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本文(DLA SMD-5962-84145 REV D-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL OR DRIVERS MONOLITHIC SILICON《硅单片或驱动器 TTL肖脱基高级小功率双极数字微型电路》.pdf)为本站会员(feelhesitate105)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-84145 REV D-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL OR DRIVERS MONOLITHIC SILICON《硅单片或驱动器 TTL肖脱基高级小功率双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change VIL, tPLH, and tPHL. Convert to military drawing for format. 86-10-14 M. A. Frye B Change input voltage range. Change ICCHfrom 8 mA maximum to 9 mA maximum. Editorial changes throughout. Change propagation delays. Added figure 3. Changed T

2、able II. 88-12-05 M. A. Frye C Changes in accordance with NOR 5962-R338-92 92-10-05 Monica L. Poelking D Redraw with changes. Update to current requirements. Editorial changes throughout. - gap 05-12-14 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

3、 REV SHET REV SHET REV STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Christopher A. Rauch DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Wm. J. Johnson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY

4、 ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, OR DRIVERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-05-13 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 84145 SHEET 1 OF 9 DSCC FORM 2233 APR

5、 97 5962-E064-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing descr

6、ibes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84145 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.

7、2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS832 Hex 2-input OR drivers 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descr

8、iptive designator Terminals Package style R GDIP1-T20 or GDIP2-T20 20 Dual-in-line S GDFP2-F20 or GDFP3-F20 20 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7

9、.0 V dc Input voltage range -1.2 V at -18 mA to +7.0 V Storage temperature range . -65C to +150C Maximum power dissipation (PD) 1/ 88 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended opera

10、ting conditions. Supply voltage (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C High level output current (IOH) -12 mA Low level output current (IOL) . 12 m

11、A _ 1/ Maximum power dissipation is defined as VCC* ICC. Device must withstand the added PDdue to short circuit test; e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS

12、COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i

13、ssues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Stan

14、dard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the

15、Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supe

16、rsedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing

17、 that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity appro

18、val in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“

19、or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlin

20、e(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections and logic diagram. The terminal connections and logic diagram shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Switching waveforms and test cir

21、cuit. The switching waveforms and test circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4

22、Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN

23、G SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also b

24、e marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when t

25、he QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved sour

26、ce of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered t

27、o this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required document

28、ation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-

29、STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

30、 control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and fi

31、nal electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

32、UIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min MaxHigh level output vol

33、tage VOH1, 2, 3 2.5 V VCC= 4.5 V, IOH= -0.4 mA VIH= 2.0 V, VIL= 0.7 V Low level output voltage VOL1, 2, 3 0.4 V VCC= 4.5 V, IOL= 12 mA VIH= 2.0 V, VIL= 0.7 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V High level input current IIH1VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 20 A IH2VCC= 5.5 V,

34、VIH= 7.0 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V, VIL= 0.4 V 1, 2, 3 -0.1 Output current IOVCC= 5.5 V, VOUT= 2.25 V 1/ 1, 2, 3 -20 -112 mA Supply current ICCHVCC= 5.5 V, VIN= 4.5 V 1, 2, 3 9 mA CCLVCC= 5.5 V, VIN= 0.0 V 1, 2, 3 16 Propagation delay time, A, B to Y tPLHVCC= 4.5 V to 5.5

35、 V CL= 50 pF 10%, 9, 10, 11 2 11 ns tPHLRL= 500 5% See figure 3 9, 10, 11 1 10 ns 1/ The output conditions have been chosen to produce a current that closely approximates one half of the true short circuit output current, IOS. Not more than one output shall be tested at one time and the duration of

36、the short circuit condition shall not exceed 1 second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97

37、FIGURE 1. Terminal connections (top view), and logic diagram. Inputs Output A B Y H X H X H H L L L H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

38、IT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics: PRR 10 Mhz, tr= tf= 3 ns 1 ns, duty cycle = 50%. 3. The outputs are

39、measured one at a time with one input transition per measurement. FIGURE 3. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI

40、O 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3

41、, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1*, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-

42、883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verificati

43、on of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under doc

44、ument revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimu

45、m. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84145 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D

46、 SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original eq

47、uipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinate

48、d with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FS

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