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本文(DLA SMD-5962-87510 REV B-2009 MICROCIRCUIT DIGITAL ECL HEX INVERTER MONOLITHIC SILICON.pdf)为本站会员(roleaisle130)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-87510 REV B-2009 MICROCIRCUIT DIGITAL ECL HEX INVERTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R104-93. 93-03-29 Monica L. Poelking B Redrawn with changes. Update drawing to current requirements. Editorial changes throughout. - gap 09-10-08 Charles F. Saffle The original first sheet of this drawing has b

2、een replaced. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY A

3、LL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ECL, HEX INVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-01-28 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-87510 SHEET 1 OF 12 DSCC FORM 2233 APR 97 59

4、62-E311-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing descri

5、bes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87510 01 E X Drawing number Device type (see 1.2.1) Case outline(see

6、1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10H589 Hex inverter with enable 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter D

7、escriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply vo

8、ltage range . -8.0 V dc to 0.0 V dc Input voltage range . 0.0 V dc to -5.2 V dc Storage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +165C Maximum power dissipation (PD) . 296 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835

9、1.4 Recommended operating conditions. Supply voltage (VEE) -5.46 V dc minimum to -4.94 V dc maximum Ambient operating temperature range (TA) -55C to +125C Minimum high level input voltage (VIH): TA= +25C . -0.780 V dc TA= +125C . -0.650 V dc TA= -55C -0.840 V dc Maximum low-level input voltage (VIL)

10、 . -1.950 V dc Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governm

11、ent specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIO

12、N MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Mic

13、rocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the

14、 event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The in

15、dividual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been gra

16、nted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the

17、 requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design,

18、construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as sp

19、ecified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical

20、performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specifie

21、d in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B

22、SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to

23、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a

24、“Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The

25、certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL

26、-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity reta

27、in the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, a

28、ppendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The

29、 test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent

30、 specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspectio

31、n. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, me

32、thod 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

33、8-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C Unless otherwise specified Group A subgroup Limits Unit Min Max Cases E, F, and 2 Quiescent tests 1/ VIHVILHigh level output voltage VOHOutputs terminated -0.78

34、0 -1.950 1 -1.010 -0.780 V through, -0.650 -1.950 2 -0.860 -0.650 100 to -2 V, -0.840 -1.950 3 -1.060 -0.840 Low level output voltage VOLVCC= 0.0 V, -0.780 -1.950 1 -1.950 -1.580 V EE= -5.2 V -0.650 -1.950 2 -1.950 -1.565 2/ -0.840 -1.950 3 -1.950 -1.610 High level threshold VOHA-1.110 -1.480 1 -1.0

35、10 -0.780 V output voltage -0.960 -1.465 2 -0.860 -0.650 -1.160 -1.510 3 -1.060 -0.840 Low level threshold VOLA-1.110 -1.480 1 -1.950 -1.580 V output voltage -0.960 -1.465 2 -1.950 -1.565 -1.160 -1.510 3 -1.950 -1.610 Power supply drain current IEEVEE= -5.46 V, 1 -42 mA 4/ VCC= 0.0 V, 2, 3 -46 VIH=

36、-0.780 V at +25C -0.650 V at +125C -0.840 V at -55C High level input current IIH1, 2 310 A 3 495 Low level input current IILVEE= -4.94 V, 1, 3 0.5 A VIL= -1.950 V, 2 0.3 A CC= 0.0 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

37、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C Unless otherwise specified Group A subg

38、roup Limits Unit Min Max Cases E and F Rapid tests 3/ VIHVILHigh level output voltage VOHOutputs terminated -0.793 -1.950 1 -1.022 -0.793 V through -0.664 -1.950 2 -0.873 -0.664 100 to -2 V, -0.854 -1.950 3 -1.073 -0.854 Low level output voltage VOLVCC= 0.0 V, -0.793 -1.950 1 -1.950 -1.584 V EE= -5.

39、2 V -0.664 -1.950 2 -1.950 -1.569 2/ -0.854 -1.950 3 -1.950 -1.614 High level threshold VOHA-1.122 -1.484 1 -1.022 -0.793 V output voltage -0.973 -1.469 2 -0.873 -0.664 -1.173 -1.514 3 -1.073 -0.854 Low level threshold VOLA-1.122 -1.484 1 -1.950 -1.584 V output voltage -0.973 -1.469 2 -1.950 -1.569

40、-1.173 -1.514 3 -1.950 -1.614 Power supply drain current IEEVEE= -5.46 V, 1 -41 mA 4/ VCC= 0.0 V, 2, 3 -45 VIH= -0.793 V at +25C -0.664 V at +125C -0.854 V at -55C High level input current IIH1, 2 295 A 3 480 Low level input current IILVEE= -4.94 V, 1, 3 0.5 A VIL= -1.950 V, 2 0.3 A CC= 0.0 V See fo

41、otnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical perfo

42、rmance characteristics - Continued. Test Symbol Conditions -55C TA +125C Unless otherwise specified Group A subgroup Limits Unit Min Max Case 2 Rapid tests 3/ VIHVILHigh level output voltage VOHOutputs terminated -0.799 -1.950 1 -1.027 -0.799 V through -0.670 -1.950 2 -0.879 -0.670 100 to -2 V, -0.8

43、60 -1.950 3 -1.079 -0.860 Low level output voltage VOLVCC= 0.0 V, -0.799 -1.950 1 -1.950 -1.586 V EE= -5.2 V -0.670 -1.950 2 -1.950 -1.571 2/ -0.860 -1.950 3 -1.950 -1.616 High level threshold VOHA-1.127 -1.486 1 -1.027 -0.799 V output voltage -0.979 -1.471 2 -0.879 -0.670 -1.179 -1.516 3 -1.079 -0.

44、860 Low level threshold VOLA-1.127 -1.486 1 -1.950 -1.586 V output voltage -0.979 -1.471 2 -1.950 -1.571 -1.179 -1.516 3 -1.950 -1.616 Power supply drain current IEEVEE= -5.46 V, 1 -41 mA 4/ VCC= 0.0 V, 2, 3 -45 VIH= -0.799 V at +25C -0.670 V at +125C -0.860 V at -55C High level input current IIH1,

45、2 295 A 3 480 Low level input current IILVEE= -4.94 V, 1, 3 0.5 A VIL= -1.950 V, 2 0.3 A CC= 0.0 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87510 DEFENSE SUPPLY CENTER CO

46、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C Unless otherwise specified Group A subgroup Limits Unit Min Max Cases E, F, and 2 AC tests Transition time tTLH, VEE= -2.9

47、4 V, 9 0.70 2.40 ns tTHLVCC= 2.0 V, 10 0.70 2.40 CL 5 pF, 11 0.70 2.20 Propagation delay time, tPHH,RL= 100 9 0.70 1.80 ns A to Y tPLL See figure 4 10 0.70 1.90 11 0.70 1.90 Propagation delay time, tPLH,9 0.70 2.50 ns E to Y tPHL 10 0.70 2.80 11 0.70 2.20 1/ The quiescent limits are determined after

48、 a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +25C, +125C, or -55C (as applicable), air blowing on the unit in a transverse direction with power applied for at least 4 minutes before the reading is taken. This method was used for theoretical limit establishment only. All devices shall be tested to the delta V (rapid test) conditions specified herein. The rapid test method is an equivalent method of testin

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