DLA SMD-5962-86071 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL SHIFT REGISTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor 07263. Change PDmax from 275 mW to 303 mW. Change ICCfrom 50 mA to 55 mA. Change footnote 2, page 5. 87-05-26 N. A. Hauck B Changes IAW NOR 5962-R153-93. Table I, add footnote 3/ in maximum clock frequency, symbol column. Table I, add

2、footnote at the end of table, “3/ fMAX, if not tested, shall be guaranteed to the specified limits.“ Editorial changes throughout. - tvn 93-05-05 Monica L. Poelking C Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-02-27 Raymond Monnin D Update dra

3、wing to current requirements. Editorial changes throughout. - gap 09-04-02 Joseph D. Rodenbeck CURRENT CAGE CODE IS 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY David W. Que

4、enan CHECKED BY D. A. DiCenzo DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Charles Reusing STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-02-04 MICROC

5、IRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, SHIFT REGISTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 5962-86071 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E054-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

6、MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3853

7、5, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86071 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device

8、 type Generic number Circuit function 01 54F164 8-bit serial-in parallel-out shift register 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or GDIP2-T14 14 Dual-in-line package D GD

9、FP1-F14 or GDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range -1.2 V dc at -18 mA to +7.0 V dc Storage temperature

10、range -65C to +150C Maximum power dissipation (PD) per device 1/ 303 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5

11、 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C Setup time, high or low, A or B to CP . 7 ns minimum Hold time, high or low, A or B to CP 1 ns minimum Clock pulse width high . 4 ns mi

12、nimum Clock pulse width low 7 ns minimum MR pulse width low 7 ns minimum Recovery time, MR to CP . 9 ns minimum _ 1/ Must withstand the added PDdue to short circuit test (e.g. IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

13、T DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the

14、 extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test M

15、ethod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.da

16、ps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Not

17、hing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified h

18、erein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved progra

19、m plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect

20、 the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appe

21、ndix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram sha

22、ll be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test

23、requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS

24、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the e

25、ntire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compli

26、ance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of s

27、upply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A c

28、ertificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC,

29、DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures

30、shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-ST

31、D-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation,

32、as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the man

33、ufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charact

34、eristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOH VCC= 4.5 V, IOH= -1 mA, VIN= 0.8 V or 2.0 V 1, 2, 3 2.4 V Low level output voltage VOL VCC= 4.5 V, IOL= 20 mA, VIN= 0.8 V or 2.0 V 1, 2, 3 0.5 V Input clamp vo

35、ltage VI C VCC= 4.5 V, IIH= -18 mA, TC= +25C 1, 2, 3 -1.2 V High level input current II H1 VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 100 A II H2 VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 -0.6 mA Short circuit output current IOS VCC= 5.5 V, VOUTS= 0.0 V 1/ 1,

36、2, 3 -60 -150 mA Supply current ICC VCC= 5.5 V, All outputs open 2/ 1, 2, 3 55 mA Functional tests See 4.3.1c 7 fMAX 3/ 9 80 MHz Maximum clock frequency 10, 11 60 MHz tPLH1 VCC= 5.0 V, RL= 500 5%, CL= 50 pF 10% 9 8 ns Propagation delay time, CP to Qn10, 11 11 ns tPHL1 9 11 ns 10, 11 13 ns tPHL2 9 13

37、 ns Propagation delay time, MR to Qn10, 11 17 ns 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one second. 2/ ICCis measured with inputs conditioned so that outputs should remain low. 3/ fMAXif not tested, shall be guarante

38、ed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type

39、 01 Case outlines C and D 2 Terminal number Terminal symbols 1 Dsa NC 2 Dsb Dsa 3 Q0Dsb 4 Q1Q05 Q2NC 6 Q3Q17 GND NC 8 CP Q29 MR Q310 Q4GND 11 Q5 NC12 Q6CP 13 Q7 MR14 VCCQ4 15 NC16 Q517 NC18 Q619 Q720 VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permi

40、tted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs Operating Mode MR CP Dsa Dsb Q0Q1 - Q7Reset (Clear) L X X X L L - L H l l L q0 - q6 Shift H l h L q

41、0 - q6 H h l L q0 - q6 H h h H q0 - q6 H = HIGH voltage level. h = HIGH voltage level one setup time prior to the LOW to HIGH clock transition. L = LOW voltage level. l = LOW voltage level one setup time prior to the LOW to HIGH clock transition. q = Lower case letters indicate the state of the refe

42、renced input (or output) one setup time prior to the LOW to HIGH clock transition. X = Dont care. = LOW to HIGH clock transition. FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR

43、AWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method

44、 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspectio

45、n shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall b

46、e omitted. c. Subgroup 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit

47、shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

48、method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86071 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1