DLA SMD-5962-84062 REV H-2009 MICROCIRCUIT DIGITAL HIGH SPEED CMOS 3-TO-8 LINE DECODER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Add vendor CAGE F8859. Add device class V criteria. Editorial changes throughout. jak 99-11-05 Monica L. Poelking F Correct data limits in paragraph 1.3 and IINtest conditions in table I. Add case outline X. Correct figure 2. Add table III, delta

2、 limits. Editorial corrections throughout. - jak 00-06-21 Monica L. Poelking G Correct table II. Update boilerplate to MIL-PRF- 38535 requirements. jak 02-01-16 Thomas M. Hess H Add JEDEC Standard 7-A reference in paragraphs 2.2 and 4.4.1c. Update boilerplate paragraphs to the current requirements a

3、s specified in MIL-PRF-38535. - jak 09-10-21 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHEET REV H SHEET 15 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http

4、:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 3-TO-8 LINE DECODER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 8

5、4-09-13 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 84062 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E001-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4

6、3218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are ref

7、lected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 84062 01 E A Drawing number Device type Case outline Lead finish (see 1.2

8、.2) (see 1.2.4) (see 1.2.5) For device class V: 5962 - 84062 01 V X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V

9、 RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2

10、.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC138 3-to-8 line decoder 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the

11、device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883

12、compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUP

13、PLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16

14、 or CDFP3-F16 16 Flat pack X CDFP4-F16 16 Flat pack2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (

15、VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc Input clamp current (IIK) (VINVCC) . 20 mA Output clamp current (IOK) (VOUTVCC) . 20 mA Continuous output current (IOUT) (VOUT= 0.0 to VCC) 25 mA Continuous c

16、urrent through VCCor GND . 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD): 500 mW 4/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 5/ 1.4 Recommended operating conditi

17、ons. 2/ 3/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time tr, tf): VCC= 2.0 V 0 to 500 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the devic

18、e. Extended operation at the maximum levels may degrade performance and affect reliability 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range of -55C to +125C. 4/ Fo

19、r TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

20、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form

21、a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE S

22、TANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availa

23、ble online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwis

24、e specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 7-A - Standard for Description of 54/74HCXXXX and 54/74HCTXXXX High-Speed CMOS Devices (Copies of these documents are available online at http:/www.eia.

25、org or from the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supers

26、edes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality

27、Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, cons

28、truction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herei

29、n. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching wavefor

30、ms and test circuit shall be as specified in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97

31、3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electric

32、al test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For pack

33、ages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance w

34、ith MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as r

35、equired in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of complian

36、ce shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, f

37、or device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-P

38、RF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that

39、 affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option

40、of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

41、MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Hig

42、h level output voltage VOHVIN= VIHminimum or VILmaximum IOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHminimum or VILmaximum IOH= -4.0 mA VCC= 4.5 V 1 3.98 2, 3 3.7 VIN= VIHminimum or VILmaximum IOH= -5.2 mA VCC= 6.0 V 1 5.48 2, 3 5.2 Low level output voltage VOLVIN= VIHmi

43、nimum or VILmaximum IOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHminimum or VILmaximum IOL= +4.0 mA VCC= 4.5 V 1 0.26 2, 3 0.40 VIN= VIHminimum or VILmaximum IOL= +5.2 mA VCC= 6.0 V 1 0.26 2, 3 0.40 High level input voltage VIH 2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15

44、 VCC= 6.0 V 4.2 Low level input voltage VIL 2/ VCC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINVIN= 0.0 V, TC= +25C, VCC= 2.0 V to 6.0 V, See 4.4.1c 4 10.0 pF Quiescent supply current ICCVIN= VCC or 0.0 V VCC= 6.0 V IOUT= 0.0 A 1 8.0 A 2, 3 160.0 Input leakage current IIN

45、VIN= VCCor 0.0 V VCC= 6.0 V 1 100.0 nA 2, 3 1000.0Power dissipation capacitance CPDSee 4.4.1c 4 85.0 pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84062 DEFENSE SUPPLY CENTER CO

46、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditions 1/ -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Functional tests See 4.4.1b 7, 8 Propagation dela

47、y time, binary select to any output tPLH1 tPHL1 3/ TC= +25C CL= 50 pF See figure 4 VCC= 2.0 V 9 180.0 ns VCC= 4.5 V 36.0 VCC= 6.0 V 31.0 TC= -55C and +125C CL= 50 pF See figure 4 VCC= 2.0 V 10, 11 270.0 ns VCC= 4.5 V 54.0 VCC= 6.0 V 46.0 Propagation delay time, G1 to any output tPHL2 tPLH2 3/ TC= +2

48、5C CL= 50 pF See figure 4 VCC= 2.0 V 9 155.0 ns VCC= 4.5 V 31.0 VCC= 6.0 V 26.0 TC= -55C and +125C CL= 50 pF See figure 4 VCC= 2.0 V 10, 11 235.0 ns VCC= 4.5 V 47.0 VCC= 6.0 V 40.0 Propagation delay time, G2A or G2B to output tPHL3 tPLH3 3/ TC= +25C CL= 50 pF See figure 4 VCC= 2.0 V 9 155.0 ns VCC= 4.5 V 31.0 VCC= 6.0 V 26.0 TC= -55C and +125C CL= 50 pF See figure 4 VCC= 2.0 V 10, 11 235.0 ns VCC= 4.5 V 47.0 VCC= 6.0 V 40.0 See footnotes at end of t