class

7、 level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76041 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s)

8、 identify the circuit function as follows: Device type Generic number Circuit function 01 54S138 3 to 8 line decoder/demultiplexer 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDI

9、P2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage range . -1.2 V dc at -18 mA to +5.

10、5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 407 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V

11、dc minimim to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc TC= +25C 0.8 V dc TC= -55C . 0.8 V dc TC= +125C 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test; e.g.,

12、 IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specificat

13、ion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-3853

14、5 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Draw

15、ings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of prec

16、edence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requir

17、ements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer wh

18、o has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifi

19、cations to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used

20、. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections

21、shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics

22、 are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for Resale

23、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part

24、 shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be re

25、placed with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6

26、 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as r

27、equired in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring

28、 activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC

29、ROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Hig

30、h level output voltage VOHVIL= 0.8 V 1, 2 All 2.5 V VCC= 4.5 V, IOH= -1.0 mA VIH= 2.0 V VIL= 0.7 V 3 Low level output voltage VOLVIL= 0.8 V 1, 2 All 0.5 V VCC= 4.5 V, IOL= 20 mA VIH= 2.0 V VIL= 0.7 V 3 Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1 All -1.2 V High level input current at data or en

31、able P IIH1VCC= 5.5 V, VIL= 2.7 V 1, 2, 3 All 50 A IIH2VCC= 5.5 V, VIL= 5.5 V 1, 2, 3 All 1.0 mA Low level input current IILVCC= 5.5 V, VIL= 0.5 V 1, 2, 3 All -2.0 mA Short circuit output current IOSVCC= 5.5 V VOUT= 0.0 V 1/ 1, 2, 3 All -40 -110 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 74 mA Func

32、tional tests See 4.3.1c 7 All Propagation delay time tPHL19 All 10.5 ns high to low level, binary VCC= 5.0 V, RL= 280 5% CL= 15 pF 10% 10, 11 All 15 ns select to any 2 levels of 9 All 15.5 ns delay 2/ CL= 50 pF 10% 10, 11 All 22 ns Propagation delay time tPLH19 7 low to high level, binary CL= 15 pF

33、10% 10, 11 All 10 ns select to any 2 levels of 9 All 12 ns delay 2/ CL= 50 pF 10% 10, 11 All 17 ns Propagation delay time tPHL29 12 high to low level, binary CL= 15 pF 10% 10, 11 All 17 ns select to any 3 levels of 9 All 17 ns delay 2/ CL= 50 pF 10% 10, 11 All 24 ns 9 All 12 ns Propagation delay tim

34、e low to high level, binary tPLH2CL= 15 pF 10% 10, 11 All 17 ns select to any 3 levels of 9 All 17 ns delay 2/ CL= 50 pF 10% 10, 11 All 24 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING

35、 SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Propagat

36、ion delay time, tPHL39 All 11 ns high to low level, enable VCC= 5.0 V, RL= 280 5% CL= 15 pF 10% 10, 11 All 15 ns to any 2 levels of delay 9 All 16 ns 2/ CL= 50 pF 10% 10, 11 All 22 ns Propagation delay time, tPLH39 All 8 low to high level, enable CL= 15 pF 10% 10, 11 All 11 ns to any 2 levels of del

37、ay 9 All 13 ns 2/ CL= 50 pF 10% 10, 11 All 18 ns Propagation delay time, tPHL49 All 11 high to low level, enable CL= 15 pF 10% 10, 11 All 15 ns to any 3 levels of delay 9 All 16 ns 2/ CL= 50 pF 10% 10, 11 All 22 ns Propagation delay time, tPLH49 All 11 low to high level, enable CL= 15 pF 10% 10, 11

38、All 15 ns to any 3 levels of delay 9 All 16 ns 2/ CL= 50 pF 10% 10, 11 All 22 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50

39、pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTE

40、R COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 Device type 01 01 Case outlines E and F 2 Terminal number Terminal symbol Terminal symbol 1 A NC 2 B A 3 C B 4 G2A C 5 G2B G2A 6 G1 NC 7 Y7 G2B 8 GND G1 9 Y6 Y7 10 Y5 GND 11 Y4 NC 12 Y3 Y6 13 Y2 Y5 14 Y1 Y4 15 Y0 Y3

41、16 VCCNC 17 - - - Y2 18 - - - Y1 19 - - - Y0 20 - - - VCCFIGURE 1. Terminal connections. Inputs Enable Select Outputs G1 *G2 C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X H X X X H H H H H H H H L X X X X H H H H H H H H H L L L L L H H H H H H H H L L L H H L H H H H H H H L L H L H H L H H H H H H L L H H H H H

42、 L H H H H H L H L L H H H H L H H H H L H L H H H H H H L H H H L H H L H H H H H H L H H L H H H H H H H H H H L *G2 = G2A + G2B H = High level, L = Low level, X = Irrelevant. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

43、TANDARD MICROCIRCUIT DRAWING SIZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

44、IZE A 76041 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance w

45、ith method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under

46、document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, min

47、imum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance wit

48、h method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical te