1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add (LCC) leadless chip carrier for device types 03 and 04. Make corrections to figure 1 and 2. 87-06-18 M. A. Frye B Add device type 05. Make changes to TABLE I, TABLE II, figure 2, figure 3, and editorial changes throughout drawing. Add ESDS pa
2、ragraph. 88-10-28 M. A. Frye C Update drawing to current requirements. Editorial changes throughout. ksr. 09-12-17 Charles F. Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED CURRENT CAGE CODE IS 67268 REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3
3、 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rick Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, DIG
4、ITAL, NMOS, 64K x 8-BIT UV ERASEABLE PROGRAMMABLE READ ONLY MEMORY(UVEPROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-05-30 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 74933 5962-85135 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E105-10 .Provided by IHSNot fo
5、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-
6、STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-85135 01 Y_ A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.
7、2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Propagation Delay 01 27512-25 64K x 8-bit UVEPROM 250 ns 02 27512-35 64K x 8-bit UVEPROM 350 ns 03 27512-30 64K x 8-bit UVEPROM 300 ns 04 27512-45 64K x 8-bit UVEPROM 450 ns 0
8、5 27512-20 64K x 8-bit UVEPROM 200 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y GDIP1-T28, CDIP2-T28 28 dual-in-line package 1/ Z CQCC1-N32 32 rectangular chip carrier 1/ 1.2.3 Lead fin
9、ish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Storage temperature range - -65C to +150C All input or output voltages 2/ - +6.5 V dc to -0.6 V dc Voltage on pin 24 2/ - +13.5 V dc to -0.6 V dc OE / VPPsupply voltage 2/ - +14.0 V dc to -0.6 V dc Maxim
10、um power dissipation (PD) - 825 mW at 5.5 V dc Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, junction-to-case (JC): - Case outlines Y and Z - See MIl-STD-1835 Junction temperature (TJ) - +200C 1.4 Recommended operating conditions. Case operating temperature range (TC) - -55C t
11、o +125C Supply voltage (VCC) - +4.5 V dc to +5.5 V dc 1 Lid shall be transparent to permit ultraviolet light erasure. 2/ Voltages shall be measured with respect to ground. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING
12、SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent sp
13、ecified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Stan
14、dard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mi
15、l/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in t
16、his document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Pr
17、oduct built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan an
18、d qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN
19、as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A an
20、d herein. 3.2.1 Block diagram. The block diagram shall be as specified on figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.3.1 Unprogrammed or erased devices. The truth table fo
21、r unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 3. When required in groups A, B, or C (see 4.3), the devices shall be programmed by the manufacturer prior to test with a minimum of 50 percent of the total number of gates programmed or to any alt
22、ered item drawing pattern which includes at least 25 percent of the total number of gates programmed. 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. Provided
23、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbo
24、l Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input load current ILIVIN= 5.5 V 1, 2, 3 All 10 A Output leakage current ILOVOUT= 5.5 V 1, 2, 3 All 10 A VCCstandby current ICC1CE = VIH1, 2, 3 All 40 mA VCCcurrent (active) ICC2CE
25、= OE / VPP= VIL1, 2, 3 All 150 mA Input low voltage VIL1, 2, 3 All -0.1 1/ +0.8 V Input high voltage VIH1, 2, 3 All 2.0 VCC+1 1/ V Output low voltage VOLIOL= 2.1 mA 1, 2, 3 All 0.45 V Output high voltage VOHIOH= -400 A, 1, 2, 3 All 2.4 V Input capacitance CIN1VOUT= 0 V (see 4.3.1c) 4 All 7 pF except
26、 OE /VPPOutput capacitance COUT4 All 12 pFOE / VPPinput capacitance CIN24 All 20 pF Address to output delay tACCCE = OE / VPP= VIL2/ 9,10,11 01 250 ns 02 35003 30004 45005 200CE to output delay tCEOE / VPP= VIL2/ 9,10,11 01 250 ns 02 35003 30004 45005 200OE to output delay tOECE = VIL2/ 9,10,11 01 1
27、00 ns 02, 03 12004 15005 75See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234
28、 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max OE / VPPhigh to output float tDF1/ CE = VIL2/ 9,10,11 01 60 ns 02, 03 10504 13005 55Output hold from a
29、ddresses CE or OE whichever occurred first tOH1/ CE = OE / VPP= VIL2/ 9, 10, 11 All 0 ns 1/ May not be tested, but shall be guaranteed to the limits specified in TABLE I 2/ See figures 4 and 5. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
30、characteristics are as specified in TABLE I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in TABLE II. The electrical tests for each subgroup are described in TABLE I. 3.5 Marking. M
31、arking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
32、option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordanc
33、e with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-
34、VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided wit
35、h each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus (DSCC), DSCCs agent, and the acquiring activity retain the opti
36、on to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior t
37、o delivery. 3.10.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.10.2 Programmability of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.5. Prov
38、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 FIGURE 1. Block diagram. Provided by IHSNot for Resale
39、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Case Outlines Y Z Terminal Number Terminal Symbol Terminal Symbol 1 A15NC2 A12A
40、153 A7 124 A6A75 A5 66 A4A57 A3 48 A2A39 A1 210 A0A111 O0 012 O1NC13 O2O014 GND O115 O3O216 O4GND 17 O5NC 18 O6O319 O7 420 CE / PGM O521 A10O622 OE / VPPO723 A11CE / PGM 24 A9A1025 A8OE / VPP26 A13NC27 A14A1128 VCC 929 A830 A1331 A1432 VCCPin Names A0 A15Addresses CE / PGM Chip Enable OE / VPPOutput
41、 Enable / VPPO0 O7Outputs FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234
42、 APR 97 Pins Mode CE OE / VPP A9VCCOutputs Read VILVILX VCCDOUTOutput Disable VILVIHX VCCHigh Z Standby VIHX X VCCHigh Z Intelligent Programming VILVPPX VCCDINProgram Inhibit VIHVPPX VCCHigh Z Intelligent Identifier VILVILVHVCCCode Notes: 1. X can be VIHor VIL2. VH= 12.0 V 0.5 V FIGURE 3. Truth tabl
43、e. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Switching test circuits. Provided by
44、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 Notes: 1. Typical values are for TA= 25C and normal supply vo
45、ltages. 2. This parameter is only sampled and is not 100% tested. 3. OE / VPPmay be delayed up to tCE tOEafter the falling edge of CE. 4. tDFis specified from OE / VPPor CE, whichever occurs first. FIGURE 5. AC waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without l
46、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 NOTES: 1. The input timing reference level is 0.8 V for a VILand 2.0 V for a VIH. 2. tOEand tDFPare characteristics of the devi
47、ce but must be accommodated by the programmer. FIGURE 6. Programming waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85135 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 12 DSCC FORM 2234 APR 97 3.10.3 Verification of erasure or programmability of EPROMS. W
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