DLA SMD-5962-87640 REV B-2002 MICROCIRCUIT LINEAR BIMOS II LATCHED DRIVERS MONOLITHIC SILICON《硅单块 双极金属氧化物半导体技术中断接口闩锁设备 直线型微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add case outline C. Made corrections to timing test limits. Editorial changes throughout. 90-02-02 M. A. FRYE B Drawing updated to reflect current requirements. - ro 02-08-23 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING

2、HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY JOSEPH A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS A

3、VAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, BIMOS II LATCHED DRIVERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-04-08 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-87640 SHEET 1 OF 12 DSCC FORM 2233 APR 97

4、5962-E544-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REV

5、ISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following

6、example: 5962-87640 01 C X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 5801 BIMOS II 8-bit latched drivers 02 5800 BIMOS II 4-

7、bit latched drivers 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line W GDIP1-T22 or CDIP2-T22 22 Dual-in-line 1.2.3 Lead finish. The lead finish is as sp

8、ecified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VDD) . 15 V dc Continuous collector current (IC) 500 mA Input voltage range (VIN) -0.3 V dc to VDD+0.3 V dc Output voltage (VCE) 50 V dc Maximum power dissipation (PD) . 1.75 W Storage temperature range -65C to +150C

9、 Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) +175C Thermal resistance, junction to case (JC) See MIL-STD-1835 Thermal resistance, junction to ambient (JA) . 65C/W 1.4 Recommended operating conditions. Supply voltage range (VDD) . 5 V dc to 12 V dc Ambient operating tempe

10、rature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCU

11、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index o

12、f Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835

13、 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the St

14、andardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supers

15、edes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing t

16、hat is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approva

17、l in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or

18、 “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines

19、. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional diagram. The functional diagram shall be as specified on figure 2. 3.2.4 Truth table. The truth table shall be as specified on figure

20、 3. 3.2.5 Timing diagram. The timing diagram shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Pro

21、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test

22、 Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output leakage current ICEXVCE= 50 V, VDD= 5 V 1 All 50 A 2,3 100 Collector emitter saturation voltage VCEIC= 100 mA, VDD= 5 V 1 All 1.1 V (SAT) IC= 200 mA, VDD= 5 V 1.3 IC= 350 mA, VDD= 7 V

23、 1.6 IC= 100 mA, VDD= 5 V 2,3 1.3 IC= 200 mA, VDD= 5 V 1.5 IC= 350 mA, VDD= 7 V 1.8 Input voltage VIN(0) VDD= 5 V 4,5,6 All 1.0 V VIN(1) VDD= 12 V 1/ 4,5 10.5 VDD= 10 V 1/ 8.5 VDD= 5 V 1/ 3.5 VDD= 12 V 1/ 6 11 VDD= 10 V 1/ 9 VDD= 5 V 1/ 3.6 Input resistance RINVDD= 12 V 1,2 All 50 k VDD= 10 V 50 VDD

24、= 5 V 50 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. E

25、lectrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input resistance RINVDD= 12 V 3 All 35 k VDD= 10 V 35 VDD= 5 V 35 Supply current IDD(on) VDD= 12 V, outputs open 1,2 All 2.0 mA (each sta

26、ge) VDD= 10 V, outputs open 1.7 VDD= 5 V, outputs open 1.0 VDD= 12 V, outputs open 3 2.5 VDD= 10 V, outputs open 2.1 VDD= 5 V, outputs open 1.0 IDD(off) VDD= 12 V, outputs open, inputs = 0 V 1,2,3 200 A (total) VDD= 5 V, outputs open, inputs = 0 V 100 Clamp diode leakage current IRVDD= 5 V, VR= 50 V

27、 1,3 All 50 A 2 100 Clamp diode forward voltage VFVDD= 5 V, IF= 350 mA 1,2 All 2.0 V 3 2.1 Functional tests See 4.3.1c 7 All Timing conditions 2/ Minimum data active time before strobe tSVDD= 5 V 9 All 50 ns enabled (data setup time) See footnotes at end of table. Provided by IHSNot for ResaleNo rep

28、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55

29、C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Timing conditions continued. 2/ Minimum data active time after strobe tHVDD= 5 V 9 All 50 ns disabled (data hold time) Minimum strobe pulse width tSPWVDD= 5 V 9 All 125 ns Minimum clear pulse width tCPWVDD= 5 V 9

30、 All 300 ns Minimum data pulse width tDPWVDD= 5 V 9 All 225 ns 1/ Operation of these devices with standard TTL or DTL may require the use of appropriate pullup resistors to insure a minimum logic “1”. 2/ See figure 4. 3.4 Electrical test requirements. The electrical test requirements shall be the su

31、bgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in M

32、IL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN dev

33、ices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required fro

34、m a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A

35、 and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordanc

36、e with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by

37、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines W C Terminal number Terminal

38、 symbol 1 CLEAR CLEAR 2 STROBE STROBE 3 IN1IN14 IN2IN25 IN3IN36 IN4IN47 IN5GROUND 8 IN6COMMON 9 IN7OUT410 IN8OUT311 GROUND OUT212 COMMON OUT113 OUT8VDD14 OUT7OUTPUT ENABLE 15 OUT6- 16 OUT5- 17 OUT4- 18 OUT3- 19 OUT2- 20 OUT1- 21 VDD- 22 OUTPUT ENABLE - FIGURE 1. Terminal connections. Provided by IHS

39、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Functional diagram. Provided by IHSNot for ResaleNo rep

40、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 INNSTROBE CLEAR OUTPUT ENABLE OUTNt - 1 t 0 1 0 0 X OFF 1 1 0 0 X ON X X 1 X X OFFX X

41、 X 1 X OFF X 0 0 0 ON ONX 0 0 0 OFF OFF X = Irrelevant. t 1 = Previous output state. t = Present output state. NOTES: 1. Information present at an input is transferred to its latch when the “strobe” input is high. 2. A high “clear” input will set all latches to the output off condition regardless of

42、 the data or strobe input levels. 3. A high “output enable” will set all outputs to the off condition regardless of any other input conditions. 4. When “output enable” is low, the outputs depend on the state of their respective latches. FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduc

43、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 A. Minimum data active time before strobe enabled (data setup time) 50 ns B. Minimum data

44、 active time after strobe disabled (data hold time) 50 ns C. Minimum strobe pulse width 125 ns D. Typical time between strobe activation and output on to off transition 500 ns E. Typical time between strobe activation and output off to on transition 500 ns F. Minimum clear pulse width 300 ns G. Mini

45、mum data pulse width 225 ns FIGURE 4. Timing diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 11 DSCC FORM 2234 AP

46、R 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conforma

47、nce inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activ

48、ity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with