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本文(DLA SMD-5962-84135 REV E-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器 TTL肖脱基高级小功率双极数字微型电路》.pdf)为本站会员(eastlab115)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-84135 REV E-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器 TTL肖脱基高级小功率双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Change maximum low level input voltage, (VIL) to 0.7 V dc. Delete minimum from propagation delay times. Change maximum on propagation delay times. Revise to military drawing format. 87-04-28 M. A. Frye C Split VILinto temperatures. Change propaga

2、tion delays. Add footnotes to table I. Add figure 4. Editorial changes throughout. Change in table II. Add CAGE 27014 to case 2. 88-05-12 M. A. Frye D Changes in accordance with NOR 5962-R097-92. 02-08-14 Monica L. Poelking E Redraw with changes. Update to reflect latest changes in format and requir

3、ements. Editorial changes throughout. - gap 05-12-12 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Monica L. Poelking DEFE

4、NSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, MULTIPLEXER AND AGENCI

5、ES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-05-18 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 84135 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E498-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI

6、RCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix

7、A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84135 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Ci

8、rcuit function 01 54ALS251 1 of 8 data selector/multiplexer with 3-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16

9、 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage range -1.5 V dc at -18 mA to +7.0 V dc Storage temperature -65C to +150C M

10、aximum power dissipation (PD) per device 1/ . 77 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum hi

11、gh level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL): VIL= +125C . 0.7 V dc VIL= +25C . 0.8 V dc VIL= -55C 0.8 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circui

12、t test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governme

13、nt specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION

14、 MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micr

15、ocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2

16、 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3

17、.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a m

18、anufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan m

19、ay make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow

20、option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The termina

21、l connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified

22、on figure 4 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted witho

23、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical t

24、ests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator

25、“C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certifica

26、te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the req

27、uirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to

28、DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the o

29、ption of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality confor

30、mance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity u

31、pon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, exce

32、pt interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-

33、3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max High level output voltage VOHIOH= -0.4 mA 1, 2, 3 2.5 V VCC= 4.5 V, VIH= 2.0 V, VIL: at +125C

34、= 0.7 V at -55C = 0.8 V at +25C = 0.8 V 2/ IOH= -1.0 mA 2.4 Low level output voltage VOLVIL= 0.7 V 2 0.4 V VCC= 4.5 V, IOL= 12 mA, VIH= 2.0 V, 2/ VIL= 0.8 V 1, 3 0.4 Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V, Unused inputs = 0.0

35、 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7.0 V, Unused inputs = 0.0 V 100 Low level input current IILVCC= 5.5 V, VIN= 0.4 V Unused inputs are 4.5 V 1, 2, 3 -100 A Output current IOVCC= 5.5 V, 3/ VOUT= 2.25 V 1, 2, 3 -20 -112 mA Supply current, ICCVCC= 5.5 V, VIN 0.4 V Enabled 1, 2, 3 10 mA CC= 5.5 V, VI

36、N 4.5 V Disabled 14 Off-state output current IOZHVCC= 5.5 V, VOUT= 2.7 V 1, 2, 3 20 A IOZL VCC= 5.5 V, VOUT= 0.4 V -20 Functional tests See 4.3.1c 4/ 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI

37、RCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics -Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min MaxPropagat

38、ion delay time, A, B, C to Y tPLH1VCC= 4.5 V to 5.5 V, CL= 50 pF 9 1 19 ns tPHL1R1= 500 R2= 500 10, 11 7 32 Propagation delay time, A, B, C to Y tPLH2See figure 4 5/ 9 5 30.5 ns tPHL210, 11 7 23.5 Propagation delay time, any D to Y tPLH39 2 11 ns tPHL310, 11 3 21 Propagation delay time, any D to Y t

39、PLH49 3 20.5 ns tPHL410, 11 3 16 Output enable time, G to Y tPZH19 3 15 ns tPZL110, 11 3 18 Output disable time, G to Y tPHZ19 2 10 ns tPLZ110, 11 1 13 Output enable time, G to Y tPZH29 3 15 ns tPZL210, 11 3 17 Output disable time, G to Y tPHZ29 2 10 ns tPLZ210, 11 1 13 1/ Unused inputs that do not

40、directly control the pin under test must be 2.5 V or 0.4 V. No unused inputs shall exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 2/ All outputs must be tested. In the case where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be performed

41、with each input being selected as the VILmaximum or VIHminimum input. 3/ The output conditions have been chosen to produce a current that closely approximates one half of the true short circuit output current, IOS. Not more than one output will be tested at one time and the duration of the test cond

42、ition shall not exceed 1 second. 4/ Functional tests shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 5/ Propagation delay limits are based on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or networking permitted witho

43、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

44、-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 D0, D1 . D7 = the level of the respective D input. H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Truth table. INPUTS OUTPUTS Sel

45、ect STROBE C B A G Y Y X X X H Z Z L L L L D0 0D L L H L D1 1D L H L L D2 2D L H H L D3 3D H L L L D4 4D H L H L D5 5D H H L L D6 6D H H H L D7 7D Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPP

46、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

47、HIO 43218-3990 REVISION LEVEL E SHEET 10 DSCC FORM 2234 APR 97 FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43

48、218-3990 REVISION LEVEL E SHEET 11 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. When measuring propagation delay times of three-state outputs, switch S1 open. 3. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. 4. All input pulse

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