DLA SMD-5962-85506 REV E-2009 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to military drawing format. Changes in table I. Add vendor CAGE 01295 to case outlines R and 2. Add case outline 2 to drawing. 87-09-22 N. A. Hauck B Change drawing CAGE code to 67268. Update boilerplate to MIL-PRF-38535 requirements. jak

2、 01-11-26 Thomas M. Hess C Update boilerplate. Add device class V criteria. jak 02-12-23 Thomas M. Hess D Add case outline S. Add table III, delta limits. Editorial changes throughout. jak 03-09-11 Thomas M. Hess E Add leakage current (IOZ) and quiescent supply current (ICC) in table I. Add JEDEC St

3、andard 7-A in paragraphs 2.2 and 4.4.1d. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-11-23 Thomas M. Hess CURRENT CAGE CODE IS 67268 REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Dav

4、id W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, HIGH-

5、SPEED CMOS, OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 86-02-28 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 85506 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E048-10 Provided by IHSNot for ResaleNo reproduction or networking perm

6、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device c

7、lasses Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in

8、the following examples. For device classes M and Q: 85506 01 R A Drawing number Device type (see 1.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 85506 01 V R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase

9、 outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix

10、 A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT245 Octal bus transceiver with three-state outputs

11、, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be

12、included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification

13、to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier Provi

14、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PR

15、F-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage . -0.5 V dc to VCC+0.5 V dc DC output voltage . -0.5 V dc to VCC+0.5 V dc Clamp diode current. 20 mA DC output cu

16、rrent (per pin) 35 mA DC VCCor GND current (per pin) . 70 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) 500 mW 3/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recom

17、mended operating conditions. 2/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Case operating temperature range (TC) . -55C to +125C Input rise or fall time 0 to 500 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels

18、 may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN

19、G SIZE A 85506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent speci

20、fied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standar

21、d Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/q

22、uicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these document

23、s cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 7-A - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 25

24、00 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a spec

25、ific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM p

26、lan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, con

27、struction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connec

28、tions shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figur

29、e 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and pos

30、tirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirem

31、ents shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is

32、 not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shal

33、l be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certific

34、ate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order

35、to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL

36、-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each l

37、ot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review

38、 for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignmen

39、t for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85506 DEFENSE SUPPLY C

40、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C 1/ unless otherwise specified Group A subgroups Limits Unit Min Max High-level output voltage VOHVIN= VIHor VIL, VIH= 2.0

41、 V IOH= -20 A, VIL= 0.8 V VCC= 4.5 V 1, 2, 3 4.4 V VIN= VIHor VIL, VIH= 2.0 V IOH= -6.0 mA, VIL= 0.8 V VCC= 4.5 V 1, 2, 3 3.7 Low-level output voltage VOLVIN= VIHor VIL, VIH= 2.0 V IOL= +20 A, VIL= 0.8 V VCC= 4.5 V 1, 2, 3 0.1 V VIN= VIHor VIL, VIH= 2.0 V IOL= +6.0 mA, VIL= 0.8 V VCC= 4.5 V 1, 2, 3

42、0.4 High-level input voltage VIH2/ VCC= 4.5 V 1, 2, 3 2.0 V Low-level input voltage VIL2/ CC= 4.5 V 1, 2, 3 0.8 V Three-state output leakage current IOZVOUT= VCCor GND VCC= 5.5 V 1, 2, 3 10.0 A Quiescent current ICCVIN= VCCor GND VCC= 5.5 V 1, 2, 3 160 A Additional quiescent supply current ICCVIN= 0

43、.5 V or 2.4 V any one input Other inputs VIN= 0 V or VCCVCC= 5.5 V 1, 2, 3 3.0 mA Input leakage current IINVIN= VCCor GND VCC= 5.5 V 1, 2, 3 1.0 A Input capacitance CIN3/ VIN= 0.0 V, TC= +25C See 4.4.1d 4 10 pF Functional tests See 4.4.1b 7 Propagation delay time, An to Bn or Bn to An tPLH, tPHL4/ C

44、L= 50 pF See figure 4 9 23 ns 10, 11 34 Propagation delay time, output enable, OE to An or Bn tPZH, tPZL4/ CL= 50 pF See figure 4 9 46 ns 10, 11 69 Propagation delay time, output disable, OE to An or Bn tPHZ, tPLZ4/ CL= 50 pF See figure 4 9 40 ns 10, 11 60 Transition time, high-to-low, low-to-high t

45、THL, tTLH5/ CL= 50 pF See figure 4 9 12 ns 10, 11 18 1/ For a power supply of 5.0 V 10%, the worst case output voltages (VOHand VOL) occur for HCT at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. The worst case leakage currents (IINand ICC) occur for CMOS at the highe

46、r voltage and so the 5.5 V values should be used. Power dissipation capacitance (CPD), typically 40 pF, determines the no load dynamic power consumption, PD= CPD VCC2f+ICC VCC; and the no load dynamic current consumption, IS= CPDVCCf+ICC. 2/ Test not required if applied as a forcing function for VOH

47、or VOL. 3/ Does not apply to transceiver I/O ports. 4/ For propagation delay tests, all paths must be tested. 5/ Transition times (tTLH, tTHL) shall be guaranteed, if not tested, to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

48、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85506 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, and 2 Terminal number Terminal symbol 1 DIR 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 GND 11 B8 12 B7 13 B6 14 B5 15 B4 16 B3 17 B2 18 B1 19 OE 20 VCCPin descriptions An (n = 1 to 8) Data inputs/outputs Bn (n = 1 to 8) Data outputs/inputs OE Output enable input (active low) DIR Direction control input FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networ