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本文(DLA SMD-5962-86012 REV D-2011 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 7-STAGE RIPPLE COUNTER MONOLITHIC SILICON.pdf)为本站会员(王申宇)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-86012 REV D-2011 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 7-STAGE RIPPLE COUNTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added vendor CAGE 01295. Converted to military drawing format. - jej 87-11-03 Michael A. Frye B Update boilerplate to MIL-PRF-38535 requirements. jak 01-11-21 Thomas M. Hess C Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requ

2、irements. LTG 05-01-26 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-09-26 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY David W

3、. Queenan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL

4、, HIGH-SPEED CMOS, 7-STAGE RIPPLE COUNTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 86-01-30 REVISION LEVEL D SIZE A CAGE CODE 14933 86012 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E491-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

5、CIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2

6、Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86012 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Cir

7、cuit function 01 54HC4024 7-stage ripple counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead

8、finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage . -0.5 V dc to VCC+0.5 V dc DC output voltage . -0.5 V dc to VCC+0.5 V dc Clamp diode current. 20 mA DC output current (per

9、pin) 25 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1/ Stresses above the absol

10、ute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full spec

11、ified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3

12、990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) . -55C to +125C Input rise or fall time: VCC= 2.0 V 0 to 1,000 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns Minimum rec

13、overy time, reset to clock (trec): TC= +25C: VCC= 2.0 V 100 ns VCC= 4.5 V 20 ns VCC= 6.0 V 17 ns TC= -55C to 125C: VCC= 2.0 V 150 ns VCC= 4.5 V 50 ns VCC= 6.0 V 26 ns Minimum reset pulse width (tw1): TC= +25C: VCC= 2.0 V 90 ns VCC= 4.5 V 16 ns VCC= 6.0 V 14 ns TC= -55C to 125C: VCC= 2.0 V 120 ns VCC

14、= 4.5 V 24 ns VCC= 6.0 V 20 ns Minimum clock pulse width (tw2) TC= +25C: VCC= 2.0 V 90 ns VCC= 4.5 V 18 ns VCC= 6.0 V 15 ns TC= -55C to 125C: VCC= 2.0 V 135 ns VCC= 4.5 V 27 ns VCC= 6.0 V 23 ns Maximum clock frequency (fMAX): TC= +25C: VCC= 2.0 V 5 MHz VCC= 4.5 V 25 MHz VCC= 6.0 V 29 MHz TC= -55C to

15、 125C: VCC= 2.0 V 3.4 MHz VCC= 4.5 V 17 MHz VCC= 6.0 V 20 MHz Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2.

16、 APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. D

17、EPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MI

18、L-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094

19、.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard

20、 for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event

21、 of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individu

22、al item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted t

23、ransitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requi

24、rements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constr

25、uction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specifie

26、d on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012

27、DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.2.5 Counting sequence. The counting sequence shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3

28、 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups

29、 specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK

30、-103 (see 6.6 herein). 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to id

31、entify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior

32、 to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each l

33、ot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity reta

34、in the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

35、ING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C 1/ unless otherwise specified Group A subgroups Limits Unit Min Max High-level output voltage VOH

36、VIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 1, 2, 3 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 1, 2, 3 5.2 Low-level output voltage VOLVIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHor V

37、ILIOL= +4.0 mA VCC= 4.5 V 1, 2, 3 0.4 VIN= VIHor VILIOL= +5.2 mA VCC= 6.0 V 1, 2, 3 0.4 High-level input voltage VIH2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low-level input voltage VIL2/ VCC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINVIN= 0.0 V, TC= +25

38、C See 4.3.1c 4 10 pF Quiescent current ICCVIN= VCCor GND VCC= 6.0 V 1, 2, 3 160 A Input leakage current IINVIN= VCCor GND VCC= 6.0 V 1, 2, 3 1.0 A Functional tests See 4.3.1d 7 Propagation delay time, CLK to Q1 tPLH1, tPHL13/ CL= 50 pF See figure 4 VCC= 2.0 V 9 210 ns 10, 11 315 VCC= 4.5 V 9 4210, 1

39、1 63 VCC= 6.0 V 9 3610, 11 54 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TAB

40、LE I. Electrical performance characteristics - Continued. Test Symbol Test conditions -55C TC +125C 1/ unless otherwise specified Group A subgroups Limits Unit Min Max Propagation delay time, CLR to Qn tPHL23/ CL= 50 pF See figure 4 VCC= 2.0 V 9 210 ns 10, 11 315 VCC= 4.5 V 9 42 10, 11 63 VCC= 6.0 V

41、 9 36 10, 11 54 Transition time high-to-low, low-to-high tTHL, tTLH4/ CL= 50 pF See figure 4 VCC= 2.0 V 9 75 ns 10, 11 110 VCC= 4.5 V 9 15 10, 11 22 VCC= 6.0 V 9 13 10, 11 19 1/ For a power supply of 5.0 V 10% the worst case output voltage (VOHand VOL) occur for HC at 4.5 V. Thus, the 4.5 V values s

42、hould be used when designing with this supply. Worst case VINand VILoccur at VCC= 5.5 V and 4.5 V, respectively. (The VIHvalue at VCC= 5.5 V is 3.85 V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage so the 6.0 V values should be used. 2/ Test not required if

43、 applied as a forcing function for VOHor VOL. 3/ For propagation delay tests, all paths must be tested. 4/ Transition times (tTLH, tTHL) shall be guaranteed, if not tested, to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

44、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline C 2 Terminal number Terminal symbol 1 CLK NC 2 CLR CLK3 Q7 CLR 4 Q6 Q7 5 Q5 NC 6 Q4 Q6 7 GND NC 8 NC Q5 9 Q3 Q4 10 NC GND 11 Q2

45、 NC 12 Q1 NC13 NC Q3 14 VCCNC 15 - - - NC 16 - - - Q2 17 - - - NC 18 - - - Q1 19 - - - NC 20 - - - VCCNC = No internal connection Pin description Qn (n = 0 to 9) Data outputs CLR Clear (reset) input CLK Clock pulse FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or netwo

46、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 CLK CLR Output state L No change L Advance to next state X H All outputs are low H = High level voltage L = Low level

47、 voltage = Low-to-high clock transition = High-to-low clock transition X = Irrelevant FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COL

48、UMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 FIGURE 4. Counting sequence. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86012 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 11 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF minimum or equivalent (includes test jig and probe capacitance). 2. Phase relationships between wavef

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