DLA SMD-5962-79011 REV E-1994 MICROCIRCUIT DIGITAL CMOS DUAL D FLIP-FLOP MONOLITHIC SILICON《硅单片双重D型双稳态多谐振荡器触发器》.pdf

1、I Addition of MIL spec replacement nunkrs plus part nrnkr corrections, editorial changes Added 1 vendor, FSCM 27014 Removed 1 vendor; FSCM 27014 for device 02. Inactivate device 01, case C only fc -cy design. Rwved 1 vendor; FSCM 31019 for device 01, Ca. -d. t- 82-08- 11 N.A. Hawk 83- 09- 05 N.A. Ha

2、uck 85-01 -04 N.A. Hauck I o Convert to approved source formt 82-06-04 I N.A. Hauck Technical and editorial changes throughout. Changed to SWD formt. Added device typc 03. 94 - 02- 1 7 M. L. Poelking I #FBGE ELECiFUlICS SFFLY CENTW PREPARED BY - t)4yTcN, CHIO 45444 A.J. Foley RullC N/A STAEa4Rf“ I C

3、HECKEDBY C.R. J.ok8on - _ - _ -_JlLtiu MILITARY APPROVED BY N.A. tisuck DRcwINf THIS DRAYING IS AVAILABLE FOR USE BY ALL DEPARTMENTS MIAWING APROVAL DATE AND AGENCIES OF THE DEPARTMENT OF DEFENSE 7946-1 4 RMCION LEVEL E I AMCC NIA MICROCIRCUIT, DIGITAL, CMOS DUAL D FLIP-FLOP MONOLITHIC SILICON A I 7

4、9011 I I DESC FORM 193-1 5962-626-93 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is vilimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-79011 REV E 999999b 0058473 348 STANDARD1 ZED SIZE MILITARY DRAWING

5、 A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Fm/lSIOVLML 1. SCOPE 1.1 Scope. This drawing describes device rcquirmts for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the we of MIL-STD-883 in conjunction with compliant non-JAN devices“. 1.2 Part or Identif

6、ying Nunber (PIN. o1 The complete PIN shall be as shorn in the following exanple: X - C - 79011 - I I I I 79011 9-EE-r I I l I ii7z&G FzsG Lead finish per (see 1.2.1) (see 1.2.2) MIL-M-38510 1.2.1 Device twe(s1. The device type(s) shall identify the circuit function as follows: Device tm Gcmric nunb

7、er Circuit function o1 02 03 40138 Dual D type flip-flop 40138 Dual D type flip-flop 140138 Dual D type flip-flop 1.2.2 Case outline(s1. lhe case outline shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desiqnator Terminals Package style C CDIP2-Tl4 or GDIP1-T14 D CD

8、FPZ-F14 or GDFP-Fi4 14 Dual-in-line package 14 f Lat-package 1.2.3 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter “X“ shall not be marked on thmicrocircuit or its packaging. finishes A, 6, and Care considered acceptable and interchangeable without p

9、reference The llXal designation is for use in specifications when lead 1.3 Absolute maximm ratings. Supply voltage range (V,) - - - - - - - - - - - -0.5 V dc to +18 V dc Input voltage range - - - - - - - - - - - - - - Storage temperature range- - - - - - - - - - - - Maximm power dissipation per devi

10、ce (P,) I/ - - 500 Ru z/ Lead temperature (soldering 10 seconds)- - - - - +3OO0C Thermal resistance, junction to case (OJc) - - - -0.5 v dc to v, +0.5 v dc -65C to +150C See MIL-STD-1835 Junction temperature (TJ)- - - - - - - - - - - - +175“C 1.4 Recomnended operatinq conditions. Supply voltage - -

11、. - - - - - - - - - - - - +3.0 V dc to +15 V dc Case operating tenperature range - - - - - - - - -55C to +125“C L/ Must withstand the added Po due to short circuit test, e.&!., I,. z/ For 1,: = +lOO“C to +125“C, derate linearly at 12 W/OC to 200 Ry. Provided by IHSNot for ResaleNo reproduction or ne

12、tworking permitted without license from IHS-,-,-SMD-59b2-790LL REV E 999999b 0058472 284 I I STANDARD1 ZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 WiSICNLML E 2. APPLICABLE DOCUMENTS 2.1 Goverment specifications. standards and bulletin. Unless otherwise specified

13、, the following specifications standards, and bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this specification to the extent specified herein. 79011 SEET 3 SPECIFICATION MI LI TARY MIL-1-385

14、35 STANDARD - Integrated Circuits (Microcircuits) Manufacturing, General Specification for MI LI TARY MI L -STD-883 - Test Methods and Procedures for Microelectronics. MXL-STD-1835 - Microcircuit Case Outlines. BULLETIN MIL I TARY MIL-BUL-103 - List of Standardized Military Drawing (sliw)s). (Copies

15、 of specifications, standards, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of Drecedence. In the event of a conflict between the text of this drawing a

16、nd the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as speci

17、fied herein Product built to this drawing that is produced by a Pualified Manufacturer Listing (ML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-1-38535 may be processed as PML product in accordance with the manufacturers approved prog

18、ram plan and qualifying activity approval in accordance with MIL-1-38535. requirements herein. shall not affect the PIN as described herein. A iiQii or oMLoa certification mark in accordance with MIL-1-38535 is required to identify when the WL flou option is used. This QIIL flow as docunented in the

19、 Quality Management (W) plan may make modifications to the These modifications shall not affect form, fit, or function of the device. These modifications 3.2 Desiqn, construction. and dwsical dimensions. The design, construction, and physical dimensions shall be as specified nn MIL-STD-883(see 3.1 h

20、erein) and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s1. The truth table(s) shall be as specified on figure 2. 3.3 Lead material and finish. Th

21、e lead material and finish shall be in accordance with MIL-U-38510. 3.4 Electrical wrformance characteristics. Unless otherwise specified herein, the electrical performance 3.5 Electrical test requirements. lhe electrical test requirements shall be the subgroups specified in table II. characteristic

22、s are as specified in table I and apply over the full case operating tenperature range. The electrical tests for each subgroup are described in table I. 3.6 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in M

23、IL-BUL-103 (see 6.6 The part shall be marked with the PIN listed in 1.2 herein. herein). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-790LL REV E 7799996 0058473 110 Condi ti ons -55C S 1,- S 125C Test Device Group A Limits type subsrows

24、Min I Max Units High-level output vol tage V, = 5 V, V, = O V or V, v, = 10 v v, = 15 v Low-level output vol tage Al 1 I1,2,3 I I 0.05 IV I I I I 0.05 I I 0.05 I High-level input voltage V, = O V or 15.0 V See 4.4.ld Lou-level input vol tage I Al 1 1, 2, 3 tl .o fi Ali 7,8 Input capacitance Puiescen

25、t current Input leakage current Functional tests Propagat i on de 1 ay, clock to Q or a outputs i i Unless otheiwise specified VDD = 5 V, V, = 0.5 or 4.5 V I All I i, 2, 3 1 3.5 I IV V, = 10 V, V, = 1.0 or 9.0 VI I Wl I 11.0 V, = 15 V V, = 1.5 or 13.5 VI I I All V, = 5 V, V, = 10 V, V, = 1.0 or 9.0

26、V V, = 15 V, V, = 1.5 or 13.5 V V, = 0.5 or 4.5 V I I I 1.5 I V LI I I 4.0 . I l I I I I 123 v, = 0 v see 4.4.c 1 Ail ! 4 ! I 7.5 ! PF V, = 5.0 V V, = O V or V, v, = 10 v V, = O V or V, I I I I I I I I t V, = 15 V Vm = O V or V, VD, = 5.0 V C, = 50 pF R, = 200 M V, = 5.0 V C, = 50 pF I o1 I 10, 11 I

27、 1.0 I 437 I l+l R, = 200 M STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 79011 -4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SND-5962-790LL REV E 9999996 0058474 057 = STANDARD1 ZED SIZE MILITARY DRAWING A

28、DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 FINISICNLML E TABLE I. Electrical characteristics - Continued. 79011 SFEET 5 -55C 5 T, 5 125C VA = 5.0 V o1 , 02 C, = 50 pF R, = 200 k 103 I V, = 5.0 V C, = 50 pF R, = 200 kn I o1 I 10, 11 I o3 I 02 I V, = 5.0 V o1 9 C, = 50 pF R, = 200 k I O2 I O

29、3 I V, = 5.0 V C, = 50 pF R, = 200 kn I o1 I 10, 11 I o3 I I 02 I I I Voo 5.0 V 101 I9 C, = 50 pF R, = 200 k I I O2 , Vw = 5.0 V IO, 11 C, = 50 pF I I R, = 200 k I I O3 Limits Min I Max Units 1.0 I 300 I ns +i I 450 I I 20 1 400 I I 450 I 1.0 I 375 I 30 I 600 I I Ju 91 Provided by IHSNot for ResaleN

30、o reproduction or networking permitted without license from IHS-,-,-SMD-5762-770LL REV E 9999976 0058475 T93 3.5 test: STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Maximm clock frequency SI 2E 79011 A FINISIrnML SET E 6 Mininun clock pulse width fMU TABLE I. El

31、ectrical characteristics - Continued. Condi t i ons -55OC 5 1, 5 125C Unless otherwise swcified v, = 5.0 C, = 50 pF R, = 200 k V, = 5.0 V C, = 50 pF R, = 200 k Device type o1 02 03 o1 02 03 t, IVoo = 5.0 V o1 ,oz 03 Group A subgrows 9 10, 11 9 2.5 I I I 200 I ns 3.7 Certificate of compliance. A cert

32、ificate of conpliance shall be required from a manufacturer in order to be lhe certificate of conpliance submitted to listed as an approved source of supply in MIL-BUL-103 (see 6.6 herein). DESC-EC prior to listing as an approved source of supply shall affirm that the manufacturers product meets the

33、 requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-Sto-683 (see 3.1 herein) shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change. Notification of

34、change to DESC-EC shall be required in accordance with MIL-STD-883 (see 3.1 herein). 3.10 Verification and review. DESC, DESCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required docunentation. at the option of the reviewer. Offshore docun

35、entation shall be made available onshore 4. QUALITY ASSURANCE PROVISIONS 4.1 Samling and inmection. Sanpling and inspection procedures shall be in accordance with MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on

36、all devices prior to quality conformance inspection. lhe following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, 6, C, or D. lhe test circuit shall be maintained by the manufacturer under docwnt revision level control and shall be made available

37、to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outpits, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) 1, = 125C, minim. b. Interim and final electrical test parameters sha

38、ll be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. the percent defective allowable (PDA) shall be as specified in MIL-1-38535, appendix A. c. Provided by IHSNot for ResaleNo reproduction or networking

39、permitted without license from IHS-,-,-SMD-5762-79011 REV E 99b O058476 92T Clock Data Reset Set z L L L ievice tms :ase out 1 i nes ermine1 nuher 1 - O O LH 2 3 4 5 6 7 9 10 11 12 13 14 a -r- X 01. 02. end 03 C and O Terminal svmbol ai - a1 CLK1 RESET1 D1 SET1 SET2 D2 RESET2 - CLKZ a2 a2 “DO v, H L

40、 L HL X L L O0 X H L L H FIGURE 1. Termlnal connectlons. I inputs Outputs t I L H H IL X X I I X XI H HI HI H X = Dont care L Lou logic level H = High logic level O, O = No change - FIGURE 2, Truth table. STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 A I 79011 P

41、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-770LL REV E 9999996 0058477 8bb W MIL-STD-883 test requirements Interim electrical perenieters Final electrical test parmeters (pre burn-in) (method 5000, _, 3.1.8) (method 5004, 3.1.14) 4.3 Qua

42、lity conformance inspection. Quality conformance inspection shall be in accordance with Method 5005 of MIL-STD-883 including groups A, B, Cl and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. lests shall be as specified in table II herein. b. c. Subgroups

43、5, and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. Subgroup 4 (Cu measurement) shalt be measured only for the initial test and after process or design changes uhich may affect input capacitance. Test all applicable pins on five devices with zero failures. d. Subgroup 7 and 4.3.2 Gro

44、ups C and D inspections. a. b. :ia11 include verification of the truth table as specified on figure 2 herein. End-point electrical parameters shall be as specified in table II herein. Steady state life test conditions, method 1005 of MIL-STO-883. manufacturer under docunent revision level control. l

45、he test circuit shall be maintained by the (1) lest condition A, BI C, or D. (2) 1, = 125C, minim. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Subgroups Method 5005, table I _ I*, 2, 3, 9 STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON,

46、OHIO 45444 IGrwp A test requirements I 1, 2. 3, 4, 7, t SIZE 79011 A RNISICNLEWL SET E 8 (ithod 5005) . I 8. 9, 10*11* Groups C and D end-point I 1, 2, 3 electrical parameters (method 5005) i * PDA applies to subgroup 1 (sec 4.3). * Subgroups 10 and 11, if not tested, shall be guaranteed to the spec

47、ified limits in table I. I I I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-79DLL REV E 9Y9939b 0058478 7T2 m STANDARD1 ZED SI $E MILITARY DRAWIN A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 FINISICNLEML 5. PACKAGING 79011 SEET

48、5.1 Packaging r-irements. The requirements for packaging shall be in accordance with MIL-STO-883 (see 3.1 herein). 6. NOTES 1 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Goverment microcircuit applications (original equipment), design applications, and logisti

49、cs purposes. 6.2 Redaceability. Microcircuits covered by this drawing will replace the sm generic device covered by a contractor-prepared sp ication or drawing. 6.3 Configuration control of SKIS. All proposed changes to existing SUIS will be coordinated with the users of record for the individual docunents. OD Form 1692, Engineering Change Proposal . Th