DLA SMD-5962-87514 REV F-2010 MICROCIRCUIT MEMORY DIGITAL CMOS 8K X 8-BIT EEPROM MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline letter U. Add vendor CAGE number 60395 to drawing. Editorial changes throughout. 89-08-07 M. A. Frye B Add device type 28 to drawing. Editorial changes throughout. 93-01-05 M. A. Frye C Add software data protect to drawing. Updat

2、ed boilerplate. 97-04-06 Raymond Monnin D Changes in accordance with NOR 5962-R409-97 97-08-12 Raymond Monnin E Editorial correction to page 1, correction of number of pages. Figure 1 redrawn with 32 leads vs 44 leads and dimension table corrected. ksr 04-06-04 Raymond Monnin F Add vendor CAGE numbe

3、rs 0C7V7 and 3DTT2 to drawing. Updated boilerplate as part of 5-year review. - glg 10-03-25 Charles Saffle THE ORIGINAL FIRST PAGE OF THE DRAWING HAS BEEN REPLACED. REV SHEET REV F F F F F F F F F SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6

4、 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD MICROCIRCUIT CHECKED BY Charles Reusing http:/www.dscc.dla.mil DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, DIGI

5、TAL, CMOS 8K X 8-BIT EEPROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-07-01 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-87514 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E053-10 Provided by IHSNot for ResaleNo reproduction or networking permitted w

6、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87514 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcir

7、cuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-87514 01 X X Drawing number Device type Case outline Lead finish per (see 1.2.1) (see 1.2.2) MIL-PRF-38535 appendix A 1.2.1 Device type(s). The

8、device type(s) shall identify the circuit function as follows: Generic Access Write Write End of write Device type number Circuit function time speed mode indicator Endurance _ 01 (see 6.4) (8K X 8 EEPROM) 350 ns 10 ms byte/page DATA polling 10,000 cycles 02 300 ns 10 ms byte/page DATA polling 10,00

9、0 cycles 03 250 ns 10 ms byte/page DATA polling 10,000 cycles 04 200 ns 10 ms byte/page DATA polling 10,000 cycles 05 250 ns 10 ms byte/page DATA polling 100,000 cycles 06 350 ns 2 ms byte/page DATA polling 10,000 cycles 07 300 ns 2 ms byte/page DATA polling 10,000 cycles 08 250 ns 2 ms byte/page DA

10、TA polling 10,000 cycles 09 200 ns 2 ms byte/page DATA polling 10,000 cycles 10 120 ns 2 ms byte/page DATA polling 10,000 cycles 11 90 ns 2 ms byte/page DATA polling 10,000 cycles 12 70 ns 2 ms byte/page DATA polling 10,000 cycles 13 350 ns 1 ms byte RDY/BUSY 10,000 cycles 14 300 ns 1 ms byte RDY/BU

11、SY 10,000 cycles 15 250 ns 1 ms byte RDY/BUSY 10,000 cycles 16 200 ns 1 ms byte RDY/BUSY 10,000 cycles 17 150 ns 1 ms byte RDY/BUSY 10,000 cycles 18 350 ns 1 ms byte DATA polling 10,000 cycles 19 300 ns 1 ms byte DATA polling 10,000 cycles 20 250 ns 1 ms byte DATA polling 10,000 cycles 21 200 ns 1 m

12、s byte DATA polling 10,000 cycles 22 150 ns 1 ms byte DATA polling 10,000 cycles 23 350 ns 10 ms byte/page RDY/BUSY 10,000 cycles 24 300 ns 10 ms byte/page RDY/BUSY 10,000 cycles 25 250 ns 10 ms byte/page RDY/BUSY 10,000 cycles 26 200 ns 10 ms byte/page RDY/BUSY 10,000 cycles 27 250 ns 10 ms byte/pa

13、ge RDY/BUSY 100,000 cycles 28 200 ns 200 s byte RDY/BUSY 10,000 cycles 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U See figure 1 32 “J“ leaded cerquad package X GDIP1-T28 or CDIP2-T28

14、 28 Dual-in-line Y CQCC1-N32 32 Rectangular leadless chip carrier Z CDFP4-F28 28 Flat pack Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87514 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISI

15、ON LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC). -0.3 V dc to +6.25 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1.0 W Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) 2/ +175C Thermal resis

16、tance, junction-to-case (JC) . See MIL-STD-1835 Input voltage range (VIL, VIH) -0.3 V dc to +6.25 V dc Data retention . 10 years (minimum) Endurance: Device types 01 through 04, 06 through 26, and 28 10,000 cycles/byte (minimum) Device types 05 and 27 100,000 cycles/byte (minimum) Chip clear voltage

17、 (VH) . 13.0 V dc 1.4 Recommended operating conditions. 1/ Supply voltage range (VCC). +4.5 V dc to +5.5 V dc Case operating temperature range (TC) . -55C to +125C Input voltage, low range (VIL) -0.1 V dc to +0.8 V dc Input voltage, high range (VIH) +2.0 V dc to VCC+0.3 V dc Chip clear voltage range

18、 (VH) . 12 V dc to 13 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th

19、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR

20、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robins Avenue, Building 4D,

21、 Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption ha

22、s been obtained. 1/ All voltages are referenced to VSS(ground). 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted w

23、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87514 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appen

24、dix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML pr

25、oduct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or fu

26、nction of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physic

27、al dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table for unprogrammed de

28、vices. The truth table for unprogrammed devices shall be as specified on figure 3. 3.2.3.1 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item drawing. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electric

29、al performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I.

30、 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufa

31、cturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification ma

32、rk in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance sub

33、mitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall

34、be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus, (DSCC), DSCCs agent, and the acquiring activity

35、 retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the man

36、ufacturer prior to delivery. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87514 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 3.10.1 Erasure of EEP

37、ROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4.1. Devices shall be shipped in the erased (logic “1s) and verified state unless otherwise specified. 3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to

38、the specified pattern using the procedures and characteristics specified in 4.4. 3.10.3 Verification of erasure or programmability of EEPROMS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of reading the de

39、vice in accordance with the procedures and characteristics specified in 4.4.2. Any bit that does not verify to be in the proper state shall constitute a device failure, and shall be removed from the lot. 3.12 Endurance. A reprogrammability test shall be completed as part of the vendors reliability m

40、onitors. This reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase endurance cycles listed in

41、section 1.3 herein over the full military temperature range. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. 3.13 Data retention. A data retention stress test shall be completed as part

42、of the vendors reliability monitors. This test shall be done for initial characterization and after any design or process change, which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full mil

43、itary temperature range. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-P

44、RF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D. The

45、test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent

46、specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. (3) Devices shall be burned-in containing a checkerboard pattern or equivalent. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are op

47、tional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall

48、 be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIand COmeasurements) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is fifteen devices with no failures, and all input and output terminals tested. d. Subgroups 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI