1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor, FSCM 04713. Delete min. limits from IILand propagation delays. Change IILmax limits. Editorial changes throughout. 86-01-15 N. A. Hauck C Added approved source of supply. Updated boilerplate. 95-03-24 M. L. Poelking D Update to reflec
2、t latest changes in format and requirements. Editorial changes throughout. -les 03-08-20 Raymond Monnin E Update to reflect latest changes in format and requirements. Correct paragraph in 3.5. Editorial changes throughout. les 05-08-15 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN
3、REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY T. E. Gordon DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY R. F. Gonzales COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWIN
4、G IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, DECODER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-12-22 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 76045 SHEET 1 OF 9 DSCC FORM 2233 APR
5、 97 5962-E458-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing descr
6、ibes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76045 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.
7、2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS47 Single 4 to 7 line decoder with open collector outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
8、Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input v
9、oltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 71.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating co
10、nditions. Supply voltage range (VCC) 4.5 V dc minimim to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand t
11、he added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APP
12、LICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPAR
13、TMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HD
14、BK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phi
15、ladelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has be
16、en obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and
17、 qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the
18、Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required
19、to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Ter
20、minal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I a
21、nd shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking
22、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
23、listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ cer
24、tification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of c
25、ompliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appe
26、ndix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to
27、 review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045
28、 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC=
29、 4.5 V, IOH= -50 A, VIN= 0.7 V or 2.0 V 1, 2,3 All 2.4 V Low level output voltage VOLVCC= 4.5 V, IOL= 1.6 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA TC= +25C 1 All -1.5 V Maximum collector cutoff current ICEXVCC= 4.5 V, VOH= 15 V 1, 2, 3 All 250 High lev
30、el input current IIH1VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input current at any input except BI/RBO IIL1VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -0.4 mA Low level input current at BI/RBO IIL2VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -1.2 mA Short circuit o
31、utput current IOSVCC= 5.5 V 1/ 1, 2, 3 All -0.3 -2.0 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 13 mA Functional tests See 4.3.1c 7 All Propagation delay time, tPHL19 All 100 ns high to low level 2/ VCC= 5.0 V, RL=655 10% CL= 15 pF 10% 10, 11 All 140 ns from any input to output 9 All 105 ns CL= 50
32、pF 10% 10, 11 All 158 ns 9 All 100 ns Propagation delay time, low to high level 2/ tPLH1CL= 15 pF 10% 10, 11 All 140 ns from any input to output 9 All 105 ns CL= 50 pF 10% 10, 11 All 158 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition shoul
33、d not exceed one second. 2/ Propagation delay time testing and pulse width testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for Resal
34、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 B 2 C 3 LAMP
35、 TEST 4 RB OUTPUT 5 RB INPUT 6 D 7 A 8 GND 9 e 10 d 11 c 12 b 13 a 14 g 15 f 16 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI
36、O 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 INPUTS OUTPUTS DECIMAL OR FUNCTION LT RBI D C B A BI/RBO a b c d e f g NOTE 0 H H L L L L H L L L L L L H 1 1 H X L L L H H H L L H H H H 1 2 H X L L H L H L L H L L H L 1 3 H X L L H H H L L L L H H L 1 4 H X L H L L H H L L H H L L 1 5 H
37、X L H L H H L H L L H L L 1 6 H X L H H L H H H L L L L L 1 7 H X L H H H H L L L H H H H 1 8 H X H L L L H L L L L L L L 1 9 H X H L L H H L L L H H L L 1 10 H X H L H L H H H H L L H L 1 11 H X H L H H H H H L L H H L 1 12 H X H H L L H H L H H H L L 1 13 H X H H L H H L H H L H L L 1 14 H X H H H
38、 L H H H H L L L L 1 15 H X H H H H H H H H H H H H 1 BI X X X X X X L H H H H H H H 2 RBI H L L L L L L H H H H H H H 3 LT L X X X X X H L L L L L L L 4 NOTES: 1. BI/RBO is wire-OR logic serving as blanking input (BI) and/or ripple-blanking output (RBO). The blanking input must be open or held at a
39、 high logic level when output functions 0 through 15 are desired and ripple-blanking input (RBI) must be held open or at high logic level during the decimal 0 input. X = Input may be high or low. 2. When a low logic level is applied to the blanking input (forced condition) all segment outputs go to
40、a high logic level regardless of the state of any other input condition. 3. When ripple-blanking input (RBI) is at a low logic level, lamp test input is at high logic level and A = B = C = D = low logic level, all segment outputs go to a high logic level and the ripple-blanking output goes to a low
41、logic level (response condition). 4. When blanking input/ripple-blanking output is open or held at a high logic level, and a low logic level is applied to lamp test input, all segment outputs go to a low logic level. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking p
42、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF
43、-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C,
44、or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with t
45、he intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical tes
46、t requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point e
47、lectrical parameters (method 5005) 1, 2, 3, 10*, 11* * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 in
48、cluding groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76045 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHE
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