1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Change RLto 2 K. Convert to military drawing format. Remove vendor, CAGE 27014. 86-10-16 N. A. Hauck E Add footnote to table I. Change max frequency. Add LCC package. Add vendor CAGE 04713. Editorial changes throughout. Change logic diagram. 87-1
2、0-21 R. P. Evans F Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-04-14 Raymond Monnin G Update to reflect latest changes in format and requirements. Correct paragraph in 3.5. Editorial changes throughout. les 05-05-31 Raymond Monnin THE ORIGINAL F
3、IRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY N. A. Hauck COLUMBUS, OHIO 4321
4、8-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, COUNTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 77-05-17 MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14
5、933 77010 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E360-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR
6、 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77010 01 C X Drawing number Dev
7、ice type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS196 30 MHz presetable decade or binary counter 1.2.2 Case outlines. The case outlines are as designated i
8、n MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line D GDFP1-F14 or CDFP2-F14 14 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maxi
9、mum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 149 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Jun
10、ction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum pow
11、er dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218
12、-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these docum
13、ents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Comp
14、onent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardizatio
15、n Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applica
16、ble laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produ
17、ced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accorda
18、nce with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certi
19、fication mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case o
20、utlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical per
21、formance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in t
22、able II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. Provided by IHSNot for ResaleNo rep
23、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non
24、-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be requ
25、ired from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, ap
26、pendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for
27、any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provide
28、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol C
29、onditions -55C TC +125C 1/ unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp volta
30、ge VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1, 2, 3 All -1.5 V High level input current IIH1 VCC= 5.5 V, Data, LOAD 1, 2, 3 All 20 A CLR , CLK 1 1, 2, 3 All 40 A IIH2 VIH= 2.7 V CLK 2 1, 2, 3 All 80 A IIH3 VCC= 5.5 V, Data, LOAD 1, 2, 3 All 100 A CLR , CLK 1 1, 2, 3 All 200 A IH4 VIH= 5.5 V CLK 2 1, 2,
31、 3 All 400 A Low level input current IIL1 VCC= 5.5 V, Data, LOAD 1, 2, 3 All -400 A IIL2 VIL= 0.4 V CLR 1, 2, 3 All -800 A IL3 CLK 1 1, 2, 3 All -2.4 mA IL4CLK 2 1, 2, 3 All -2.8 mA Short circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 27 mA Fu
32、nctional tests See 4.3.1c 7 All Maximum clock frequency fMAX VCC= 5.0 V, 9 All 25 MHz CLK 1 RL= 2 K 5%, 10, 11 All 17 MHz 9 All 20 ns Propagation delay time, CLK 1 to QAtPLH1 CL = 50 pF 10% 2/ 10, 11 All 28 ns 9 All 30 ns tPHL1 10, 11 All 35 ns 9 All 29 ns Propagation delay time, CLK 2 to QBtPLH2 10
33、, 11 All 41 ns 9 All 42 ns tPHL2 10, 11 All 53 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEE
34、T 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C 1/ unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max9 All 68 ns Propagation delay time, CLK 2 to QCtPLH3 VCC= 5.0 V CL= 50 pF 10% RL= 2 k 5% 10, 11 All 87 ns 9 Al
35、l 72 ns tPHL3 2/ 10, 11 All 94 ns 9 All 23 ns Propagation delay time, CLK 2 to QDtPLH4 10, 11 All 32 ns 9 All 54 ns tPHL4 10, 11 All 70 ns 9 All 35 ns Propagation delay time, A, B, C, D to QA, QB, QC, QDtPLH5 10, 11 All 49 ns 9 All 53 ns tPHL5 10, 11 All 69 ns 9 All 45 ns tPLH6 10, 11 All 64 ns 9 Al
36、l 54 ns Propagation delay time, LOAD to any output tPHL6 10, 11 All 70 ns 9 All 60 ns Propagation delay time, high-to-low level, CLR to any output tPHL7 10, 11 All 78 ns 1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one seco
37、nd. 2/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo repro
38、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines C, D 2 Terminal number Terminal symbols Terminal symbols 1
39、LOAD N/C 2 QCLOAD 3 C QC4 A C 5 QAN/C 6 CLK 2 A 7 GND N/C 8 GND QA9 CLK 1 CLK 2 10 QBGND 11 B N/C 12 D CLK 1 13 CLR QB14 VCCB 15 - - - N/C 16 - - -D 17 - - - N/C 18 - - - QD19 - - - CLR 20 - - - VCCFIGURE 1. Terminal connections. Count QDQCQBQA0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 5 L H
40、L H 6 L H H L 7 L H H H 8 H L L L 9 H L L H H = High voltage level L = Low voltage level NOTE: Output QAconnected to CLK2 input FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE
41、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Device type 01 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER C
42、OLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and
43、 shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and
44、 shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electric
45、al test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, ta
46、ble I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11,
47、 if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A
48、inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as spec
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