DLA SMD-5962-85063 REV C-2005 MICROCIRCUIT MICROPROCESSOR DIGITAL N-CHANNEL 16-BIT MICROCONTROLLER MONOLITHIC SILICON《硅单片14级二进计数器 高速氧化物半导体数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y. Change to military drawing format. Change AC parameters tAVDV, tRLDV, tLHLL, tAVLL. Change drawing CAGE to 67268. Editorial changes throughout. 87-10-23 Michael A. Frye B Modify paragraphs 3.1 and 3.5.1 to allow product to be

2、marked with “QD” certification mark. Change CSlimit in table I. Add subgroup test option for groups C and D test requirements in table II. Update boilerplate. TVN 00-10-19 Thomas M. Hess C Correct marking requirements in 3.5. Update boilerplate in accordance with MIL-PRF-38535 requirements. - PHN. 0

3、5-04-11 Thomas M. Hess THE ORIGINAL FIRST SHEET OF THIS SMD HAS BEEN REPLACED. REV SHET REV C SHET 15 REV STATUS REV C B C C B B B B B B B B B C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison STANDARD MICROCIRCUIT DRAWING CHECKED BY Da Di Cenzo DEFENSE SUPPLY

4、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-11-18 MICROCIRCUIT, MICROPROCESSOR, DIGITAL, N-CHANNEL, 16-BIT MICROCONTROLLER, MONOLIT

5、HIC SILICON SIZE A CAGE CODE 67268 85063 AMSC N/A REVISION LEVEL C SHEET 1 OF 15 DSCC FORM 2233 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-APR 97 5962-E179-05 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 complia

6、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 85063 01 Y X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). T

7、he device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 8097 NMOS 16-bit microcontroller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y See

8、 figure 1 68 Ceramic quad flatpack Z CMGA3-P68 68 Pin grid array package X 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage +7 V dc maximum Operating voltage range. -0.3 V dc to +7.0 V Voltage from any pin to VSSor ANGND -0

9、.3 V dc to +7.0 V dc Average output current (any pin) 10 mA maximum Maximum power dissipation (PD) 1.5 W Case temperature under bias. -55C to +125C 1/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC): Case Y 5C/W Case Z

10、 See MIL-STD-1835 Maximum junction temperature (TJ) . +200C _ 1/ Case temperature is “instant on”. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REV

11、ISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Digital supply voltage range (VCC) 4.5 V dc VCC 5.5 V dc Analog supply voltage range (VREF) 4.5 VCC 0.3 V VREF 5.5 VCC+ 0.3 V Power down supply voltage (VPD). 4.5 V VPD 5.5 V Oscillator frequency (fOSC) 6.0 MHz VCC 12

12、MHz Resolution 0.001 VREF1/ 2/ Accuracy 0.004 VREF1/ Differential nonlinearity. 0.002 VREFmaximum 1/ 2/ Integral nonlinearity 0.004 VREFmaximum 1/ 2/ Channel-to-channel matching 1 LSB 3/ Crosstalk (dc to 100 kHz). -60 dB maximum 3/ Case temperature under bias (TC) . -55C to +125C 4/ 2. APPLICABLE DO

13、CUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF D

14、EFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - L

15、ist of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,

16、 PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtaine

17、d. _ 1/ Testing is done at VREF= 5.120 V 2/ Guaranteed but not tested. 3/ Not tested or guaranteed. 4/ Case temperature is “instant on” Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER C

18、OLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that

19、 is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval i

20、n accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “Q

21、ML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qual

22、ifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The te

23、rminal connections shall be as specified on figure . 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure . 3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure . 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical

24、 performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3

25、.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built i

26、n compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufac

27、turers QM plan, the “QD” certification mark shall be used in place of the “Q“ or “QML“ certification mark. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The cert

28、ificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF

29、-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain t

30、he option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING

31、SIZE A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Min Max UnitInput low voltage, (e

32、xcept RESET ) VIL1All 1, 2, 3 -0.3 1/ 0.8 V Input low voltage, RESET VIL2All 1, 2, 3 -0.3 1/ 0.7 V Input high voltage (except RESET , NMI, XTAL1) VIH1All 1, 2, 3 2.0 VCC+ 0.5 1/ V Input high voltage, RESET , NMI, XTAL1 VIH2All 1, 2, 3 2.4 VCC+ 0.5 1/ V Output low voltage VOL2/ All 1, 2, 3 0.5 V Outp

33、ut high voltage VOH3/ All 1, 2, 3 2.4 V VCCsupply current ICCAll outputs disconnected All 1, 2, 3 200 mA VPDsupply current IPDNormal operation and power-down All 1, 2, 3 1 mA VREFsupply current IREFAll bits All 1, 2, 3 10 mA Input leakage current to all pins of HIS, P0, P3, P4, and to P2.1 ILI VIN=

34、0 to VCC4/ 10 A Input low current to all pins of P1 and to P2.6, P2.7 IIL1VIL= 0.45 V All 1, 2, 3 -100 A Input low current to RESET IIL2VIL= 0.45 V All 1, 2, 3 -2 mA Input low current to P2.2, P2.3, P2.4, READY IIL3VIL= 0.45 V All 1, 2, 3 -50 A Input high current to EA IIHVIH= 2.4 V All 1, 2, 3 100

35、A Pin capacitance (any pin to VSS) CS fTEST= 1.0 MHz See 4.3.1c All 4 15 pF Oscillator frequency fXTALAll 9, 10, 11 6.0 12.0 MHz1/Oscillator frequency tOSCAll 9, 10, 11 83 166 ns CLKOUT period 5/ 6/ tCHCH All 9, 10, 11 3tOSC- 30 3tOSC+ 30 ns CLKOUT high time tCHCL All 9, 10, 11 tOSC- 20 tOSC+ 20 ns

36、CLKOUT low to ALE high tCLLH Oscillator frequency = 12 MHz Load capacitance on output pins = 80 pF See figure 4 All 9, 10, 11 -30 +30 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

37、 A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TC +125C unless otherwise specified Devicetype Group A subgroups Min Max Unit ALE low to CL

38、KOUT high tLLCH All 9, 10, 11 tOSC- 20 tOSC+ 40 ns ALE pulse width tLHLL All 9, 10, 11 tOSC- 30 tOSC+ 20 ns Address valid to end of ALE tAVLL All 9, 10, 11 tOSC- 60 ns End of ALE to RD or WR active tLLRL All 9, 10, 11 tOSC- 20 ns End of ALE to address invalid 6/ tLLAX All 9, 10, 11 tOSC- 20 ns WR pu

39、lse width tWLWH All 9, 10, 11 2tOSC- 35 ns Output data valid to end of WR tQVWX All 9, 10, 11 2tOSC- 60 ns Output data hold after WR 6/ tWXQX All 9, 10, 11 tOSC- 25 ns End of WR to next ALE tWXLH All 9, 10, 11 2tOSC- 30 ns RD pulse width tRLRH All 9, 10, 11 3tOSC- 30 ns End of RD to next ALE tRHLH A

40、ll 9, 10, 11 tOSC- 30 ns READY hold after CLKOUT edge 7/ tCLYX All 9, 10, 11 0 ns End of ALE to READY setup 7/ tLLYV All 9, 10, 11 -tOSC1/ 2tOSC 60 ns Non-ready time 7/ tYLYH All 9, 10, 11 1000 ns Address valid to input data valid 7/ tAVDV All 9, 10, 11 5tOSC- 100 ns RD active to input data valid 1/

41、 7/ tRLDV All 9, 10, 11 3tOSC- 70 ns End of RD to input data float 7/ tRXDZ All 9, 10, 11 0 tOSC- 20 ns End of ALE to READY 7/ tLLYH Oscillator frequency = 12 MHz Load capacitance on output pins = 80 pF See figure 4 All 9, 10, 11 2tOSC+ 60 1/ 4tOSC- 60 8/ ns See footnotes on next sheet. Provided by

42、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ Gua

43、ranteed but not tested. 2/ IOL= 0.36 mA for all pins of P1, for P2.6 and P2.7, and for all pins of P3 and P4 when used as ports. IOL= 2.0 mA for TXD, RXD (in serial port mode 0), PWM, CLKOUT, ALE, BHE, RD , WR , and all pins of HSO and P3 and P4 when used as external memory bus (AD0 AD15). 3/ IOH= -

44、20 A for all pins of P1, for P2.6 and P2.7. IOH= -200 A for TXD, RXD (in serial port mode 0), PWM, CLKOUT, ALE, BHE, WR , and all pins of HSO and P3 and P4 when used as external memory bus (AD0 AD15). P3 and P4, when used as ports, have open-drain outputs. 4/ Analog conversion not in process. 5/ CLK

45、OUT is directly generated as a divide by three of the oscillator. The period will be 3tOSC10 ns if tOSCis constant and the rise and fall times on XTAL1 are less than 10 ns. 6/ Due to test equipment limitation, actual tested values may differ from those specified, but specified limits are guaranteed.

46、 7/ Other system components must meet these specifications. 8/ If more than one wait state is desired, add “3tOSC” for each additional wait state. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPP

47、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Case Y FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85063 DEFENSE SUPPLY CENTER COLUMBUS COLUM

48、BUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 Case Y Inches Millimeters Symbol Min Max Min Max A .080 .106 2.03 2.69 B .016 .020 0.41 0.51 B1.040 .060 1.02 1.52 B2.030 .040 0.76 1.02 B3.005 .020 0.13 0.51 C .008 .012 0.20 0.31 D 1.640 1.870 41.66 47.50 D1.935 .970 23.75 24.64 D2.800 BSC 20.32 BSC e1.050 BSC 1.27 BSC L .375 .450 9.53 11.43 L1.040 .060 1.02 1.52 N 68 68 S .066 .087 1.68 2.21 S1.050 1.27 FIGURE 1. Case outline- Continued. Provided by IHSNot for ResaleNo reproduction or networking