DLA SMD-5962-87631 REV E-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE FLIP-FLOP TTL COMPATIBLE INPUTS THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 02. Technical changes to 1.3, 1.4, and table I. Change to figures 1, 2, and 3. Add vendor CAGE 01295. Editorial changes throughout. Remove JAN replacement part number M38510/75652BRX and 2X. 89-06-05 M. A. Frye B Add vendor CAGE

2、F8859. Add device type 03. Add case outline X. Add table III, delta limits. Update drawing to MIL-PRF-38535 requirements. jak 02-12-23 Thomas M. Hess C Add radiation features for device type 03 in section 1.5. Update the boilerplate to include radiation hardness assured requirements for device type

3、03. Editorial changes throughout. jak 05-02-22 Thomas M. Hess D Update radiation features in section 1.5. Add table IB and paragraphs 4.4.4.1 - 4.4.4.2. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. LTG 11-12-19 Thomas M. Hess E Update dimensions of case outline X to figur

4、e 1. - LTG 12-08-23 Thomas M. Hess REV SHEET REV E E E SHEET 15 16 17 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Nicklaus DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIR

5、CUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL D-TYPE FLIP-FLOP, TTL COMPATIBLE INPUTS, THREE-STATE OUTPUTS, MONOLITHIC SILICON DRAWI

6、NG APPROVAL DATE 88-03-02 REVISION LEVEL E SIZE A CAGE CODE 67268 5962-87631 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E418-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87631 DLA LAND AND MARITIME COLUMB

7、US, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available a

8、nd are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 87631 01 L A Federal stock class designator RHA designat

9、or (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 F 87631 01 V L A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2

10、.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked

11、with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT374 Octal D-type flip-flop with three-state outputs and TTL compatible inputs 02 54ACT113

12、74 Octal D-type flip-flop with three-state outputs and TTL compatible inputs 03 54ACT374 Octal D-type flip-flop with three-state outputs and TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Si

13、nce the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-

14、STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8763

15、1 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line R GDIP1-T20

16、 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack X See figure 1 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, app

17、endix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current. 20 mA DC output current (IOUT) (per pin) . 50 mA

18、DC VCCor GND current (per pin) . 100 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 3/ 1.4 Recommended operating co

19、nditions. 2/ 4/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCCase operating temperature range (TC) . -55C to +125C Input rise or fall rate (t/t): VCC= 4.5 V to 5.5 V . 0 to 8 ns/V Minimum setup time, Dn to CP

20、 (ts): Device types 01, 03, TC= +25C, VCC= 4.5 V . 4.5 ns Device type 02, TC= +25C, VCC= 4.5 V . 3.0 ns Device types 01, 03, TC= -55C to +125C, VCC= 4.5 V . 5.5 ns Device type 02, TC= -55C to +125C, VCC= 4.5 V . 3.0 ns Minimum hold time, Dn to CP (th): Device types 01, 03, TC= +25C, VCC= 4.5 V . 2.0

21、 ns Device type 02, TC= +25C, VCC= 4.5 V . 5.5 ns Device types 01, 03, TC= -55C to +125C, VCC= 4.5 V . 2.0 ns Device type 02, TC= -55C to +125C, VCC= 4.5 V . 5.5 ns Minimum pulse width, Dn to CP (tw): Device types 01, 03, TC= +25C, VCC= 4.5 V . 5.5 ns Device type 02, TC= +25C, VCC= 4.5 V . 9.0 ns De

22、vice types 01, 03, TC= -55C to +125C, VCC= 4.5 V . 7.4 ns Device type 02, TC= -55C to +125C, VCC= 4.5 V . 9.0 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless

23、otherwise noted, all voltages are referenced to GND. 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 4/ Unless otherwise specified, the values listed above shall apply over the full

24、VCCand TCrecommended operating range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87631 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended opera

25、ting conditions Continued. 2/ 4/ Minimum clock frequency (fMAX): Device types 01, 03, TC= +25C, VCC= 4.5 V . 92 MHz Device type 02, TC= +25C, VCC= 4.5 V . 55 MHz Device types 01, 03, TC= -55C to +125C, VCC= 4.5 V . 68 MHz Device type 02, TC= -55C to +125C, VCC= 4.5 V . 55 MHz 1.5 Radiation features.

26、 Device type 03: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 krads (Si) No Single Event Latchup (SEL) occurs at LET (see 4.4.4.2) . 93 MeV-cm2/mg 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handb

27、ooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF

28、 DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents

29、are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless ot

30、herwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available onlin

31、e at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Co

32、pies of this document is available online at http:/www.astm.org/ or from ASTM International, P. O. Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959). (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documen

33、ts. These documents may also be available in or through libraries or other informational services.) 5/ Limits obtained during technology characterization/qualification, guaranteed by design or process, but not production tested unless specified by the customer through the purchase order or contract.

34、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87631 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 2.3 Order of precedence. In the event of a conflict betwee

35、n the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.1 Item requirements. The individual item requirements for device class

36、es Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M s

37、hall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF

38、-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3

39、. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer

40、 under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation

41、parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking.

42、 The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA prod

43、uct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device clas

44、ses Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufactu

45、rer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DL

46、A Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Ce

47、rtificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device clas

48、s M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered b