DLA SMD-5962-84141 REV E-2005 MICROCIRCUIT DIGITAL ADVANCED LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器 TTL肖脱基高级小功率数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Table I, added footnotes and changed propagation delay times. Added Figure 4, switching waveforms and test circuit. Change to military drawing format. Editorial changes throughout. 88-05-03 M. A. Frye C Changes in accordance with NOR 5962-R014-92

2、 91-11-18 Monica L. Poelking D Changes in accordance with NOR 5962-R337-92. 92-10-05 Monica L. Poelking E Redraw with changes. Update to current requirements. Editorial changes throughout. - gap 05-11-17 Raymond Monnin CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E

3、 OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Christopher A. Rauch DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY David H. Johnson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A.

4、Frye MICROCIRCUIT, DIGITAL, ADVANCED LOW-POWER SCHOTTKY TTL, MULTIPLEXER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-07-02 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 84141 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E066-06 Provided by IHSNot for ResaleN

5、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compli

6、ant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84141 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s).

7、The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS151 1 of 8 data selector/multiplexer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package s

8、tyle E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat package 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input v

9、oltage range -1.5 V at -18 mA to +7.0 V Storage temperature -65C to +150C Maximum power dissipation (PD) per device 66.0 mW 1/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating con

10、ditions. Supply voltage range +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL): TC= +125C 0.7 V dc TC= -55C 0.8 V dc TC= +25C . 0.8 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation

11、is defined as VCCx ICC, and must withstand the added PDdue to short circuit test; e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION L

12、EVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those c

13、ited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outli

14、nes. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk,

15、 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulatio

16、ns unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. RE

17、QUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufac

18、turer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management

19、 (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when t

20、he QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connecti

21、ons. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall

22、be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test req

23、uirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also

24、 be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when

25、 the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved so

26、urce of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered

27、 to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required docume

28、ntation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

29、N LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Conditions -55C TC +125C Unless otherwise specified Group A subgroups Min Max Unit VIL= 0.7 V 2 High level output voltage VOHVIH= 2.0 V, VCC= 4.5 V, IOH= -0.4 mA 2/ VIL= 0.8 V 1,3 2.5 V VIL

30、 0.7 V 2 Low level output voltage VOLVIH= 2.0 V, VCC= 4.5 V, IOL= 12.0 mA 2/ VIL= 0.8 V 1,3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V IIH1VCC= 5.5 V, VIN= 2.7 V, All other inputs = 0.0 V 1, 2, 3 20 A High level input current IIH2VCC= 5.5 V, VIN= 7.0 V, All other inputs = 0

31、0 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V, All other inputs = 4.5 V 1, 2, 3 -0.1 mA Output current IOVCC= 5.5 V, VOUT= 2.25 V 3/ 1, 2, 3 -20 -112 mA Supply current ICCVCC= 5.5 V, VIN 4.5 V (All inputs) 1, 2, 3 12 mA Functional tests See 4.3.1c 4/ 7, 8 tPLH19, 10, 11 4 18.5

32、 Propagation delay time, A, B, C to Y tPHL1VCC= 4.5 V to 5.5 V, CL= 50 pF 10%, RL= 500 5%, 5/ See figure 4 9, 10, 11 7 32 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEF

33、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ Limits Test Symbol Conditions -55C TC +125C Unless otherwise specified Group A subgroups Min Max Unit tPLH29, 10, 11 5 30.5 Propagation

34、 delay time, A, B, C to Y tPHL29, 10, 11 7 23 ns tPLH39, 10, 11 3 11 Propagation delay time, any D to Y tPHL39, 10, 11 5 21 ns tPLH49, 10, 11 3 18.5 Propagation delay time, any D to Y tPHL49, 10, 11 4 15 ns tPLH59, 10, 11 4 18 Propagation delay time, G to Y tPHL59, 10, 11 4 21 ns tPLH69, 10, 11 5 22

35、 Propagation delay time, G to Y tPHL6VCC= 4.5 V to 5.5 V, CL= 50 pF 10%, RL= 500 5%, 5/ See figure 4 9, 10, 11 5 25 ns 1/ Unused inputs that do not directly control the pin under test must be 2.5 V or 0.4 V. Unused inputs shall not exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 2/ A

36、ll outputs must be tested. In the case where only one input at VILmaximum or VIH minimum produces the proper output state, the test must be performed with each input being selected as the VIL maximum or VIH minimum input. 3/ The output conditions have been chosen to produce a current that closely ap

37、proximates one-half of the true short circuit output current, IOS. Not more than one output will be tested at a time and the duration of the test condition shall not exceed 1 second. 4/ Functional tests shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 5/ The propagation del

38、ay limits are based on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET

39、 7 DSCC FORM 2234 APR 97 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 9

40、7 INPUTS OUTPUTS SELECT C B A STROBE G Y Y X X X H L H L L L L D0 0D L L H L D1 1D L H L L D2 2D L H H L D3 3D H L L L D4 4D H L H L D5 5D H H L L D6 6D H H H L D7 7D H = high level, L = low level, X = irrelevant D0 - D7 = the level of the D respective input FIGURE 2. Truth table. Provided by IHSNot

41、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or

42、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics

43、 PRR 10 Mhz, duty cycle = 50%, tr= tf= 3 ns 1 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

44、UIT DRAWING SIZE A 84141 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be i

45、n accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manuf

46、acturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2)

47、TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups

48、 (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005