DLA SMD-5962-80018 REV F-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计数器 肖脱基小功率TTL数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Editorial changes throughout document. Change device 02 to “A” version. 83-04-08 N. A. HAUCK B Para. 6.8; remove device 02. 83-04-26 N. A. HAUCK C Remove vendor 04713 for 01 package from drawing. Add vendor 01295 for 02 package. Covert to new dra

2、wing format. Change IOS, ICC, fMAX, IIL, RL, subgroups 10, 11, and propagation delays. 87-03-13 C. REUSING D Changes in accordance with NOR 5962-R143-93. - ltg 93-05-06 M. L. POELKING E Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 04-01-29 R. MONNI

3、N F Make corrections to the Marking paragraph 3.5 and Table I footnotes. - ro 05-07-20 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED B

4、Y H. L. BAKER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 81-01-19 M

5、ICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, COUNTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 80018 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E349-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR

6、AWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 P

7、art or Identifying Number (PIN). The complete PIN is as shown in the following example: 80018 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circ

8、uit function 01 54LS168 Synchronous 4-bit up/down decade counter 02 54LS169 Synchronous 4-bit up/down binary counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16

9、Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage -0.5 V dc to +7.0 V dc Input voltage range : Device type 01 -1.5 V dc at -18 mA

10、 to +5.5 V dc Device type 02 -1.2 V dc at -18 mA to +5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 187 mW 1/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): Cases E and F See MIL-STD-1835 Case 2 . +80C/W Junction tempe

11、rature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissip

12、ation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REV

13、ISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are

14、those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Cas

15、e Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Documen

16、t Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws

17、and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a

18、Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with

19、MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification

20、mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines s

21、hall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performa

22、nce characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table

23、II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FOR

24、M 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA, VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOL

25、 VCC= 4.5 V, IOL= 4 mA VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1, 2, 3 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 2.7 V, 1/ Data, CLK, LOAD , ENP , U/ D 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIN= 2.7 V, 1/ ENT 40 IIH3 VCC= 5.5 V,

26、VIN= 5.5 V, 1/ Data, CLK, LOAD , ENP , U/ D 100 IIH4 VCC= 5.5 V, VIN= 5.5 V, 1/ ENT 200 Low level input current IIL1 VCC= 5.5 V, VIN= 0.4 V, 2/ Data, CLK, LOAD , U/ D 1, 2, 3 All -400 A IIL2 VCC = 5.5 V, VIN = 0.4 V, ENP 2/ -385 IIL3 VCC = 5.5 V, VIN = 0.4 V, ENT 2/ -760 Short circuit output current

27、 IOSVCC= 5.5 V, VOUT= 0.0 V 3/ 1, 2, 3 All -15 -130 mA Supply current ICC VCC= 5.5 V 1, 2, 3 All 45 mA Functional tests See 4.3.1c 7 All Maximum frequency fMAX VCC= 5.0 V, RL= 2 k 5%, 4/ 9 All 20 MHz CL= 50 pF 10% 10, 11 12 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction

28、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C unle

29、ss otherwise specified Group A subgroupsDevice type Limits Unit Min Max9 All 26 ns Propagation delay time, high-to-low level, from CLK to any Q tPHL1 VCC= 5.0 V, RL= 667 5%, 4/ CL= 50 pF 10% 10, 11 37 9 All 26 ns Propagation delay time, low-to-high level, from CLK to any Q tPLH1 VCC= 5.0 V, RL= 667

30、5%, 4/ CL= 50 pF 10% 10, 11 37 9 All 73 ns Propagation delay time, high-to-low level, CLK to RCO tPHL2 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 102 9 All 38 ns Propagation delay time, low-to-high level, CLK to RCO tPLH2 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 53.2 9 All 28 ns Propagat

31、ion delay time, high-to-low level, ENT to RCO tPHL3 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 40 9 All 28 ns Propagation delay time, low-to-high level, ENT to RCO tPLH3 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 40 9 All 26 ns Propagation delay time, high-to-low, counts up and down to Q,

32、U/ D to RCO tPHL4 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 37 9 All 52 ns Propagation delay time, low-to-high, counts up and down to Q, U/ D to RCO tPLH4 VCC= 5.0 V, CL= 50 pF 10%, 4/ RL= 2 k 5% 10, 11 73 1/ All unspecified inputs grounded. 2/ All unspecified inputs at 5.5 volts. 3/ Not more

33、than one output should be shorted at a time and the duration of the short circuit condition should not exceed one second. 4/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee t

34、hat the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEE

35、T 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E, F 2 Terminal number Terminal symbols 1 U/ D N/C 2 CLK U/ D 3 A CLK 4 B A 5 C B 6 D N/C 7 ENP C 8 GND D 9 LOAD ENP 10 ENT GND 11 QDN/C 12 QCLOAD 13 QBENT 14 QAQD15 RCO QC16 VCC N/C 17 - - - QB18 - - - QA19 - - - RCO 20 - - - VCCN/C = No connec

36、tion FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Dev

37、ice type 02 UP COUNT SEQUENCE TABLE UP COUNT SEQUENCE TABLE QA(LSB) QBQCQD(MSB) QA(LSB) QBQCQD(MSB) L L L L L L L L H L L L H L L L L H L L L H L L H H L L H H L L L L H L L L H L H L H L H L H L L H H L L H H L H H H L H H H L L L L H L L L H H L L H H L L H L H L H H H L H L L H H H L H H L H H H

38、H H H H Device types 01 and 02 MODE SELECT TABLE LOAD ENP ENT U/ D Action on Rising Clock Edge L X X X Load ( Dn Qn) H L L H Count Up (increment) H L L L Count Down (decrement) H H X X No Change (Hold) H X H X No Change (Hold) H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Tru

39、th tables. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 Device type 01 FIGURE 3. Logic diagrams. Pro

40、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 Device type 02 FIGURE 3. Logic diagrams - Continued. Provi

41、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 10 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38

42、535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance

43、indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply

44、 in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certif

45、icate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs

46、 agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall

47、 be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883

48、. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parame