DLA SMD-5962-86890 REV D-2012 MICROCIRCUIT DIGITAL HIGH SPEED CMOS HEX SCHMITT TRIGGER TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outlines D and 2 to device type 01. Add vendor CAGE 18324 to case outlines C, D, and 2. Editorial changes throughout. Change to current CAGE code. Change to table I, VOH, VOL, VH, VT, and VT-. 88-11-22 Michael A. Frye B Delete vendor CAG

2、E 18324. Change vendor CAGE 18714 to 34371. Inactivate case outlines D and 2 for new design. Editorial changes throughout. 90-10-11 Michael A. Frye C Add test circuit and notes to figure 4, Switching waveforms and test circuit. Update the boilerplate to current requirements as specified in MIL-PRF-3

3、8535. Editorial changes throughout jak. 06-02-17 Thomas M. Hess D Update test condition of high and low level output voltage (VOHand VOL) to table I. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-07-25 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV

4、 STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY James E. Nicklaus DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT O

5、F DEFENSE AMSC N/A CHECKED BY Raymond Monnin APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, HEX SCHMITT TRIGGER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-02-06 REVISION LEVEL D SIZE A CAGE CODE 14933 5962-86890 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E4

6、22-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device req

7、uirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86890 01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead f

8、inish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT14 Hex inverting Schmitt trigger, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows

9、: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/

10、 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) 20 mA DC output current (per pin) (IOUT) 25 mA DC VCCor GND current (per pin) (ICC, IGND) 50

11、mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 500 mW 4/ Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) .

12、+4.5 V dc minimum to +5.5 V dc maximum Input voltage range (VIN) . 0.0 V dc to VCCOutput voltage range (VOUT) 0.0 V dc to VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 4.5 V 0 to 500 ns _ 1/ Stresses above the absolute maximum rating may cause permanen

13、t damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature r

14、ange of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSC

15、C FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solici

16、tation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF

17、 DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphi

18、a, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard

19、No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of preceden

20、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requiremen

21、ts. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who ha

22、s been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modificati

23、ons to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.

24、2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall

25、be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provide

26、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise speci

27、fied herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup

28、are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to spac

29、e limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“

30、or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The cert

31、ificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as r

32、equired in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Marit

33、ime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking

34、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specif

35、ied VCCGroup A subgroups Limits Unit Min Max High level output voltage VOHVIN= VT+or VT-IOH= -20 A 4.5 V 1, 2, 3 4.4 V IOH= -4 mA 3.7 Low level output voltage VOLVIN= VT+or VT-IOL= +20 A 4.5 V 1, 2, 3 0.1 V IOL= +4 mA 0.4 Hysteresis voltage VH2/ 4.5 V 1, 2, 3 0.4 1.4 V Positive-going threshold volta

36、ge VT+2/ 4.5 V 1, 2, 3 1.2 1.9 V Negative-going threshold voltage VT-2/ 4.5 V 1, 2, 3 0.5 1.2 V Input capacitance CINSee 4.3.1c, TC= +25C GND 4 10 pF Quiescent supply current ICCVIN= VCCor GND 5.5 V 1, 2, 3 40 A Additional quiescent supply current, TTL input levels ICC3/ Any one input, VIN= 2.4 V, o

37、ther inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 1, 2, 3 3.0 mA Input leakage current IINVIN= VCCor GND 5.5 V 1, 2, 3 1 A Functional tests See 4.3.1d 7, 8 Propagation delay time, An to Yn tPHL, tPLHCL= 50 pF See figure 4 4.5 V 9 38 ns 10, 11 57 Output transition time tTLH, tTHL4/ 4.5 V 9 15 ns 10, 11 2

38、2 1/ For power supply of 5 V 10 percent, the worst case output voltages (VOHand VOL) occur for HCT at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. Worst cases VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. 2/ VT+, and VT-, and VHtests are not required if appl

39、ied as forcing functions for VOHor VOLtests. 3/ Guaranteed, if not tested, to the limits specified in table I. 4/ Transition times (tTLH, tTHL), if not tested, shall be guaranteed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

40、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A0 Y0 A1 Y1 A2 Y2 GND

41、 Y3 A3 Y4 A4 Y5 A5 VCC- - - - - - - - - - - - - - - - - - NC A0 Y0 A1 NC Y1 NC A2 Y2 GND NC Y3 A3 Y4 NC A4 NC Y5 A5 VCCNC = No internal connection FIGURE 1. Terminal connections. Inputs Outputs An Yn L H H L L = Low voltage level H = High voltage level FIGURE 2. Truth table. Provided by IHSNot for R

42、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. NOTES: 1. CL = 50 pF or equivalent (includes test jig and

43、probe capacitance). 2. Input signal from pulse generator: VIN= 0.0 V to 3.0 V; PRR 1 MHz; ZO= 50; tr= 6.0 ns; tf= 6.0 ns; trand tfshall be measured from 0.3 V to 2.7 V and from 2.7 V to 0.3 V, respectively; duty cycle = 50 percent. 3. The outputs are measured one at a time with one transition per me

44、asurement. FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86890 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97

45、4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The f

46、ollowing additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The

47、 test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim elect

48、rical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1, 2, 3, 9 1/ Group A test requirements (method 5005) 1, 2, 3, 4, 7, 8, 9, 10, 11 2/ Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 1/ PDA applies to subgroup 1. 2/ Subgroups 10 and 11, if not tested, shall be gu