DLA SMD-5962-86706 REV C-2010 MICROCIRCUIT MEMORY DIGITAL BIPOLAR 1K x 8-bit REGISTERED PROM WITH PROGRAMMABLE INITIALIZE MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add one vendor CAGE 18324. Change parameters in table I. Add program procedure B. Update vendors part numbers. Change screening and group A inspection. 87-06-25 N. A. Hauck B Changes in accordance with NOR 5962-R083-96. glg 96-03-22 Michael A. Fr

2、ye C Update drawing to current requirements. Editorial changes throughout. ksr. 10-03-15 Charles F. Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED CURRENT CAGE CODE IS 67268 REV SHET REV C C C C C SHEET 15 16 17 18 19 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3

3、 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D.A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, MEMORY, DIGI

4、TAL, BIPOLAR, 1K x 8-bit, REGISTERED PROM WITH PROGRAMMABLE INITIALIZE, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-10-09 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 5962-86706 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E226-10 .Provided by IHSNot for Res

5、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86706 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-8

6、83 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86706 01 L_ A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 D

7、evice type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 27S35 1024 X 8-bit registered PROM with programmable INITIALIZE 45 ns 82HS187A (Asynchronous) 02 27S35A 1024 X 8-bit registered PROM with programmable INITIALIZE 40

8、ns 82HS187A (Asynchronous) 03 27S37 1024 X 8-bit registered PROM with programmable INITIALIZE 45 ns 82HS189A (Synchronous) 04 27S37A 1024 X 8-bit registered PROM with programmable INITIALIZE 40ns 82HS189A (Synchronous) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and

9、as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24, CDIP4-T24 24 dual-in-line package K GDFP2-F24, CDFP3-F24 24 flat package 3 CQCC1-N28 28 square chip carrier X CQCC1-N32 32 rectangular chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-385

10、35, appendix A. 1.3 Absolute maximum ratings. Supply voltage range - -0.5 V dc to +7.0 V dc DC input voltage - -0.5 V dc to +5.5 V dc DC voltage applied to outputs- -0.5 V dc to +5.5 V dc DC input current - -30 mA to +5 mA Storage temperature range - -65C to +150C Maximum power dissipation (PD) 1/ -

11、 1.02 W Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, junction-to-case (JC): 2/ Case outlines K, X, 3, and L - See MIl-STD-1835 Junction temperature (TJ) - 175C DC voltage applied to outputs during programming - 21 V DC current into outputs during programming (maximum duration

12、 1 s) 250 mA 1 Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ Heat sinking is recommended to reduce the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86706 DEFENS

13、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) - +4.5 V dc minimum to +5.5 V dc maximum Minimum high-level Input high voltage (VIH) - 2.0 V dc Maximum low-level Input low voltage (VIL) - 0.8

14、 V dc Case operating temperature range (TC) - -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of thes

15、e documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electron

16、ic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk

17、, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulati

18、ons unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Ma

19、nufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-3853

20、5. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in acco

21、rdance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections

22、 shall be as specified on figure 1. 3.2.2 Logic diagrams. The logic diagrams shall be as specified on figure 2. 3.2.3 Truth tables. 3.2.3.1 Unprogrammed devices. Testing to the applicable truth table, or alternate testing as specified in 4.3.1.d, shall be used for unprogrammed devices for contracts

23、involving no altered item drawing. When testing is required per 4.3 herein, the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 p

24、ercent of the total number of bits programmed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86706 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.2

25、.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an altered item drawing. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

26、 characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking.

27、Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the

28、 option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordan

29、ce with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC

30、-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided wi

31、th each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus (DSCC), DSCCs agent, and the acquiring activity retain the opt

32、ion to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the manufacturer or the user t

33、o result in a wide variety of PROM configurations; two processing options are provided for selection, using an altered item drawing. 3.10.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 3.2.3.1 and table II. It is recommended that users

34、perform subgroups 7 and 9 after programming to verify the specific program confiugration. 3.10.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing shall be satisfied by the manu

35、facturer prior to delivery. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86706 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical pe

36、rformance characteristics. Test Symbol Conditions 1/ -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA, 1, 2, 3 All 2.4 V IN= VIHor VILOutput low voltage VOLVCC= 4.5 V, IOL= 16.0 mA, 1, 2, 3 All 0

37、.50 V IN= VIHor VILInput high voltage 2/ 3/ VIH1, 2, 3 All 2.0 V Input low voltage 2/ 3/ VIL1, 2, 3 All 0.8 V Input clamp voltage VICVCC= 4.5 V, IIN= -18.0 mA 1, 2, 3 All -1.2 V Input low current IILVCC= 5.5 V, VIN= 0.45 V 1, 2, 3 All -250 A Input high current IIHVCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 5

38、0 A Output short circuit 4/ ISCVCC= 5.5 V, 1, 2, 3 All -15 -90 mA current VOUT= 0 V Power supply current ICCVCC= 5.5 V, All inputs = GND 1, 2, 3 All 185 mA Output leakage current ICEXVCC= 5.5 V VO= 5.5 V 1, 2, 3 All 60 A VG = 2.4 V VO= 0.4 V -60 Functional tests See 4.3.1e 7, 8A, 8B All Input capaci

39、tance 5/ CINVIN= 2.0 V, TA= +25C, f = 1 MHz, see 4.3.1c 4 All 10.0 pF Output capacitance 5/ COUT4 All 13.0 pF Address to K high, setup time TAVKH See figure 3 6/ 9, 10, 11 02, 04 40 ns 01, 03 45Address to K high, hold time TKHAX 9, 10, 11 All 5 ns Delay from K high to output valid, for initially act

40、ive outputs (high or low) TKHQV1 9, 10, 11 02, 04 25 ns 01, 03 30K pulse width (high or low)TKHKL, TKLKH 9, 10, 11 All 25 ns GS to K high setup time TGSVKH 9, 10, 11 All 15 ns GS to K high hold time TKHGSX 9, 10, 11 All 5.0 ns Delay from I low to output valid (high or low) 7/ TILQV 9, 10, 11 01 40 n

41、s 02 35 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86706 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. El

42、ectrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Asynchronous I recovery to K high 7/ TIHKH See figure 3 6/ 9, 10, 11 01, 02 25 ns Asynchronous I pulse width (low) 7/

43、TILIH 9, 10, 11 01, 02 30 ns IS to K high setup time 8/ TISVKH 9, 10, 11 03 35 ns 04 30 IS to K high hold time 7/ TKHISX 9, 10, 11 03, 04 5 ns Delay from K high to output valid for initially high-Z outputs TKHQV2 9, 10, 11 01, 03 35 ns 02, 04 30 Delay from G low to output valid (high or low) TGLQV 9

44、, 10, 11 01, 03 35 ns 02, 04 30 Delay from K high to output high-Z 9/ TKHQZ 9, 10, 11 01, 03 35 ns 02, 04 30 Delay from G high to output high-Z 9/ TGHQZ 9, 10, 11 01, 03 35 ns 02, 04 30 1/ All voltages given are referenced to the test system ground for ac and functional testing. Voltages given for d

45、c testing are referenced to the microcircuit ground terminal. 2/ These are absolute voltages with respect to device ground pin and include all overshoots due to system and/or tester noise. Do not attempt to test these values without suitable equipment. 3/ VILand VIHthreshold levels are guaranteed fo

46、r 0.8 V and 2.0 V respectively during dc testing. For ac and functional testing VILand VIHlimits of -0.2 V and 4.0 V are implemented to allow for noise margins needed in a high speed, automated test equipment environment, when fast switching of multiple I/Os is encountered. 4/ Only one output should be shorted at a time. Duration of the short circuit should not be more than one second. 5/ These parameters are not 100 percent tested, but are evaluated at initial characterization and after any design or process change which may affect the capacitance. 6/ AC test