DLA SMD-5962-77057 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL OCTAL BUFFER DRIVER RECEIVER MONOLITHIC SILICON《硅单片驱动器 接收器的八位缓冲器 肖脱基小功率TTL双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Delete vendors CAGE 343255 and 07263. Move VIHand VILfrom table I to paragraph 1.4. Table I, tPHZ(CL= 5 pF, sub. 9 change from 18 ns to 25 ns. (10, 11) from 25 ns to 35 ns. Case “S“ inactive for new design. (Device 01 inactive for new design.) Re

2、vise to military drawing format. Change CAGE identification to 67268. 87-09-29 R. P. Evans F Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-07-19 Raymond Monnin G Update to reflect latest changes in format and requirements. Correct paragraph in 3.5

3、. Editorial changes throughout. les 05-08-01 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS STA

4、NDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY R. P. Evans MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, OCTAL BUFFER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING AP

5、PROVAL DATE 77-12-29 DRIVER/RECEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 77057 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E398-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057

6、 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying

7、 Number (PIN). The complete PIN is as shown in the following example: 77057 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS244

8、Octal buffer, driver/receiver 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line S GDFP2-F20 or CDFP3-F20 20 flat 1.2.3 Lead finish. The lead finish is as spec

9、ified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to 7.0 V dc Dc input voltage range -1.5 V dc at 18 mA to +5.5 V dc Maximum power dissipation (PD) per device 1/. +300 mW Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) . +300

10、C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC): Cases R and S . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (VCC) . 4.5 V dc minimim to 5.5 V dc maximum Minimum high-level voltage (VIH) 2.0 V dc Maximum low-level input voltage (VIL) 0.7 Vdc High

11、 level output current (IOH) -12 mA maximum Low level output current (IOL) 12 mA maximum Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo repr

12、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The followi

13、ng specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Ge

14、neral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit

15、 Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict betwee

16、n the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements

17、shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certifica

18、tion to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These

19、 modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical

20、dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections and logic diagrams. The terminal connections and logic diagrams sha

21、ll be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating tem

22、perature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The e

23、lectrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufact

24、urers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-3853

25、5 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing

26、 as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of micro

27、circuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicab

28、le required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

29、43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxHigh level output voltage VOH1VCC= 4.5 V, VIH= 2.0 V, IOH= -3.0 mA, VIL= 0.7 V 1

30、, 2, 3 All 2.4 V VOH2VCC= 4.5 V, VIH= 2.0 V, IOH= -12.0 mA, VIL= 0.5 V 2.0 Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, IOL= 12.0 mA, VIL= 0.7V 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1 All -1.5 V Off-state output current IOZHVCC= 5.5 V, VIH= 2.0 V, VOH= 2.7 V, VIL= 0

31、.7 V 1, 2, 3 All 20 A IOZLVCC= 5.5 V, VIH= 2.0 V, VOL= 0.4 V, VIL= 0.5 V -20 Input current at maximum input voltage II VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 All 0.1 mA High level input current IIHVCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A Low level input current IILVCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -200 A Sh

32、ort-circuit output current IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -40 -225 mA Supply current ICC VCC= 5.5 V Outputs high 27 Outputs low 1, 2, 3 All 46 mA All outputs disabled 54 Functional Tests See 4.3.1c 7 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networ

33、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C unless otherw

34、ise specified Group A subgroups Device type Limits Unit Min MaxtPHL VCC= 5.0 V RL= 667 5% 9 All 18 ns 2/ CL= 45 pF 10% 10, 11 25 Propagation delay times, A to Y RL= 110 5% 9 All 23 ns CL= 50 pF 10% 10, 11 35 tPLHRL= 667 5% 9 All 18 ns CL= 45 pF 10% 10, 11 25 RL= 110 5% 9 All 23 ns CL= 50 pF 10% 10,

35、11 32 Output enable time tPZH RL= 667 5% 9 All 23 ns CL= 45 pF 10% 10, 11 32 RL= 110 5% 9 All 28 ns CL= 50 pF 10% 10, 11 42 tPZL RL= 667 5% 9 All 30 ns CL= 45 pF 10% 10, 11 42 RL= 110 5% 9 All 35 ns CL= 50 pF 10% 10, 11 53 Output disable time tPHZRL= 667 5% 9 All 25 ns CL= 5 pF 10% 10, 11 35 RL= 110

36、 5% 9 All 35 ns CL= 50 pF 10% 10, 11 45 tPLZRL= 667 5% 9 All 25 ns CL= 5 pF 10% 10, 11 35 RL= 110 5% 9 All 30 ns CL= 50 pF 10% 10, 11 45 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one second. 2/ Propagation delay time te

37、sting may be performed using either CL= 5 pF, CL= 45 pF, or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

38、,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 FIGURE 1. Terminal connections and logic diagram. Inputs Output G A Y L L L L H H H X Z H = High voltage level L = Low voltage level X = Dont care Z

39、= High impedance FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION

40、 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additi

41、onal criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit s

42、hall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

43、 tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (metho

44、d 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance

45、inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in ta

46、ble I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77057 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

47、43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maint

48、ained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with M