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本文(DLA SMD-5962-85125 REV D-2013 MICROCIRCUIT DIGITAL HIGH SPEED CMOS 8-INPUT DATA SELECTOR MULTIPLEXER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf)为本站会员(wealthynice100)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-85125 REV D-2013 MICROCIRCUIT DIGITAL HIGH SPEED CMOS 8-INPUT DATA SELECTOR MULTIPLEXER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. LTG 03-04-09 Thomas M. Hess B Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. - LTG 05-02-09 Thomas M. Hess C Add device class V crite

2、ria. - jak 06-10-19 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-11-22 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gre

3、g A. Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, HI

4、GH SPEED CMOS, 8-INPUT DATA SELECTOR/MULTIPLEXER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 86-02-07 REVISION LEVEL D SIZE A CAGE CODE 14933 85125 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E049-14 Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

5、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space ap

6、plication (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For

7、device class M and Q: 85125 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) For device class V: 5962 - 85125 01 V E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead

8、 finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels

9、 and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC251 8-input data selector/multiplexer with three-state outputs 1.2.3 Devic

10、e class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be

11、 marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline

12、(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier Provided by IHSNot for ResaleNo reproduc

13、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PR

14、F-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current . 20 mA DC output current (per pin) 25

15、 mA VCCor GND current (per pin) 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 3/ . 500 mW Lead temperature (soldering 10 seconds) 260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . 175C 1.4 Recommended operating conditi

16、ons. Supply voltage range (VCC) . +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time: VCC= 2.0 V 0 to 1000 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended

17、 operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

18、,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw

19、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88

20、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:

21、/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these

22、 documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Tec

23、hnology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201-2107). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable

24、 laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM)

25、 plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and p

26、hysical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Termin

27、al connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 4.

28、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation p

29、arameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be

30、the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible

31、due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accord

32、ance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of complia

33、nce. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed a

34、s an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of

35、MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with eac

36、h lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Ver

37、ification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the op

38、tion of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN

39、DARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min

40、 Max High level output voltage VOHVIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 All 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 5.2 Low level output voltage VOLVIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 All 0.1 V VCC= 4.5 V 0.1 V

41、CC= 6.0 V 0.1 VIN= VIHor VILIOL= +4.0 mA VCC= 4.5 V 0.4 VIN= VIHor VILIOL= +5.2 mA VCC= 6.0 V 0.4 High level input voltage 2/ VIHVCC= 2.0 V 1, 2, 3 All 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low level input voltage 2/ VILVCC= 2.0 V 1, 2, 3 All 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Quiescent current ICCV

42、CC= 6.0 V, VIN= VCCor GND 1, 2, 3 All 160 A Input leakage current IINVCC= 6.0 V, VIN= VCCor GND 1, 2, 3 All 1.0 A Off-state output current IOZVO= VCCor GND, VIN= VIHor VIL1, 2, 3 All 10.0 A Input capacitance CINVIN= 0.0 V, TC= 25C See 4.4.1c 4 All 10.0 pF Functional tests See 4.4.1d 7, 8 All L H Pro

43、pagation delay time, A, B, or C to W or Y 3/ tPHL1, tPLH1TC= 25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 All 205 ns VCC= 4.5 V 41 VCC= 6.0 V 35 TC= -55C, +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 All 310 ns VCC= 4.5 V 62 VCC= 6.0 V 53 Propagation delay time, any D to W or Y 3/ tPHL2, tPLH2T

44、C= 25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 All 210 ns VCC= 4.5 V 42 VCC= 6.0 V 36 TC= -55C, +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 All 315 ns VCC= 4.5 V 63 VCC= 6.0 V 54 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

45、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85125 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroup

46、s Device type Limits Unit Min Max Propagation delay time, output enable, G to W or Y 3/ tPZH, tPZLTC= 25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 All 175 ns VCC= 4.5 V 35 VCC= 6.0 V 30 TC= -55C, +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 All 265 ns VCC= 4.5 V 53 VCC= 6.0 V 45 Propagation del

47、ay time, output disable, G to W or Y 3/ tPHZ, tPLZTC= 25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 All 220 ns VCC= 4.5 V 44 VCC= 6.0 V 37 TC= -55C, +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 All 330 ns VCC= 4.5 V 66 VCC= 6.0 V 56 Transition time, high to low, low to high 4/ tTHL, tTLHTC= 25C

48、CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 All 75 ns VCC= 4.5 V 15 VCC= 6.0 V 13 TC= -55C, +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 All 110 ns VCC= 4.5 V 22 VCC= 6.0 V 19 1/ For a power supply of 5.0 V 10%, the worst case output voltages (VOHand VOL) occur for HC at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. Worst case VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. (The VIHvalue at 5.5 V is 3.85 V). The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0 V v

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