DLA SMD-5962-85004 REV F-2009 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS ASYNCHRONOUS 12 STAGE BINARY COUNTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor CAGE 27014 for device type 01EX, 01FX, and 012X. Convert to military drawing format. 87-03-18 C. Reusing C Add vendor CAGE F8859. Add class V device criteria. Editorial changes throughout. ljs 99-11-09 Raymond Monnin D Revise data limi

2、ts in paragraphs 1.3 and 1.4. Add case outline X. Add Table III, delta limits. Editorial changes throughout. ljs 00-07-14 Raymond Monnin E Correct table II. Update boilerplate to MIL-PRF- 38535 requirements. jak 02-01-25 Thomas M. Hess F Add JEDEC Standard in paragraphs 2.2 and 4.4.1c. Update title

3、to reflect accurate function of devices. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-09-14 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Jeffer

4、y Tunstall DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY Charles Reusing MICROCIRCUIT, DIGITAL, HIGH-SPE

5、ED CMOS, ASYNCHRONOUS 12 STAGE BINARY COUNTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 85-06-12 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 85004 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E462-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

6、TANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space applicatio

7、n (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device c

8、lasses M and Q: 85004 01 E A Drawing number Device type (see 1.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 85004 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see

9、 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are mark

10、ed with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC4040 Asynchronous 12 stage binary counter 1.2.3 Device class designator. The device cla

11、ss designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device clas

12、s Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as de

13、signated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier X CDFP4-F16 16 Flat pack Provided by IHSNot for ResaleNo reproduction or n

14、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PR

15、F-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc Input clamp diode current (IIK) 20 mA Output clamp diode

16、current (IOK) 20 mA Continuous output current . 25 mA Continuous current through VCCor GND 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junct

17、ion temperature (TJ) +175C 5/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V . 0 to 1,000 ns CC= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns Maximum operat

18、ing frequency (fmax): TC= +25C: VCC= 2.0 V . 5.5 MHz CC= 4.5 V . 28 MHz VCC= 6.0 V . 33 MHz TC= -55C to +125C: VCC= 2.0 V . 3.7 MHz CC= 4.5 V . 19 MHz VCC= 6.0 V . 22 MHz Minimum removal time, clear to clock (trec): TC= +25C: VCC= 2.0 V . 60 ns CC= 4.5 V . 12 ns VCC= 6.0 V . 10 ns TC= -55C to +125C:

19、 VCC= 2.0 V . 90 ns CC= 4.5 V . 18 ns VCC= 6.0 V . 15 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to GND.

20、 3 The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be exceeded except for allowable short circuit duration burn-in

21、 screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FOR

22、M 2234 APR 97 1.4 Recommended operating conditions Continued. Minimum pulse width, clock high or low (tW): TC= +25C: VCC= 2.0 V . 90 ns CC= 4.5 V . 18ns VCC= 6.0 V . 15 ns TC= -55C to +125C: VCC= 2.0 V . 135 ns CC= 4.5 V . 27 ns VCC= 6.0 V . 23 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification

23、, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 -

24、 Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings

25、. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following do

26、cument(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 7-A - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX High-Speed

27、CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the tex

28、t of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-3853

29、5 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix

30、A for non-JAN class level B devices and as specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 A

31、PR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accor

32、dance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit.

33、 The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I

34、 and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed i

35、n 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall

36、 still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required

37、 in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of t

38、his drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of

39、 supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as requir

40、ed for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herei

41、n) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documen

42、tation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 40 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleN

43、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C

44、TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max High-level output voltage VOH VIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 1 3.98 2, 3 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 1 5.48 2, 3 5.2 Low-leve

45、l output voltage VOLVIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHor VILIOL= +4.0 mA VCC= 4.5 V 1 0.26 2, 3 0.4 VIN= VIHor VILIOL= +5.2 mA VCC= 6.0 V 1 0.26 2, 3 0.4 High level input voltage VIH2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low-l

46、evel input voltage VIL2/ VCC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINTC= +25C, VCC= 2.0 V to 6.0 V See 4.4.1c 4 10 pF Power dissipation capacitance CPDSee 4.4.1c 4 88 pF Quiescent current ICCVIN= VCC or GND, IO= 0 VCC= 6.0 V 1 8 A 2, 3 160 Input leakage current IINVCC

47、= 6.0 V, IOUT= 0 A VIN= VCCor GND 0.1 A 2, 3 1 Functional tests See 4.4.1b 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI

48、O 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max Propagation delay time; CLK to Q1tPHL1, tPLH13/ TC= +25C CL= 50 pF See figure 4 VCC= 2.0 V 9 150 ns VCC= 4.5V 30 VCC= 6.0 V 26 TC= -55C to +125C CL= 50 pF See figure 4 VCC= 2.0 V 10, 11 225 ns VCC= 4.5V 45 VCC= 6.0 V 38 Propagation delay time; CLR to QntPHL23/ TC= +25C CL= 50 pF See figure 4 VCC= 2.0 V 9 170 ns VCC= 4.5 V