DLA SMD-5962-84154 REV D-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL REGISTER MONOLITHIC SILICON《硅单片自记器 TTL肖脱基高级小功率双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R122-92. - tvn 92-02-21 Monica L. Poelking B Changes in accordance with NOR 5962-R136-93. - ltg 93-04-21 Monica L. Poelking C Update to reflect latest changes in format and requirements. Editorial changes throu

2、ghout. - les 02-08-13 Raymond Monnin D Change 3.5 marking paragraph to remove “5962-“. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-17 Thomas M. Hess CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D

3、 OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, D

4、IGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, REGISTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-07-03 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 84154 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E470-05 Provided by IHSNot for ResaleNo reproduction or networ

5、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level

6、 B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84154 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) ident

7、ify the circuit function as follows: Device type Generic number Circuit function 01 54LS399 Quad 2-port register 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-

8、line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc +7.0 V dc Input voltage range . -1.2V dc at -18 mA to 7.0 V dc Storage temperature r

9、ange -65C to +150C Maximum power dissipation (PD) 1/ 37 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases E and F . See MIL-STD-1835 Case 2 80 C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5

10、V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C Width of clock pulse 20 ns minimum Data setup time. 25 ns minimum Select setup time. 45 ns minimum Hold time, any inpu

11、t: +25C 0 ns minimum -55C or +125C 5 ns minimum _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING

12、SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specifi

13、ed herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard

14、Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist/daps/dla.mil/quic

15、ksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes p

16、recedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and

17、as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers a

18、pproved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications sh

19、all not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-P

20、RF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The log

21、ic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Elect

22、rical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups speci

23、fied in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compli

24、ance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Cert

25、ificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the m

26、anufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of

27、change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall

28、be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 9

29、7 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min MaxHigh level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4.0 mA 1, 2, 3 All

30、0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 2.7 V, 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIN= 5.5 V, 100 A Low level input current IIL VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.4 mA Short circuit output current IOSVCC= 5.5 V, VOUT=

31、GND 1/ 1, 2, 3 All -20 -100 mA Supply current ICC VCC= 5.5 V, VIN= GND 1, 2, 3 All 13 mA High level output current IOH1, 2, 3 All -0.4 mA Low level output current IOL 1, 2, 3 All 4.0 mA Propagation delay time, tPLH VCC= 5.0 V, CL= 15 pF 10% 9 All 27 ns clock to output 2/ RL = 2 K 5% 10, 11 All 38 CL

32、= 50 pF 10% 9 All 29.8 10, 11 All 41.72 tPHL CL= 15 pF 10% 9 All 32 ns 10, 11 All 45 CL= 50 pF 10% 9 All 34.8 10, 11 All 48.72 1/ Not more than one output should be shorted at a time, and duration of the short circuit condition should not exceed one second. 2/ AC limits may be tested at either the 1

33、5 pF or the 50 pF limits, but must be guaranteed if not tested to the 50 pF limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D S

34、HEET 6 DSCC FORM 2234 APR 97 Device type 01 01 Case outlines E, F 2 Terminal number Terminal symbols 1 WS NC 2 QA WS 3 A1 QA 4 A2 A1 5 B2 A2 6 B1 NC 7 QB B2 8 GND B1 9 CLK QB 10 QC GND 11 C1 NC 12 C2 CLK 13 D2 QC 14 D1 C1 15 QD C2 16 VCCNC 17 - - - D2 18 - - - D1 19 - - - QD 20 - - - VCCFIGURE 1. Te

35、rminal connections. INPUTS OUTPUTS WORD SELECT CLOCK QA QB QC QD L a1 b1 c1 d1 H a2 b2 c2 d2 X L QAO QBO QCO QDO H = High level L = Low level X = Irrelevant = Transition from low to high level FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

36、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI

37、RCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be

38、in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manu

39、facturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2)

40、 TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroup

41、s (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Group C end-point electrical parameters (method 5005) 1, 2, 3, 10*, 11* Group D

42、end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 i

43、ncluding groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the

44、 truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84154 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-

45、point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the

46、preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method

47、 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment),

48、 design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration co