DLA SMD-5962-87554 REV F-2011 MICROCIRCUIT DIGITAL CMOS 1-OF-8 DECODER DEMULTIPLEXER TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to one part - one part number format. Add device type 02. Add vendor CAGE 01295 for device type 02. Add characterization for device classes B, S, Q, and V. Add ground bounce and latch-up changes to table I. Editorial changes throughout 93-

2、01-15 Monica L. Poelking B Change the power dissipation capacitance parameters in table I. 93-04-14 Monica L. Poelking C Technical and editorial changes throughout. Add RHA requirements. - CS 97-11-05 Monica L. Poelking D Add device type 03. Add vendor CAGE F8859. Add case outline X. Add radiation f

3、eatures for device type 01. Update boilerplate to MIL-PRF-38535 requirements. - jak 02-07-03 Thomas M. Hess E Add radiation features for device type 03 in section 1.5. Update the boilerplate to include radiation hardness assured requirements for device type 03. Editorial changes throughout. - jak 04

4、-05-05 Thomas M. Hess F Update radiation features in section 1.5, Add SEP test table IB and paragraph 4.4.4.2. jak 11-04-14 David J.Corbett REV SHET REV F F F F F F F F F F SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14

5、 PMIC N/A PREPARED BY Jeffery Tunstall DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, CMOS, 1-OF-8 DECODER/DEMULTIPLEXER,

6、 TTL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-05-26 COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-87554 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E015-11 Provided by IHSNot for ResaleNo reproduction or networking permitted withou

7、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87554 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes B, Q and

8、M), and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the

9、following example: 5962 F 87554 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q, and V RHA marked devices meet

10、the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The de

11、vice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT138 1-of-8 decoder/demultiplexer,TTL compatible inputs 02 54ACT11138 1-of-8 decoder/demultiplexer, TTL compatible inputs 03 54ACT138 1-of-8 decoder/demultiplexer,TTL compatible inputs 1.2.3 Dev

12、ice class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MI

13、L-PRF-38535, appendix A B, S, Q, or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CD

14、FP3-F16 16 Flat pack X CDFP4-F16 16 Flat pack 2 CQCC1-N20 20 Leadless-chip-carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitt

15、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87554 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage (VIN) -0.5 V dc to VCC

16、+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input diode current (IIK) (0.0V VIN, VIN VCC) 20 mA DC output diode current (IOK) (0.0V VOUT, VOUT VCC) 20 mA DC output current (IOUT) (per output) 50 mA DC VCCor GND current (ICC, IGND) (per pin) . 200 mA 3/ Storage temperatu

17、re range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds): Case outline X +260C All other case outlines except case X . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C Case operating temperatur

18、e (TC) . -55C to +125C 1.4 Recommended operating conditions. 2/ 4/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V Minimum high level input voltage (VIH) . 2.0 V Case

19、 operating temperature range (TC) . -55C to +125C Input rise and fall rate (trand tf) maximum: VCC= 4.5 V 10 ns/V VCC= 5.5 V 8 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) 24 mA 1.5 Radiation features. Device type 01: Maximum total dose available (dose r

20、ate = 50 300 rads (Si)/s) . 100 krads (Si) Single event phenomenon (SEP): effective LET, no SEL (see 4.4.4.2) . 100 MeV-cm2/mg effective LET, no SEU (see 4.4.4.2) 100 MeV-cm2/mg Device type 03: Maximum total dose available (dose rate = 50 300 rads(Si)/s) 300 krads (Si) Single event phenomenon (SEP):

21、 effective LET, no SEL (see 4.4.4.2) . 93 MeV-cm2/mg 5/ effective LET, no SEU (see 4.4.4.2) . 93 MeV-cm2/mg 5/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum

22、junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ For packages with multiple VCCand GND pins, this value represents the maximum total current

23、flowing into or out of all VCCor GND pins. 4/ Unless otherwise specified, the values listed above shall apply over the full VCCand TCrecommended operating range. 5/ These limits were obtained during technology characterization and qualification, and are guaranteed by design or process, but not produ

24、ction tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87554 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHE

25、ET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th

26、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR

27、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D

28、, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

29、(JEDEC) JESD-20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) ASTM INTERNA

30、TIONAL (ASTM) ASTM F1192- Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org/ or from ASTM International, P. O. Box C700, 100 Barr Harbor Drive, West Conshoho

31、cken, PA 19428-2959). (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents may also be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a co

32、nflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item

33、requirements for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual it

34、em requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level C devices and as specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87554 DLA LA

35、ND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes B, S, Q, and V or MIL-PRF-38535, appendix

36、 A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The lo

37、gic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision leve

38、l control and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specif

39、ied in table IA and shall apply over the full case operating temperature range. Test conditions for these specified characteristics and limits are as specified in table IA. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrica

40、l tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has th

41、e option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1

42、 Certification/compliance mark. The certification mark for device classes B, S, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes B, S, Q, an

43、d V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supp

44、ly in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q, and V, the requirements of MIL-PRF-38535 and he

45、rein or for device class M the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes B, S, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of micro

46、circuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and

47、review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the re

48、viewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A). 3.11 Substitution. Substitution data shall be as indicated in the appendix herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87554 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performan