DLA SMD-5962-86836 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL OR GATES MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change tPLH, tPHL, and footnotes in table I. Add figure 3. Editorial changes throughout. 88-04-19 M. A. Frye B Changes IAW NOR 5962-R098-92. -pn 92-03-25 Monica L. Poelking C Update to reflect latest changes in format and requirements. Editorial

2、changes throughout. -les 01-10-30 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-01-09 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 1

3、0 PMIC N/A PREPARED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW

4、POWER SCHOTTKY TTL, OR GATES, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-08-17 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-86836 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E360-08 Provided by IHSNot for ResaleNo reproduction or networking permitted

5、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microci

6、rcuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86836 01 D X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify t

7、he circuit function as follows: Device type Generic number Circuit function 01 54ALS32 Quadruple, two-input, positive OR gates 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style D GDFP1-F14 or GDF

8、P2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature

9、range . -65C to +150C Maximum power dissipation (PD) per device 1/ 26.95 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum t

10、o 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL): TC= +125C . 0.7 V dc TC= -55C 0.8 V dc TC= +25C . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added

11、 PDdue to short circuit test (e.g. IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLIC

12、ABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTME

13、NT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-

14、103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 O

15、rder of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1

16、 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a man

17、ufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may

18、 make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow op

19、tion is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal

20、connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on

21、 figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be

22、 the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218

23、-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number

24、is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” sh

25、all be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103

26、 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conform

27、ance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the

28、acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordanc

29、e with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condi

30、tion A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in acc

31、ordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided b

32、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol

33、 Conditions -55C TC+125C unless otherwise specified Group A subgroups Limits Unit Min Max High level output voltage VOHVIL= 0.8 V 1, 3 2.5 V VIH= 2.0 V, VCC= 4.5 V, IOH= -0.4 mA 3/ 4/ VIL= 0.7 V 2 Low level output voltage VOLVIL= 0.8 V 1, 3 0.4 V VIH= 2.0 V, VCC= 4.5 V, IOL= 4.0 mA 5/ 4/ VIL= 0.7 V

34、2 Input clamp voltage VI CVCC= 4.5 V, IIH= -18 mA 1, 2, 3 -1.5 V High level input current II H1 VCC= 5.5 V, VIN= 2.7 V, All other inputs = 0.0 V 1, 2, 3 20 A II H2 VCC= 5.5 V, VIN= 7.0 V, All other inputs = 0.0 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V, All other inputs = 4.5

35、 V 1, 2, 3 -0.1 mA Output current IOVCC= 5.5 V, VOUT= 2.25 V 6/ 1, 2, 3 -20 -112 mA High level supply current ICCHVCC= 5.5 V, VIN 4.5 V (All inputs) 1, 2, 3 4.0 mA Low level supply current ICCL VCC = 5.5 V, VIN 0.4 V (All inputs) 1, 2, 3 4.9 mA Functional tests See 4.3.1c 7/ 7, 8 tPHL 9, 10, 11 3 14

36、.5 ns Propagation delay time, A, B to Y tPLH VCC= 4.5 V to 5.5 V, CL= 50 pF, RL= 500 8/ See figure 3 9, 10, 11 3 16 ns 1/ Unused inputs that do not directly control the pin under test must be 2.5 V or 0.4 V. 2/ Unused inputs shall not exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 3

37、/ One input to gate under test must be = VIH, the other inputs shall be 0.7 V. 4/ All outputs must be tested. In the case where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input

38、. 5/ One input to gate under test must be = VIL, the other inputs shall be 0.7 V. 6/ The output conditions have been chosen to produce a current that closely approximates one-half of the true short circuit output current, IO. Not more than one output will be tested at a time and the duration of the

39、test condition shall not exceed one second. 7/ Functional tests shall be conducted at input test conditions of 0.0 V VIL VOLand VOH VIH VCC. 8/ The propagation delay limits are based on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or networkin

40、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Case outlines D 2 Terminal number Terminal symbols 1 1A NC 2 1B 1A 3 1Y 1B 4 2A 1Y 5 2B NC6 2Y 2A 7 GND NC

41、8 3Y 2B 9 3A 2Y 10 3B GND11 4Y NC 12 4A 3Y13 4B 3A 14 VCC 3B15 NC16 4Y 17 NC18 4A 19 4B 20 VCC FIGURE 1. Terminal connections. Inputs Output A B Y H X H X H H L L L H = High voltage level L = Low voltage level X = Irelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or netwo

42、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without l

43、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86836 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics: PRR 10 MHz, duty cycle 5

44、0%, tr= tf= 3 ns 1 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8683

45、6 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final ele

46、ctrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall

47、be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.

48、c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,