DLA SMD-5962-84032 REV C-2005 MICROCIRCUITS DIGITAL ADVANCED LOW POWER SCHOTTKY TTL DUAL 4-BIT TRANSPARENT LATCH MONOLITHIC SILICON《硅单片4比特透明锁存器 TTL肖脱基高级小功率数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Converted to military drawing format. Change VIL, IIL, VOH, and propagation delays. Remove vendor CAGE 01295 for device 02. 86-10-14 C. Reusing B Change input voltage range. Changes made to table I. Change Logic diagram. Editorial changes through

2、out. Change code ident. No to 67268. Change vendor similar part no. to indicate A version. 87-09-11 N. A. Hauck C Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 05-01-13 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT

3、 CAGE CODE 67268 REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWI

4、NG IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Charles Reusing MICROCIRCUITS, DIGITAL, ADVANCED LOW POWER SCHOTTKY TTL, DUAL 4-BIT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-05-17 TRANSPARENT LATCH, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 8

5、4032 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E077-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1

6、. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84032 01 K X Drawing number Device t

7、ype (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS873 Dual 4-bit D-type transparent latch with three-state outputs 02 54ALS880 Dual 4-bit D-type transparent la

8、tch with inverted three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 flat L GDIP3-T24 or CDIP4-T24 24 dual-in-line 3 CQCC1-N28 28 leadless chip carr

9、ier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . +1.2 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/: Device types 01

10、 and 02 170.5 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH

11、) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) -55C to +125C Input set-up time, t(setup): Device types 01 and 02 10 ns minimum Input hold time, t(hold): Device type 01 7 ns minimum Device type 02 10 ns minimum _ 1/ Maximum power dissipation is defin

12、ed as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C

13、SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions - Continued. Input pulse width, t( p ): Device type 01 (enable) 10 ns minimum Device type 02 (enable) 15 ns minimum Device type 01 (clear) . 15 ns minimum Device type 02 (preset) . 15 ns minimum 2. APPLICABLE DOCUMENTS 2.1 Government

14、 specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION M

15、IL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microc

16、ircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 O

17、rder of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1

18、 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a man

19、ufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may

20、 make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow op

21、tion is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal

22、connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

23、D MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall

24、apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PR

25、F-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The complia

26、nce indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of su

27、pply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A ce

28、rtificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, D

29、SCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

30、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice

31、 type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.4 V Low level output voltage VOLVCC= 4.5 V, IOL= 12 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VI CVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V Low level input curren

32、t IILVCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -200 A High level input current IIH1VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIH= 7.0 V 1, 2, 3 All 110 A Output current IOVCC= 5.5 V, VO= 2.25 V 1/ 1, 2, 3 All -15 -112 mA Output current, high level, outputs OFF IOZHVCC= 5.5 V, VOH= 2.7 V 1, 2,

33、 3 All 20 A Output current, low level, outputs OFF IOZLVCC= 5.5 V, VOH= 0.4 V 1, 2, 3 All -20 A Supply current, ICCHVCC= 5.5 V, VIN= 5.0 V 1, 2, 3 01 21 mA outputs high VIN= 0 V 02 21 Supply current, ICCLVCC= 5.5 V VIN= 0 V 1, 2, 3 01 29 mA outputs low VIN= 5.0 V 02 29 Supply current, ICCZVCC= 5.5 V

34、, VIN= 0 V 1, 2, 3 01 31 mA outputs disabled VOC= 5.0 V VIN= 5.5 V 02 31 Propagation delay time to low level (clear or preset to output) tPHL1VCC= 5.0 V, CL= 50 pF 10%, RL= 500 9, 10, 11 All 27 ns Propagation delay time to high level (enable to output) tPLH29, 10, 11 All 31 ns Propagation delay time

35、 to low level (enable to output) tPHL29, 10, 11 All 26 ns See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

36、 C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Propagation delay time to high level (data to tPLH3VCC= 5.0 V, CL= 50 pF 10% 9, 10, 11 01 23

37、ns output) RL= 500 9, 10, 11 02 23 ns Propagation delay time to low level (enable to output) tPHL39, 10, 11 All 17 ns Output control, ON to high level output tPZH9, 10, 11 All 24 ns Output control, ON to low level output tPZL9, 10, 11 All 23 ns High level output to output, control OFF tPHZ9, 10, 11

38、All 12 ns Low level output to output, control OFF tPLZ9, 10, 11 All 30 ns 1/ The output conditions have been chosen to produce a current that closely approximates one-half of the true short circuit output current, IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

39、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 01 01 02 02 Case outlines L, K 3 L, K 3 Terminal number Terminal symbols Terminal symbols Terminal symbols Terminal symbols 1 1 CLR NC 1

40、PRE NC 2 1 OC 1CLR 1OC 1 PRE 3 1D1 1 OC 1D1 1 OC 4 1D2 1D1 1D2 1D1 5 1D3 1D2 1D3 1D2 6 1D4 1D3 1D4 1D3 7 2D1 1D4 2D1 1D4 8 2D2 NC 2D2 NC 9 2D3 2D1 2D3 2D1 10 2D4 2D2 2D4 2D2 11 2 OC 2D3 2 OC 2D3 12 GND 2D4 GND 2D4 13 2 CLR 2OC 2PRE 2 OC 14 2C (ENABLE) GND 2C (ENABLE) GND 15 2Q4 NC 2 Q 4 NC 16 2Q3 2

41、CLR 2Q 3 2 PRE 17 2Q2 2C (ENABLE) 2 Q 2 2C (ENABLE) 18 2Q1 2Q4 2 Q 1 2 Q 4 19 1Q4 2Q3 1 Q 4 2 Q 3 20 1Q3 2Q2 1 Q 3 2 Q 2 21 1Q2 2Q1 1 Q 2 2 Q 1 22 1Q1 NC 1 Q 1 NC 23 1C (ENABLE) 1Q4 1C (ENABLE) 1 Q 4 24 VCC 1Q3 VCC 1 Q 3 25 - - - 1Q2 - - - 1 Q 2 26 - - - 1Q1 - - - 1 Q 1 27 - - - 1C (ENABLE) - - - 1C

42、 (ENABLE) 28 - - - VCC - - - VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 22

43、34 APR 97 Device type 01 Output control Clear Enable Data Output OC CLR C D Q H X X X Z L L X X L L H L X Q0H L L L H H H H Device type 02 Output control Clear Enable Data Output OC PRE C D Q H X X X ZL L X X L L H L X Q0H L L L H H H H H = High level (steady state). L = Low level, (steady state). Z

44、 = High impedance state. X = Irrelevant. Q0= The level of Q or Q before the indicated input conditions were established. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY

45、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 Device type 01 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS

46、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 Device type 02 FIGURE 3. Logic diagram - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84032 DEFENSE SUPPLY CENTER COLUMBUS C

47、OLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall b

48、e conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of M