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本文(DLA SMD-5962-84066 REV G-2006 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单片可编程序外围接口 氧化物半导体数字微型电路》.pdf)为本站会员(syndromehi216)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-84066 REV G-2006 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单片可编程序外围接口 氧化物半导体数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Changes to recommended operating conditions, table I, and table II. Convert to military drawing format. Editorial changes throughout. Add device type 02. Add vendor CAGE 34649. 87-02-27 N. A. Hauck C Changes in accordance with NOR 5962-R053-93. 9

2、2-12-18 Monica L. Poelking D Changes in accordance with NOR 5962-R077-95. 95-04-19 Monica L. Poelking E Update boilerplate to MIL-PRF-38535 requirements. Correct drawing title to indicate device function. - CFS 03-08-05 Thomas M. Hess F Correct marking requirements in 3.5. Update boilerplate in acco

3、rdance with MIL-PRF-38535 requirements. - PHN. 05-03-17 Thomas M. Hess G Change IBHH and IBHL maximum limits in table I from -400 uA and 400 uA, respectively, to -450 uA and 450 uA, respectively, at -55C. - CFS. 06-11-06 Thomas M. Hess REV SHET REV E E E E SHEET 15 16 17 18 REV STATUS REV G E F F G

4、E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY

5、 N. A. Hauck AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-12-03 MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE PERIPHERAL INTERFACE, MONOLITHIC SILICON SIZE A CAGE CODE 67268 84066 AMSC N/A REVISION LEVEL G SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E034-07 Provided by IHSNot for Resa

6、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 com

7、pliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84066 01 Q A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s

8、). The device type(s) identify the circuit function as follows: Device type Generic number Frequency Circuit function 01 82C55A-5/B 5.0 MHz Programmable peripheral interface 02 82C55A/B 8.0 MHz Programmable peripheral interface 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-

9、1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line X CQCC1-N44 44 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range

10、(VCC) (Referenced to ground). +8.0 V dc maximum Input, output, or I/O applied voltage range . GND - 0.5 V dc to VCC+ 0.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/. 1.0 W Lead temperature (soldering, 10 seconds). +260C Maximum junction temperature (TJ) . +150C The

11、rmal resistance, junction-to-case (JC): Case Q . See MIL-STD-1835 Case X See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Case operating temperature range (TC) . -55C to +125C Frequency of operation: Device type 01 0 to 5.0 MHz Device type 02 0

12、 to 8.0 MHz Operating supply current (ICCOP). 10 mA maximum 2/ Data float after READ (tDF) (5) 3/. 10 ns minimum to 75 ns maximum ACK = 1 to output float (tKD) (23) 3/. 20 ns minimum to 250 ns maximum _ 1/ Must withstand the added PDdue to short circuit test e.g., IOS. 2/ ICCOP= 1 mA/MHz of peripher

13、al read/write cycle time (ie: 1.0 s I/O read/write cycle time = 1 mA). 3/ See waveforms on figure 3 and test condition 2 on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COL

14、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified,

15、 the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfac

16、e Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil

17、or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, h

18、owever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to

19、this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying ac

20、tivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described he

21、rein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1

22、 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Switching waveforms and test circuits. The switching

23、 waveforms and test circuits shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for

24、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be t

25、he subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Ce

26、rtification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option

27、 is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall

28、 affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.

29、8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore do

30、cumentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DS

31、CC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= +4.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level input voltage VIHVCC= 5.5 V 1, 2, 3 All 2.2 V Low level input voltage VIL1, 2, 3 All 0.8 V IOH

32、= -2.5 mA 1/ 3.0 High level output voltage VOHIOH= -100 A 1/ 1, 2, 3 All VCC0.4 V Low level output voltage VOLIOL= +2.5 mA 1/ 1, 2, 3 All 0.4 V Low level input leakage current IILVCC= 5.5 V VIN= 0 V or VCC1, 2, 3 All -1.0 1.0 A I/O pin leakage current IOVCC= 5.5 V VO= 0 V or VCC1, 2, 3 All -10.0 10.

33、0 A 1, 2 -50 -400 Bus hold high leakage current IBHHVO= 3.0 V, VCC= 4.5 V and 5.5 V Ports A, B, C 3 All -50 -450 A 1, 2 50 400 Bus hold low leakage current IBHLVO= 1.0 V, VCC= 4.5 V and 5.5 V Port A only 3 All 50 450 A Darlington drive current IDARPorts A, B, C 2/ 3/ 1, 2, 3 All -2.5 4/ mA Power sup

34、ply current ICCSBVCC= 5.5 V, VIN= VCCor GND Outputs open 1, 2, 3 All 10 A Input capacitance CINFrequency = 1 MHz, see 4.3.1c All measurements are referenced to device ground. TC= +25C, VIN= VCCor GND 4 All 10 pF I/O capacitance CI/OFrequency = 1 MHz, see 4.3.1c All measurements are referenced to dev

35、ice ground. TC= +25C, VIN= VCCor GND 4 All 20 pF Functional tests See 4.3.1d 5/ 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

36、, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C VCC= +4.5 V unless otherwise specified Referencenumber 6/ Group A subgroups Device type Limits Unit Min Max Address stable before READ tA

37、R1 9, 10, 11 All 0 ns Address stable after READ tRA2 9, 10, 11 All 0 ns 01 250 READ pulse width tRR3 9, 10, 11 02 150 ns 01 200 Data valid from READ tRD4 (1) 9, 10, 11 02 120 ns Time between READS, WRITES, and READ and WRITE tRV6 9, 10, 11 All 300 ns Address stable before WRITE tAW7 9, 10, 11 All 0

38、ns Address stable after WRITE tWA8 9, 10, 11 All 20 ns WRITE pulse width tWW10 9, 10, 11 All 100 ns Data valid to WRITE high tDW12 9, 10, 11 All 100 ns Data valid after WRITE high tWD13 9, 10, 11 All 30 ns WR = 1 to output tWB15 (1) 9, 10, 11 All 350 ns Peripheral data before RD tIR16 9, 10, 11 All

39、0 ns Peripheral data after RD tHR17 9, 10, 11 All 0 ns ACK pulse width tAK18 9, 10, 11 All 200 ns STB pulse width tSTf = 1 MHz 19 9, 10, 11 All 100 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

40、T DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C VCC= +4.5 V unless otherwise specified Referencenumber 6/ Group A subgroups

41、 Device type Limits Unit Min Max Peripheral data before STB high tPS20 9, 10, 11 All 20 ns Peripheral data after STB high tPH21 9, 10, 11 All 50 ns ACK = 0 to output tAD22 (1) 9, 10, 11 All 175 ns WR = 1 to OBF = 0 tWOB24 (1) 9, 10, 11 All 150 ns ACK = 0 to OBF = 1 tAOB25 (1) 9, 10, 11 All 150 ns ST

42、B = 0 to IBF = 1 tSIB26 (1) 9, 10, 11 All 150 ns RD = 1 to IBF = 0 tRIB27 (1) 9, 10, 11 All 150 ns RD = 0 to INTR = 0 tRIT28 (1) 9, 10, 11 All 200 ns STB = 1 to INTR = 1 tSIT29 (1) 9, 10, 11 All 150 ns ACK = 1 to INTR = 1 tAIT30 (1) 9, 10, 11 All 150 ns WR = 0 to INTR = 0 tWIT31 (1) 9, 10, 11 All 20

43、0 ns Reset pulse width 7/ tRESf = 1 MHz 32 9, 10, 11 All 500 ns 1/ Interchanging of force and sense condition is permitted. 2/ Refers to test condition 3 as specified on figure 3. 3/ Guaranteed by VOHtest. 4/ No internal current limiting on port outputs. A resistor must be added externally to limit

44、the current. 5/ Tested as follows: f = 1 MHz, VIN= 2.6 V, VIL= 0.4 V, CL= 50 pF, VOH 1.5 V, and VOL 1.5 V. 6/ The reference number refers to the parameter being measured on figure 3 and the number identified in ( ) refers to the test condition on figure 3. 7/ Period of initial reset pulse after powe

45、r-on must be at least 50 s. Subsequent reset pulses may be 500 ns minimum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DS

46、CC FORM 2234 APR 97 Device types: 01 and 02 Case outline Q Terminal number Terminal symbol Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PA3 PA2 PA1 PA0 RD CS GND A1 A0 PC7 PC6 PC5 PC4 PC0 PC1 PC2 PC3 PB0 PB1 PB2 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

47、 38 39 40 PB3 PB4 PB5 PB6 PB7 VCCD7 D6 D5 D4 D3 D2 D1 D0 RESET WR PA7 PA6 PA5 PA4 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

48、 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 Device types: 01 and 02 Case outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 PA3 PA2 PA1 PA0 RD CS VSSNC A1 A0 PC7 PC6 PC5 PC4 PC0 PC1 PC2 PC3 PB0 PB1 PB2 PB3 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 PB4 PB5 PB6 PB7 VCCNC NC D7 D6 D5 D4 D3 D2 D1 D0 RESET NC WR PA7 PA6 PA5 PA4 NC = No connection FIGURE 1. Terminal connections - Continued. Provided by IHSNot for ResaleNo reproduction or netwo

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