DLA SMD-5962-87512 REV E-2013 MICROCIRCUIT DIGITAL ECL FLIP-FLOP HEX D-TYPE MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin C Figure 4 modified to be consistent with

2、Table I. - ljs 98-08-12 Raymond Monnin D Update to current requirements. Editorial changes throughout. - gap 06-03-07 Raymond Monnin E Update drawing to current MIL-PRF-38535 requirements. - jt 13-07-01 C. SAFFLE The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STAT

3、US REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY David W. Queenan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF TH

4、E DEPARTMENT OF DEFENSE CHECKED BY Dan DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ECL, FLIP-FLOP, HEX, D-TYPE, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-01-28 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-87512 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E373-13 Provided by IH

5、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-ST

6、D-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87512 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.

7、2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 10H576 Hex D-type master slave flip-flop 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminal

8、s Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat package X CDFP4-F16 16 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VEE) .

9、 -8.0 V dc to 0.0 V dc Input voltage range . -5.2 V dc to 0.0 V dc Storage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +165C Maximum power dissipation (PD) 717 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended

10、 operating conditions. Supply voltage range (VEE) . -5.46 V dc minimum to -4.94 V dc maximum Ambient operating temperature range (TA) . -55C to +125C Minimum high level input voltage (VIH): TA= +25C -0.780 V TA= +125C -0.650 V TA= -55C . -0.840 V Maximum low level input voltage (VIL) . -1.950 V Mini

11、mum setup time (ts) 1.5 ns Minimum hold time (th) 0.80 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2

12、. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

13、DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS M

14、IL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order

15、 of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Ite

16、m requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufac

17、turer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may mak

18、e modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option

19、 is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal conn

20、ections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on fig

21、ure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without

22、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests f

23、or each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not fea

24、sible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be rep

25、laced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6

26、herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of

27、 conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. D

28、LA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspecti

29、on. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply:

30、 a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, ou

31、tputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are

32、 optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. E

33、lectrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Cases E, F, 2 and X Quiescent tests 1/ VIHVILHigh level output voltage VOHOutputs terminated through 100 to -2 V, -0.780 -1.950 1 -1.010 -0.780 V -0.650 -1.950

34、 2 -0.860 -0.650 -0.840 -1.950 3 -1.060 -0.840 Low level output voltage VOLVCC= 0.0 V, VEE= -5.2 V 2/ -0.780 -1.950 1 -1.950 -1.580 V -0.650 -1.950 2 -1.950 -1.565 -0.840 -1.950 3 -1.950 -1.610 High level threshold output voltage VOHA-1.110 -1.480 1 -1.010 -0.780 V -0.960 -1.465 2 -0.860 -0.650 -1.1

35、60 -1.510 3 -1.060 -0.840 Low level threshold output voltage VOLA-1.110 -1.480 1 -1.950 -1.580 V -0.960 -1.465 2 -1.950 -1.565 -1.160 -1.510 3 -1.950 -1.610 Power supply drain current 4/ IEEVEE= -5.46 V VCC= 0.0 V 1 -112 mA 2, 3 -123 High level input current IIH1VIH= -0.780 V at +25C -0.650 V at +12

36、5C Clock input 1, 2 420 A 3 670 IIH2-0.840 V at -55C Data inputs 1, 2 265 A 3 425 Low level input current IILVEE= -4.94 V, VIL= -1.950 V, VCC= 0.0 V 1, 3 0.5 A 2 0.3 Functional test See 4.3.1c 7 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted witho

37、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A

38、subgroups Limits Unit Min Max Cases E, F and X Rapid tests 3/ VIHVILHigh level output voltage VOHOutputs terminated through 100 to -2 V, -0.810 -1.950 1 -1.038 -0.810 V -0.683 -1.950 2 -0.890 -0.683 -0.873 -1.950 3 -1.090 -0.873 Low level output voltage VOLVCC= 0.0 V, VEE= -5.2 V 2/ -0.810 -1.950 1

39、-1.950 -1.589 V -0.683 -1.950 2 -1.950 -1.575 -0.873 -1.950 3 -1.950 -1.620 High level threshold output voltage VOHA-1.138 -1.489 1 -1.038 -0.810 V -0.990 -1.475 2 -0.890 -0.683 -1.190 -1.520 3 -1.090 -0.873 Low level threshold output voltage VOLA-1.138 -1.489 1 -1.950 -1.589 V -0.990 -1.475 2 -1.95

40、0 -1.575 -1.190 -1.520 3 -1.950 -1.620 Power supply drain IEEVEE= -5.46 V, 1 -111 mA current 4/ VCC= 0.0 V, 2, 3 -122 High level input current IIH1VIH= -0.810 V at +25C Clock 1, 2 405 A -0.683 V at +125C input 3 660 IIH2-0.873 V at -55C Data 1, 2 270 A inputs 3 445 Low level input current IILVEE= -4

41、.94 V, VIL= -1.950 V 1, 3 0.5 A VCC= 0.0 V 2 0.3 Functional test See 4.3.1c 7 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-39

42、90 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Case 2 Rapid tests 3/ VIHVILHigh level output voltage VOHOutputs terminated through 100

43、 to -2 V, -0.813 -1.950 1 -1.040 -0.813 V -0.686 -1.950 2 -0.893 -0.686 -0.876 -1.950 3 -1.093 -0.876 Low level output voltage VOLVCC= 0.0 V, VEE= -5.2 V 2/ -0.813 -1.950 1 -1.950 -1.590 V -0.686 -1.950 2 -1.950 -1.576 -0.876 -1.950 3 -1.950 -1.621 High level threshold output voltage VOHA-1.140 -1.4

44、90 1 -1.040 -0.813 V -0.993 -1.476 2 -0.893 -0.686 -1.193 -1.521 3 -1.093 -0.876 Low level threshold output voltage VOLA-1.140 -1.490 1 -1.950 -1.590 V -0.993 -1.476 2 -1.950 -1.576 -1.193 -1.521 3 -1.950 -1.621 Power supply drain IEEVEE= -5.46 V 1 -111 mA current 4/ VCC= 0.0 V 2, 3 -122 High level

45、input current IIH1VIH= -0.813 V at +25C Clock 1, 2 405 A -0.686 V at +125C input 3 655 IIH2-0.876 V at -55C Data 1, 2 250 A inputs 3 410 Low level input current IILVEE= -4.94 V 1, 3 0.5 A VIL= -1.950 V, VCC= 0.0 V 2 0.3 Functional test See 4.3.1c 7 See footnotes at end of table. Provided by IHSNot f

46、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87512 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Condit

47、ions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Cases E, F, 2 and X AC tests Transition time tTLH, tTHLVEE= -2.94 V VCC= 2.0 V CL 5 pF 9 0.70 1.80 ns 10 0.80 1.90 11 0.80 1.80 Propagation delay time, Dn, CLK to Qn tPLH, tPHL, tPLL, tPHHRL= 100 See figure 4 9 1.00

48、2.70 ns 10 1.00 3.00 11 1.00 2.90 Toggle frequency fMAX9 250 MHz 10 250 11 250 1/ The quiescent limits are determined after a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +25 C, +125 C or -55 C (as applicable) air blowing on the unit in a transverse direction with power applied for at least 4 minutes before the reading is taken. This m