DLA SMD-5962-84156 REV E-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL BUFFER MONOLITHIC SILICON《硅单片缓冲器 TTL肖脱基高级小功率数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change tPHZmaximum limits to 29/41 ns and tPLZmaximum limits to 18/26 ns. Convert to military drawing format. Delete minimum limits from IIL. Make corrections to table I VOH1. 87-01-28 N. A. Hauck B Change IOLmaximum limit to 12 mA. Change tPHZan

2、d tPLZmaximum limits to 33/46/22/30 ns. Add note to table I. Omit inversion circles from Fig. 1. Change code itent no. to 67268. Editorial changes. 87-10-15 R. R. Evans C Changes in accordance with NOR 5962-R124-92. - tvn. 92-02-05 Monica L. Poelking D Update to reflect latest changes in format and

3、requirements. Editorial changes throughout. - les 02-08-20 Raymond Monnin E Change 3.5 marking paragraph to remove “5962-“. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-17 Thomas M. Hess CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV

4、SHET REV STATUS REV E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENT

5、S APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-07-01 SCHOTTKY, TTL, BUFFER, MONOLITHIC SILICONAMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 84156 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E471-05 Provided by IHSNot for

6、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883

7、 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84156 01 S X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device ty

8、pe(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS541 Inverting octal buffer gate (inverting control inputs) with three-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline

9、letter Descriptive designator Terminals Package style S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc +7.0 V dc Input voltage range . -1.

10、5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 302 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply volta

11、ge range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL): At -55C and +25C. 0.7 V dc At +125C 0.6 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and m

12、ust withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 223

13、4 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or

14、contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE H

15、ANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, B

16、uilding 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific e

17、xemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML

18、) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as doc

19、umented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-385

20、35 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 he

21、rein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking per

22、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteris

23、tics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shal

24、l be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-

25、38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be list

26、ed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Ce

27、rtificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Ve

28、rification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or net

29、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise spe

30、cified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOH1VCC= 4.5 V, VIH= 2.0 v, IOH= -3 mA, VIL= 0.7 V at +25C and -55C VIL= 0.6 V at +125C 1, 2, 3 All 2.4 V VOH2VCC= 4.5 V, VIH= 2.0 v, VIL= 0.5 V, IOH= -12 mA 1, 2, 3 All 2.0 V Low level output voltage VOL VCC= 4.5 V, I

31、OL= 12 mA, VIH= 2.0 v, VIL= 0.7 V at +25C and -55C VIL= 0.6 V at +125C 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA TC= +25C 1 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 2.7 V, 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIN= 7.0 V, 100 Low level input current IIL VCC= 5.5

32、V, VIN= 0.4 V 1, 2, 3 All -200 A Short circuit output current IOSVCC= 5.5 V, 1/ VOUT= 0.0 V 1, 2, 3 All -40 -225 mA Supply current, ICCH Outputs high 1, 2, 3 All 32 mA ICCL VCC= 5.5 V Outputs low 1, 2, 3 All 52 CCZ Outputs disabled 1, 2, 3 All 55 High level output current IOH1, 2, 3 All -12 mA Low l

33、evel output current IOL 1, 2, 3 All 12 mA Hysteresis 2/ VT+, VT- VCC= 4.5 V 1, 2, 3 All 0.2 V Off-state (high-impedance) output current IOZHVCC= 5.5 V, VIH= 2.0 v, VOH= 2.7 V, VIL= 0.7 V at +25C and -55C VIL= 0.6 V at +125C 1, 2, 3 All 20 A IOZL VCC= 5.5 V, VIH= 2.0 v, VOL= 0.4 V, VIL= 0.7 V at +25C

34、 and -55C VIL= 0.6 V at +125C 1, 2, 3 All -20 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6

35、DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min MaxPropagation delay time tPLH VCC= 5.0 V, 9 All 15 ns data to output CL = 50 pF 10%, 10, 11 All 21 tPHL RL

36、= 110 5% 3/ 9 All 18 ns 10, 11 All 26 Output enable time to tPZH 9 32 ns high level 10, 11 All 45 Output enable time to tPZL 38 ns low level 10, 11 All 54 Output disable time from tPHZ 9 33 ns high level 10, 11 All 46 Output disable time from tPLZ 22 ns low level 10, 11 All 30 1/ Not more than one o

37、utput should be shorted at a time, and duration of the short circuit condition should not exceed one second. 2/ Guaranteed but not tested. 3/ Frequency testing may be performed using either CL= 5 pF, CL= 45 pF or CL= 50pF. However, the manufacturer must certify and guarantee that the microcircuits m

38、eet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR

39、97 Device type 01 Case outlines S, 2 Terminal number Terminal symbol 1 1G 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 GND 11 Y8 12 Y7 13 Y6 14 Y5 15 Y4 16 Y3 17 Y2 18 Y1 19 2G 20 VCCFIGURE 1. Terminal connections. INPUTS OUTPUTS 1G 2G A Y L L H H H X X Z X H X ZL L L L H = High voltage level L = Low

40、voltage level X = Irrelevant Z = High impedance FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC F

41、ORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATIO

42、N 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following addit

43、ional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit

44、shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical paramete

45、r tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (meth

46、od 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Group C end-point electrical parameters (method 5005) 1, 2, 3 Group D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to t

47、he specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specifi

48、ed in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84156 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test condi