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本文(DLA SMD-5962-85508 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路》.pdf)为本站会员(周芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-85508 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单块 多路复用器晶体管-晶体管逻辑电路双极数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 01295 for cases E, F, and 2. Convert to military drawing format. Remove vendor 04713. 87-04-01 N. A. Hauck B Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-01-31 Raymond Monnin

2、C Change 3.5 marking paragraph to remove “5962-“. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-17 Thomas M. Hess Current CAGE code is 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6

3、7 8 9 10 11 PMIC N/A PREPARED BY Joe Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCH

4、OTTKY, TTL, MULTIPLEXER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-02-27 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 85508 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E467-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without li

5、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accor

6、dance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 85508 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function

7、as follows: Device type Generic number Circuit function 01 54LS353 Dual 4-line to 1-line data selector/ multiplexer with 3-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16

8、or GDIP2-T16 16 Dual-in-line F GDFP2-F16 or GDFP3-F16 16 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range . -1.5 V dc at -

9、18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 1/. 77 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply volta

10、ge range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH). 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C Maximum high-level output current (IOH) . -1 mA Maximum low-level output current (IOL) . 4 mA _ 1

11、/ Must withstand the added PDdue to short circuit test (e.g. IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM

12、2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation

13、or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENS

14、E HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue

15、, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specifi

16、c exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (

17、QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as

18、documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-

19、38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2

20、 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking

21、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characte

22、ristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking s

23、hall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-P

24、RF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be l

25、isted as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7

26、 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9

27、 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or

28、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise

29、specified Group A subgroups Device type Limits Unit Min MaxHigh level output voltage VOH VCC= 4.5 V, VIN= 0.7 V or 2.0 V, IOH= -1 mA 1, 2, 3 All 2.4 V Low level output voltage VOL VCC= 4.5 V, VIN= 0.7 V or 2.0 V, IOL= 4 mA 1, 2, 3 All 0.4 V Input clamp voltage VI C VCC= 4.5 V, IIN= -18 mA, TC= +25C

30、1 All -1.5 V High level input current II H1 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 100 A II H2 VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.4 mA Short circuit output current IOS VCC= 5.5 V, VOUT= GND 1/ 1, 2, 3 All -15 -130 mA Off-state output

31、current, high voltage applied IOZH VCC= 5.5 V, VIN= 2.0 V, VOUT = 2.7 V 1, 2, 3 All 20 A Off-state output current, low voltage applied IOZL VCC= 5.5 V, VIN= 2.0 V, VOUT= 0.4 V 1, 2, 3 All -20 A Supply current ICC1 VCC= 5.5 V 2/ 1, 2, 3 All 12 mA ICC2 VCC= 5.5 V 3/ 1, 2, 3 All 14 mA Functional tests

32、See 4.3.1c 7 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I

33、. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxPropagation delay time, data to Y tPLH1 VCC= 5.0 V, RL= 2k 5%, 9 All 30 ns CL= 50 pF 10% 10, 11 All 45 ns tPHL1 9 All 25 ns 10, 11 Al

34、l 38 ns Propagation delay time, select to Y tPLH2 9 All 50 ns 10, 11 All 75 ns tPHL2 9 All 37 ns 10, 11 All 56 ns Output enable time, output control to Y tPZH 9 All 46 ns 10, 11 All 69 ns tPZL 9 All 28 ns 10, 11 All 42 ns Output disable time, output control to Y tPHZ 9 All 48 ns 10, 11 All 69 ns tPL

35、Z 9 All 35 ns 10, 11 All 48 ns 1/ Not more than one output will be tested at one time and the duration of the test condition shall not exceed 1 second. 2/ All inputs grounded. 3/ Output control at 4.5 V, all other inputs grounded. Provided by IHSNot for ResaleNo reproduction or networking permitted

36、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols 1 1 G NC 2 B 1 G 3 1C3 B 4 1C2 1C3 5 1C1 1C2 6 1C0

37、NC 7 1Y 1C1 8 GND 1C0 9 2Y 1Y 10 2C0 GND11 2C1NC 12 2C2 2Y 13 2C32C0 14 A2C115 2 G2C2 16 VCCNC 17 - - - 2C318 - - - A19 - - - 2 G20 - - - VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN

38、G SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Select inputs Data inputs Output control Output B A C0 C1 C2 C3 G Y X X X X X X H Z L L L X X X L H L L H X X X L L L H X L X X L H L H X H X X L L H L X X L X L H H L X X H X L L H

39、 H X X X L L H H H X X X H L L Select inputs A and B are common to both sections. H = High voltage level L = Low voltage level Z = High impedance X = Irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

40、UIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFEN

41、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004

42、of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revisio

43、n level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim

44、 and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-8

45、83, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * S

46、ubgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall ap

47、ply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

48、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or ac

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