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本文(DLA SMD-5962-84152 REV C-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL MAGNITUDE COMPARATOR MONOLITHIC SILICON《硅单片量值比较器 TTL肖脱基高级小功率数字微型电路》.pdf)为本站会员(feelhesitate105)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-84152 REV C-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL MAGNITUDE COMPARATOR MONOLITHIC SILICON《硅单片量值比较器 TTL肖脱基高级小功率数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R123-92. 92-02-05 Monica L. Poelking B Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-08-09 Raymond Monnin C Change 3.5 marking paragraph to remove “5962-“.

2、Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-17 Thomas M. Hess CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY

3、 CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, MAGNITUDE COMPARATOR, AND AGENCIES OF THE DEPARTMENT OF

4、 DEFENSE DRAWING APPROVAL DATE 85-07-01 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 84152 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E472-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 841

5、52 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifyi

6、ng Number (PIN). The complete PIN is as shown in the following example: 84152 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01

7、54LS684 8-bit magnitude comparator 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square chip carrier

8、1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc +7.0 V dc Input voltage range . -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 357.5 mW Lead temperatu

9、re (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases R and S. See MIL-STD-1835 Case 2 80 C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2

10、.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted

11、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and

12、 handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTM

13、ENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these docu

14、ments are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and t

15、he references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-

16、PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be pro

17、cessed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect

18、form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construc

19、tion, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables s

20、hall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case opera

21、ting temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

22、STANDARD MICROCIRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the

23、manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-

24、PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

25、 listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot

26、of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and

27、applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU

28、S, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min MaxHigh level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA 1, 2, 3 All 2.5 V L

29、ow level output voltage VOL VCC= 4.5 V, IOL= 12 mA 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.5 V Low level input current IIL VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -200 A High level input current IIH1 VCC= 5.5 V, VIN= 2.7 V, 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIN= 7

30、.0 V, 100 Short circuit output current 1/ IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -20 -130 mA Supply current, ICC VCC= 5.5 V 1, 2, 3 All 65 mA High level output current IOH1, 2, 3 All -0.4 mA Low level output current IOL 1, 2, 3 All 12 mA Propagation delay time, tPLH1 VCC= 5.0 V, 9 All 25 ns P to

31、Q P = CL = 50 pF 10%, 10, 11 All 35 tPHL1 RL = 667 5%, 9 All 25 ns All other inputs low 10, 11 All 35 Propagation delay time, tPLH2 9 25 ns Q to Q P = 10, 11 All 35 tPHL2 All 25 ns 10, 11 35 Propagation delay time, tPLH3 9 All 30 ns P to Q P 10, 11 42 tPHL3 All 30 ns 10, 11 42 Propagation delay time

32、, tPLH4 9 All 30 ns Q to Q P 10, 11 42 tPHL4 All 30 ns 10, 11 42 1/ Not more than one output should be shorted at a time, and duration of the short circuit condition should not exceed one second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

33、RD MICROCIRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, 2 Terminal number Terminal symbol 1 Q P 2 P0 3 Q0 4 P1 5 Q1 6 P2 7 Q2 8 P3 9 Q3 10 GND 11 P4 12 Q4 13 P5 14 Q5 15 P6 16 Q6 1

34、7 P7 18 Q7 19 Q P = 20 VCCFIGURE 1. Terminal connections. INPUTS OUTPUTS DATA P, Q P = Q P Q P = Q L H P Q H L P Q H H H = High level L = Low level X = Irrelevant FIGURE 2. Truth tables. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC

35、IRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagrams. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84152 D

36、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 50

37、04 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revi

38、sion level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Inte

39、rim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-ST

40、D-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Group C end-point electrical parameters (method 5005) 1, 2, 3, 10*, 11* Group D end-point electrical paramet

41、ers (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and

42、 D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IH

43、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84152 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters

44、shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activ

45、ity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PAC

46、KAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and lo

47、gistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the in

48、dividual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will

49、 maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA,

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