DLA SMD-5962-84012 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL TRANSPARENT LATCHES MONOLITHIC SILICON《硅单片透明锁存器 TTL肖脱基高级小功率双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor, FSCM 04713. Change supply current. Editorial changes throughout. 85-04-24 N. A. HAUCK B Add vendor, FSCM 27014. Editorial changes. 86-02-27 N. A. HAUCK C Change VIL, setup times, hold times input pulse width, and propagation delay tim

2、es. Delete minimum limits from IILand propagation delay times. Convert to military drawing format. Device type 01, case R inactive for new design. 87-05-29 N. A. HAUCK D Changes input voltage range. Changes to recommended operating conditions. Changes to table I. Change to vendor similar part number

3、. Change drawing code identification number to 67268. 87-09-01 N. A. HAUCK E Changes in accordance with NOR 5962-R112-96. - tvn 96-04-17 M. A. FRYE F Update to reflect latest changes in format and requirements. Editorial changes throughout. Reactivate device type 01, case R for new design. - les 02-

4、08-19 R. MONNIN G Make change to the Marking paragraph 3.5. - ro 05-07-19 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY GREG A. PITZ

5、 DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCENZO COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-05-04 MICROCIRCUIT,

6、DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, TRANSPARENT LATCHES, MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 84012 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E639-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

7、D MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535,

8、appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84012 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge

9、neric number Circuit function 01 54ALS573 Octal D-type transparent latch with three state outputs 02 54ALS580 Octal D-type transparent latch with inverted three state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desig

10、nator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V

11、 dc Input voltage range -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/: Device types 01 and 02 . 148.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases R and S See MIL-STD-1835 Case 2 . 80C/

12、W Junction temperature (TJ) 175C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEF

13、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V d

14、c Case operating temperature range (TC) . -55C to +125C Input setup time t(setup): Device type 01 . 10 ns minimum Device type 02 . 20 ns minimum Input hold time t(hold): Device type 01 . 7 ns minimum Device type 02 . 12 ns minimum Input pulse width (tp): Device type 01 . 25 ns minimum Device type 02

15、 . 15 ns minimum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicita

16、tion or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF D

17、EFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins A

18、venue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a sp

19、ecific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer List

20、ing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flo

21、w as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL

22、-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FOR

23、M 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal

24、connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

25、 characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking.

26、Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

27、 to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in orde

28、r to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements he

29、rein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this dra

30、wing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reprodu

31、ction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions -55C TC +125C unles

32、s otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA, VIN= 0.7 V or 2.0 V, 1, 2, 3 All 2.4 V Low level output voltage VOL VCC= 4.5 V, IOL= 12 mA, VIN= 0.7 or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 m

33、A, TC= +25C 1, 2, 3 All -1.5 V Low level input current IIL VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -200 A High level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIH= 7.0 V 110 Output current IOVCC= 5.5 V, VOH= 2.25 V 1/ 1, 2, 3 01 -15 -112 mA Output current, high level, ou

34、tputs OFF IOZHVCC= 5.5 V, VOH= 2.7 V 1, 2, 3 All 20 A Output current, low level, outputs OFF IOZL VCC= 5.5 V, VOH= 0.4 V 1, 2, 3 All -20 A Supply current, outputs high ICCH VCC= 5.5 V, VIN= 4.5 V 1, 2, 3 01 19 mA VCC= 5.5 V, VIN= 0 V 02 17 Supply current, outputs low ICCL VCC= 5.5 V, VIN= 0 V 1, 2,

35、3 01 26 mA VCC= 5.5 V, VIN= 4.5 V 02 26 Supply current, outputs disabled ICCZ VCC= 5.5 V, VOC= Open 1, 2, 3 01 27 mA 02 29 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFEN

36、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min MaxPropagation delay time, tPLH

37、1 VCC= 5.0 V, 9, 10, 11 01 33 ns enable to output CL= 50 pF 10%, 02 31 tPHL1 RL= 500 01 24 02 22 Propagation delay time, tPLH2 VCC= 5.0 V, 9, 10, 11 01 20 ns data to output CL= 50 pF 10%, 02 29 tPHL2 RL= 500 01 19 02 15 Output control ON to high tPZH 9, 10, 11 01 28 ns level output 02 25 Output cont

38、rol ON to low tPZL 9, 10, 11 All 21 ns level output High level output to output tPHZ 9, 10, 11 01 20 ns control OFF 02 12 Low level output to output tPLZ 9, 10, 11 01 26 ns control OFF 02 29 1/ The output conditions have been chosen to produce a current that closely approximates one half of the true

39、 short circuit output current, IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device types 01 02

40、Case outlines R, S 2 R, S 2 Terminal number Terminal symbols 1 OC OC OC OC 2 1D 1D 1D 1D 3 2D 2D 2D 2D 4 3D 3D 3D 3D 5 4D 4D 4D 4D 6 5D 5D 5D 5D 7 6D 6D 6D 6D 8 7D 7D 7D 7D 9 8D 8D 8D 8D 10 GND GND GND GND 11 ENABLE C ENABLE C ENABLE C ENABLE C 12 8Q 8Q 8 Q 8Q 13 7Q 7Q 7 Q 7Q 14 6Q 6Q 6 Q 6Q 15 5Q 5

41、Q 5 Q 5Q 16 4Q 4Q 4 Q 4Q 17 3Q 3Q 3 Q 3Q 18 2Q 2Q 2 Q 2Q 19 1Q 1Q 1 Q 1Q 20 VCCVCCVCCVCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

42、, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Output control Enable Data Output OC ENABLE C D Q H X X Z L L X Q0 L H L L L H H H H = High level L = Low level X = Irrelevant Q0= The level of Q before the indicated steady-state input conditions were established Z = Hi

43、gh impedance state Device type 02 Output control Enable Data Output OC ENABLE C D Q H X X Z L L X Q0 L H L H L H H L H = High level L = Low level X = Irrelevant Q0= The level of Q before the indicated steady-state input conditions were established Z = High impedance state FIGURE 2. Truth tables. Pro

44、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagrams. Provided by IHSNot for ResaleNo

45、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagrams - Continued. Provided by IHSNot for ResaleNo reproduction or

46、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance

47、 with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condit

48、ion A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at