DLA SMD-5962-87525 REV G-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS DUAL D-TYPE FLIP-FLOP WITH PRESET AND CLEAR TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical and editorial changes throughout. Add vendor CAGE 04713 for device type 01. Add characterization for device classes B, S, Q, and V. Add ground bounce and latch-up immunity characterization. Add appendix A. - jak 92-12-15 Monica L. Poelk

2、ing B Technical and editorial changes throughout. Add RHA requirements. - CS 97-10-16 Monica L. Poelking C Add device type 03. Add vendor CAGE F8859. Add case outlines X and Z. Add radiation features for device type 01. Update boilerplate to MIL-PRF-38535 requirements. - jak 02-07-03 Thomas M. Hess

3、D Change lead temperature for case outline X in section 1.3. Add radiation features for device type 03 in section 1.5. Editorial changes throughout. - LTG 05-01-04 Thomas M. Hess E Change ICCHand ICCLmax limits for device type 03 in table I. - LTG 05-08-23 Thomas M. Hess F Add appendix A, microcircu

4、it die. Update the boilerplate to MIL-PRF-38535 requirements and to include radiation hardness assurance requirements. - jak 07-04-02 Thomas M. Hess G Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-08-27 Thomas M. Hess REV SHEET REV G G G G G G G G G G G G G G G SH

5、EET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING

6、IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, DUAL D-TYPE FLIP-FLOP WITH PRESET AND CLEAR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-01-06

7、REVISION LEVEL G SIZE A CAGE CODE 67268 5962-87525 SHEET 1 OF 29 DSCC FORM 2233 APR 97 5962-E499-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87525 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI

8、ON LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes M, B, and Q) and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflect

9、ed in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 87525 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) De

10、vice class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked device

11、s meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT74 Dual D-type f

12、lip-flop with preset and clear, TTL compatible inputs 02 54ACT11074 Dual D-type flip-flop with preset and clear, TTL compatible inputs 03 54ACT74 Dual D-type flip-flop with preset and clear, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifyi

13、ng the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q or V Certification and qualification to MIL-PR

14、F-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack Z GDFP1-G14 14 Flat pack with gullwing X CDFP3-F14 14 Flat

15、 pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

16、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-87525 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range

17、 (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) 100 mA 3/ Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds): Case outline X 260C

18、 Other case outlines except case X . 300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C 1.4 Recommended operating conditions. 2/ 4/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT)

19、. +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V at VCC= 4.5 V 0.8 V at VCC= 5.5 V Minimum high level input voltage (VIH) . 2.0 V at VCC= 4.5 V 2.0 V at VCC= 5.5 V Case operating temperature range (TC) . -55C to +125C Input rise and fall rate (trand tf) maximum: VCC= 4.5 V 10 ns/V VCC=

20、5.5 V 8 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) 24 mA 1.5 Radiation features. Device type 01: Maximum total dose available (dose rate = 50 300 rads (Si)/s) . 100 Krads (Si) No single Event Latch-up (SEL) occurs at LET (see 4.4.4.2) . 100 MeV-cm2/mg

21、5/ Device type 03: Maximum total dose available (dose rate = 50 300 rads (Si)/s) . 300 Krads (Si) No single Event Latch-up (SEL) occurs at LET (see 4.4.4.2) . 93 MeVcm2/mg 5/ _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum l

22、evels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ For packages with multiple

23、 VCCand GND pins, this value represents the maximum total current flowing into or out of all VCCor GND pins. 4/ Unless otherwise specified, the values listed above shall apply over the full VCCand TCrecommended operating range. 5/ Limits obtained during technology characterization/qualification, gua

24、ranteed by design or process, but not production tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87525 DLA LAND AND MARITIME COL

25、UMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issu

26、es of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standar

27、d Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 70

28、0 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECH

29、NOLOGY ASSOCIATION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. JESD78 - IC Latch-Up Test. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet,

30、Suite 240-S Arlington, VA 22201-2107). ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org/ or from ASTM International,

31、100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and

32、 regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan

33、. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requ

34、irements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes B, S, Q, and V or MIL-PRF-38535, appendix A and herein for device c

35、lass M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87525 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in

36、accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test

37、 circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by th

38、e manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and po

39、stirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA

40、. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device

41、. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark f

42、or device classes B, S, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes B, S, Q, and V, a certificate of compliance shall be required from

43、a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate o

44、f compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q, and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-3

45、8535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes B, S, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of

46、change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land

47、and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device cla

48、ss M. Device class M devices covered by this drawing shall be in microcircuit group number 38 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87525 DLA LAND AND MARITIME COLUM

49、BUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type and device class VCCGroup A subgroups Limits 4/ Unit Min Max High level out