DLA SMD-5962-87602 REV A-1988 MICROCIRCUITS BIPOLAR 16-BIT ERROR DETECTION AND CORRECTION UNIT MONOLITHIC SILICON《硅单块 16比特错误监测和改正单元 双极微型电路》.pdf

1、. DESC-DWG-87602 REV A 57 W 7777795 O007489 7 W A REVISIONS Add case outline Z. Table I, change tS8 and th8. Changes to 1988 JUL 26 figures 1 and 7. H Editorial changes throughout. _ _ DESCRIPTION PMIC WA STANDARDIZED M I L ITARY DRAWING THIS DRAWING IS AVAILABLE PR USE BY ALL DEPARTMENTS AND AGENCI

2、ES OF THE DEPARTMENT OF DEFENSE AMSC NIA I PREPAREDBY I - DEFENSE ELECTRONICS SUPPLY CENTER I DAYTON, OHIO 45444 I REVISION LEVEL I 1 I SHEET 1 OF 26 A I 1ESC FORM 193 SEP 87 * U.S. GOVERNMENT PIIIHTING OFFICI: 1987 - 748-129/60911 E5962-E950 DISTRIBUTION STATEMENT A. Approved for public ”- h / - I

3、,/ Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-87602 REV A 57 W 7779795 000770 5 W 1. SCOPE 1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance rith 1.2.1 of MIL-STD-883, “Provisions for the use

4、of MIL-STD-883 in conjunction with compliant ion-JAN devices“ 1.2 Part number. The complete part number shall be as shown in the following example: 5962-87602 o1 - X X -r I I T- I I I I I I I I I I I Dram ng number Devi ce type Case outline Lead finish per (1.2.1). (1.2.2) MIL-M-38510 1.2.1 Device t

5、ype. The device type shall identify the circuit function as follows: Device type Generic number Circuit function o1 2960 16-bit error detection and correction unit 1.2.2 Case outlines. The case outlines shall be as designated in appendix C of MIL-M-38510, and s follows: Outline letter Case outline D

6、-14 (48-lead, 2.435“ x .620“ x .225“), dual-in-line package. (48-lead, 1.235“ x .660“ x .098“), top braze flat ackage (see figure 1). C-6 (52-tennina1, .761“ x ,761“ x .120“), square cRip carrier package. (52-tennina1, .760“ x .760“ x .075“), thin square chip carrier package (see figure 2). 1.3 Abso

7、lute maximum ratings. Supply voltage range- - - - - - - - - - - - - Input voltage range - - - - - - - - - - - - - Storage temperature range - - - - - - - - - - Maximum power dissipation (PD)- - - - - - - - Lead temperature (soldering, 10 seconds)- - - Thermal resistance, junction-to-case (0jc) : Cas

8、es X and U - - - - - - - - - - - - - - Case y- - - - - - - - - - - - Case Z- - - - - - - - - - - - - - Junction temperature (TJ) - - - - - - - - - - DC vol tage applied to outputs for high output DC output current, into outputs - - - - - - - DC input current- - - - - - - - - - - - - - - 1.4 Recommen

9、ded operating conditions. Supply voltage (Vcc)- - - - - - - - - - - - - - - - Minimum high level input voltage (VIH)- - - - - - - Maximum low level input voltage (VIL) - - - - - - - Case operating temperature range (TC) - - - - - - - -0.5 V dc to t7.0 V dc -0.5 V dc to t5.5 V dc -65C to +15O0C 2.2 w

10、 +3OOoC See MIL-M-38510, appendix C 30“C/W l/ 30C/W x/ +185“C -0.5 V to Vcc (maximum) 30 mA -30 mA to t5.0 mA 4.5 V dc minimum to 5.5 V dc maximum 2.0 V dc 0.8 V dc -55C to +125“C /en a thermal resistance value for this case is included in MIL-M-38510, appendix C, that value shall supersede the valu

11、e indicated herein. SIZE A MILITARY DRAWING mv-mn7 STANDARDIZED DEFENSE ELECTRONICS SUPPLY CENTER RMSION LEVEL SHEET 2 DAYTON, OHIO 45444 A i U. 5. QOVERNMENT PRINTING OFFICE- 1ObS549-904 ESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

12、HS-,-,-DESC-DWG-87bOZ REV A 57 W 7977775 0007Li71 7 9 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON. OHIO 45444 2. APPLICABLE DOCUMENTS 2.1 Government specification and standard. Unless otherwise specified, the following ipecification and standard, of the issue listed in tha

13、t issue of the Department of Defense Index of lpecifications and Standards specified in the solicitation, form a part of this drawing to the hxtent specified herein. SIZE A 5962-87602 REVISION LEVEL SHEET A 3 SPEC IF I CAT ION MILITARY M IL-M- 38510 STANDARD MIL I TARY MIL-STD-883 (Cooies of the spe

14、c - Microcircuits, General Specification for. - Test Methods and Procedures for Microelectronics. Pication and standard required by manufacturers in connection with specific cquisition functions should be obtained from the contracting activity or as directed by the ontracting activity. I 2.2 Order o

15、f precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with .1.2.1 of In the event of a conflict between the text of this drawing and the eferences cited herein, the text of this drawing shall take precedence. IL-STD- . nd as s,“ifiBd herein. “ r

16、ovisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ 3.2 Design, construction, and physical dimensions. The design, construction, and physical imensions shall be as specified in MIL-M-38510 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1

17、.2.2 here 3.2.2 Terminal connections. The terminal connections shall be as specified on 3.2.3 Block diagram. nd 2. The block diagram shall be as specified on figure 4- n and figures 1 figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified, the electrical erformance characte

18、ristics are as specified in table I and apply over the full case operating emperature range. e markd the part number listed in 1.2 herein. ay also be marked as listed in 6.5 herein. 3.4 Markin Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall In addition, the manufactu

19、rers part number 3.5 Certificate of compliance. A certificate of compliance shall be required from a manufacturer n order to be listed as an approved source of supply in 6.5. The certificate of compliance ubmitted to DESC-ECS prior to.listing as an approved source of supply shall state that the anuf

20、acturer s product meets the requirements of MIL-STD-883 ( see 3.1 herein) and the requi rements erei n. erein) shall be provided with each lot of microcircuits delivered to this drawing. 3.6 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 I I I - * U. S.

21、GOVERNMENT PRINTINQ OFFICE 1988-549-954 DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I DESC-DWG-760ZtREV A 57 II 7777775 0007L172 7 TABLE I. Electrical performance characteristics. I I I 1 I I Unit Conditions I Group A I Limi

22、ts -55C TIhG OFlICE: 19E7. .lU4ZPWYU DESC FORM 193A SEP a7 P ,/ - Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-87602 REV A 57 7777775 0007503 T INDEX CORNER 020 X 45O REF (OPTIONAL) t 0- 0075 MAX. PLANE 2 PLANE I ,007 NOTEI COPLANARITY A

23、LIMIT = .o06 MAX SOLDER DIPPED LEADLESS CHIP CARRIER Variations Inches .O03 I NO/NE ,005 .O06 Min i Max. i Min i Max i Min i Max i BSC I Max .O07 ,0075 ,064 I .O75 I .O54 I .o65 I .74 I .760 I ,600 I ,660 I 13 .O15 .o20 NOTES : .o22 A minimum clearance of ,015 inch (0.38 mm) shall be maintained bgtw

24、een all .O28 metaliized features. Corner teminal pads may have a .020“ x 45 maximum ,040 chamfer to accomplish el dimension. .O45 2. The lid shall not extend beyond the edges of the body. .O54 3. N is the maximum quantity of terminal positions. ND and NE are the number of .O55 terminals along the si

25、des of length D and E respectively. .O64 4. Electrical connection terminals are required on plane 1 and optional on .O65 plane 2. However, if plane 2 has such terminals, they shall be electrically .O75 connected to opposing terminals on plane 1. .O77 5. The index feature for pin 1 D1, optical orient

26、ation or handling purposes .O93 shall be within the shaded area shown, and is defined by dimensions B1 and L2. .6oo 6. Plane 1 is the heat radiating surface which may optionally be metallized .660 with checkerboard pattern of thermal conduction pads; the number of pads is ,740 determined in accordan

27、ce with MIL-M-38510, appendix C for LCC outlines. .760 7. The chip carrier corner shape (square, notch, radius, etc.) may vary at the manufacturers option from that shown in the detailed drawing. 8. Dimensions 83 and L3 define the castellation width and depth respectively at any point of the surface

28、. Castellations are required on bottom two layers and optional in the top layer. See MIL-M-38510, appendix C for details. 9. Package shall consist of a minimum of two layers. 10. Solder dipped LCC packages shall conform to MIL-M-38510, appendix C on coplanarity measurements. 1. FIGURE 2. Case outlin

29、e Z. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYION, OHIO 45444 ESC FORM 193A SEP 87 mm O.OE 0.1: 0.1E 0.1E 0.15 0.3 0.51 0.5L 0.73 1.0; 1.14 1.3; 1.4C 1.6: 1.6f 1.91 1.9L 2.3t 15.24 16.7f 18.8C 19.3 SIZE A I 5962-87602 I REVISION LEVEL A I SHEET 15 *C.S. GOVERhMEiT PRIhTISC

30、OFFICE: 1987 . 1%129-M)90 _,- ? . f Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-7602 REV A 57 7797775 00075Oq L M STANDARDIZED MILITARY DRAW IN G DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Case outlines X and Y SIZE 5962-87602

31、A REVISION LEVEL SHEET 16 PASS THRU. TOP VIEW FIGURE 3. Terminal connections. DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-87b02 REV A 57 7777775 0007505 3 m STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY C

32、ENTER DAYION, OHIO 45444 GND 14 DATA? I5 DATA4 E 18 OE BYTE O 19 DATA6 16 DATA5 17 - 5962-87602 SIZE A REVISION LEVEL SHEET 17 21 22 23 24 25 26 27 28 29 30 31 32 33 TOP VIEW FIGURE 3. Teminal connections - Continued. DESC FORM 193A SEP 87 f?L.S. COVERSlEhiT PRISTISG OFFICE 1917. 718-129-WU Provided

33、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-87602 REV A 57 = 7777775 0007506 5 SIZE 5962- 87 602 A 1 I STANDARMZED MILTTARY DRAWING I DEFENSE ELECtRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL I SHEET 18 fi1.S. COIER%IEiT PRhTIiC OFFI

34、CE 88 . 48.lN.M)9U ESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- DESC-DWG-87602 REV A 57 7777775 0007507 7 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Test output 1 oads SIZE 5962-87602 A

35、 REVISION LEVEL SHEET 19 I 1 I I I Test I I I i Pin label i circuit i R1 1 Ri? i I I I DATAO-15 I Figure 5 I 430n f 1 kn I l I I I I I I I I I I I i SCo-SC6 i Figure 5 i 430n i 1 kn i I I I I I 1-1 I I I I I I I I I ERROR I Figure 6 I 470n I 3 ka I I I I i MULT ERROR i Fiqure 6 i 4700 I 3 kn I “cc $

36、2 Switching test c.i rcui tc vO UT FIGURE 5. Three-state outputs. “OUT “cc CC = 5.0 V minus the current to ground through R2. 6. CL = 5.0 pF for output disable tests. 2.4 Y for non-three-state outputs. f7L.S. COYERSlET PRI3TISG OFFICE: 1981 748129-90 ESC FORM 193A SEP 87 Provided by IHSNot for Resal

37、eNo reproduction or networking permitted without license from IHS-,-,-_I_ _I- _ - - DESC-DWG-87602 REV A 59 W 9979995 0007508 9 W DATA TO LE IN SETUP TIME LE IN 7 DATA TO LE IN HOLD TIME BYTE Oc1 NOTE: Inputs switch between O Y and 3.0 V at 1 V/ns with measurements made at 1.5 V. A19 outputs have ma

38、ximum dc load. FIGURE 7. Switching waveform. SIZE STANDARDIZED 5962-87602 A MILITARY DRAW JN G I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I SHEET 20 I REVISIONLEVEL A I I I f7L.S. COERXiLIT PRIITlhC OFFICE: HU?. ?48lZ%09U DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction

39、 or networking permitted without license from IHS-,-,-DESC-DWG-bU2 REV A 57 H 7777775 0007507 O SIZE A STANDARDIZED 3.7 Notification of change. Notification of change to DESC-ECS shall be required in accordance Mith MIL-STD-883 see 3.1 herein). 5962-87602 3.8 Verification and review. DESC, DESCS age

40、nt, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. shall be made available onshore at the option of the reviewer. Offshore documentation 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection, Sampling and inspection proc

41、edures shall be in accordance with section 4 of MIL - M 38510 to the extent specified in MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be Zonducted on all devices prior to quality conformance inspection. shall apply: The foll

42、owing additional criteria a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D using the circuit submitted with the certificate of compliance (see 3.5 herein). (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, exce t

43、interim electrical parameter tests prior to burn-in are optional at the discretion of tile manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with nethod 5005 of MIL - STD 883 including groups A, B, C, and D inspections. :riteria shall apply. The

44、following additional 4.3.1 a. b. C. 4.3.2 a. b. I . DESC FORM 193A QU. 5. GOVERNMENT PRIMING OFFICE: 1888-549-904 SEP 87 Group A inspection. Tests shall be as specified in table II herein. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. Subgroups 7 and 8 testing shall

45、be sufficient to verify the functional operation of the device. These tests form a part of the vendors test tape and shall be maintained and available from the approved source of supply. Groups C and D inspections. End-point electrical parameters shall be as specified in table II herein. Steady-stat

46、e li fe test conditions, method 1005 of MIL-STD-883. (1) Test condition C or D using the circuit submitted with the certificate of comp (see 3.5 herein). (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. i ance Provided by IHSNot for ResaleNo

47、 reproduction or networking permitted without license from IHS-,-,-DESC-DWG-7602 REV A 57 m 7777775 00075LO 7 W I TABLE II. Electrical test requirements. I I Subgroups i I MIL-STD-883 test requirements I (per method I I I 5005, table I) I I I I I I I interim electrical parameters I - I (method 5004)

48、 I I I I I I Final electrical test parameters I 1*, 2, 3, 7, I I (method 5004) I 8, 9, 10, 11 I I I I I Group A test requirements I 1, 2, 3, 7, 8, I I (method 5005) I 9, 10, 11 I I I I Groups C and D end-point I electrical parameters I (method 5005) I I 1, 2, 3 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with II L-M-38slU 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military ;pecifications do not exist and qualified mil