DLA SMD-5962-86834 REV C-2012 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL QUAD NONINVERTING BUS TRANSCEIVERS WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate. Add QD certification. Change code ident. no. to 67268. Editorial changes throughout. -les 00-06-22 Raymond Monnin B Update to current requirements. Editorial changes throughout. - gap 06-01-05 Raymond Monnin C Update drawing a

2、s part of 5 year review. - jt 12-12-10 C. SAFFLE CURRENT CAGE CODE 67268 The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joe A. Kerby DLA LAND AND MARITIME COLUMBUS, OHIO 43218

3、-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauch MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTKY TTL, QUAD NONINVERTING BUS TRANSCEIVERS WITH

4、THREE-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-05-08 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-86834 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E074-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

5、DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Par

6、t or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86834 01 C X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Ci

7、rcuit function 01 54F243 Quad noninverting bus transceivers, with three-state outputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F

8、14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc Storage temperature rang

9、e (TSTG) . -65C to +150C Maximum power dissipation (PD) . 495 mW 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 2/ 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5

10、V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Normalized fanout (each output): Low-level logic 33 maximum High-level logic . 50 maximum Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as V

11、CC x ICC, and must withstand the added PD due to short circuit test; e.g., IOS. 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networ

12、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stan

13、dards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification fo

14、r. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of

15、these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited her

16、ein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A f

17、or non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product i

18、n accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function

19、of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication

20、requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The ca

21、se outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical

22、 performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

23、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are des

24、cribed in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limit

25、ations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML

26、“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturers QM plan, the “QD” certification mark shall be used in place of the “Q“ or “QML“ certification mark. 3

27、.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of suppl

28、y shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this draw

29、ing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers

30、facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall

31、be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the m

32、anufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.

33、(2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted withou

34、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C Group A subgroups Limits Unit unless otherw

35、ise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -3 mA, VIL= 0.8 V, VIH= 2.0 mA 1, 2, 3 2.4 V VOH1VCC= 4.5 V, IOH= -12 mA, VIL= 0.8 V, VIH= 2.0 mA 1, 2, 3 2.0 V Low level output voltage VOLVCC= 4.5 V, IOL= 48 mA, VIL= 0.8 V, VIH= 2.0 mA 1, 2, 3 0.55 V Input clamp voltage VIC II= -

36、18 mA, TC= +25C,VCC= 0.0 V 1 -1.2 V High-level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIH= 7.0 V enable inputs only 1, 2, 3 100 A IIH3 VCC= 5.5 V, VIH= 5.5 V data inputs only 1, 2, 3 1.0 mA Low-level input current IIL1 VCC= 5.5 V, VIL= 0.5 V E BA input 1, 2, 3 -0.3 -1

37、.0 mA IIL2 VCC= 5.5 V, VIL= 0.5 V EBA input 1, 2, 3 -.06 -1.6 mA Short-circuit output current IOS VCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 -100 -325 mA Low-level input, off-state low-output current IIOZL VCC= 5.5 V, VIOZL= 0.5 V 1, 2, 3 -0.3 -1.6 mA High-level input, off-state low-output current IIOZH VCC

38、= 5.5 V, VIOZH= 2.7 V 1, 2, 3 70 A Supply current, high ICCH VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 80 mA Supply current, low ICCL VCC= 5.5 V, VIN= 0.0 V 1, 2, 3 92 mA Supply current, disable ICCZ VCC= 5.5 V, VIN= Open 1, 2, 3 90 mA Propagation delay time, low-to-high level Bn to An tPLH1 VCC= 5.5 V, CL= 50

39、 pF 10% 2/ RL= 500 5% 9, 10, 11 6.5 ns An to Bn tPLH2 9, 10, 11 6.5 ns Propagation delay time, low-to-high level Bn to An tPHL1 9, 10, 11 8.5 ns An to Bn tPHL2 9, 10, 11 8.5 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

40、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min

41、 Max Propagation delay time, low level to off-state E, E , OE , to An tPLZ1VCC= 5.5 V, CL= 50 pF 10% 2/ RL= 500 5% 9, 10, 11 8.5 ns E, E , OE , to Bn tPLZ29, 10, 11 8.5 ns Propagation delay time, high level to off-state E, E , OE , to An tPHZ19, 10, 11 7.5 ns E, E , OE , to Bn tPHZ29, 10, 11 7.5 ns

42、Propagation delay time, off- state to low level E, E , OE , to An tPZL19, 10, 11 10.5 ns E, E , OE , to Bn tPZL29, 10, 11 10.5 ns Propagation delay time, off- state to high level E, E , OE , to An tPZH19, 10, 11 8.0 ns E, E , OE , to Bn tPZH29, 10, 11 8.0 ns 1/ Not more than one output should be sho

43、rted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet t

44、he switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device

45、 type 01 Case Outline C and D 2 Terminal Number Terminal Symbol Terminal Symbol 1 E AB NC 2 NC E AB 3 A0 NC 4 A1 A0 5 A2 NC 6 A3 A1 7 GND NC 8 B3 A2 9 B2 A3 10 B1 GND 11 B0NC12 NCB3 13 EBAB214 VCCB1 15 - - - NC 16 - - - B0 17 - - - NC 18 - - - NC 19 - - - EBA 20 - - - VCC FIGURE 1. Terminal connecti

46、ons. Inputs Outputs E AB EBA An Bn Bn An L L H - H - L L L - L - H H - H - H H H - L - L H L X - Z - H L - X - Z H = High voltage level. L = Low voltage level. Z = High impedance state. X = Irrelevant. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted withou

47、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

48、CROCIRCUIT DRAWING SIZE A 5962-86834 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to