ImageVerifierCode 换一换
格式:PDF , 页数:13 ,大小:139.31KB ,
资源ID:699123      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-699123.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(DLA SMD-5962-87718 REV B-2011 MICROCIRCUIT LINEAR 4-CHANNEL DIFFERENTIAL JFET ANALOG MULTIPLEXER MONOLITHIC SILICON.pdf)为本站会员(boatfragile160)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-87718 REV B-2011 MICROCIRCUIT LINEAR 4-CHANNEL DIFFERENTIAL JFET ANALOG MULTIPLEXER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. drw 00-12-13 Raymond Monnin B Redraw. Correct device type number in 1.2.1. Editorial changes throughout. drw 11-08-03 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THI

2、S DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVA

3、ILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Wm. J. Johnson APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 4-CHANNEL DIFFERENTIAL JFET ANALOG MULTIPLEXER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-12-09 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5

4、962-87718 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E426-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97

5、1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87718 01 E A Drawing number De

6、vice type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 MUX-24A 4-channel differential JFET analog multiplexer 02 MUX-24B 4-channel differential JFET analog multi

7、plexer 1.2.2 Case outline. The case outline are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratin

8、gs. Positive supply voltage (VCC) . +18 V dc Negative supply voltage (VEE) -18 V dc Logic input voltage . (-4 V or VEE) to VCCAnalog input voltage VEE- 20 V to VCC+ 20 V Maximum current through any pin . 25 mA Storage temperature range -65C to +150C Power dissipation (PD) 1/ . 500 mW Lead temperatur

9、e (soldering, 60 seconds) 300C Junction temperature (TJ) 150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-case (JA): Case E . 91C/W 1.4 Recommended operating conditions. Positive supply voltage (VCC) . +15 V dc Negative supply voltage (VEE) -15 V dc A

10、mbient operating temperature range (TA) -55C to +125C Digital “1” input voltage (VIH) 2.0 V min Digital “0” input voltage (VIL) 0.8 V max Analog voltage range (VA) . 10 V max _ 1/ Derate above 100C, 10 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

11、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of th

12、is drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL

13、-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online a

14、t https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing tak

15、es precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices

16、and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacture

17、rs approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modification

18、s shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in M

19、IL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The l

20、ogic diagram shall be as specified on figure 3. 3.2.5 Switching time waveforms. The switching time waveforms shall be as specified on figure 7. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and sh

21、all apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking pe

22、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A sub

23、groups Device type Limits Unit unless otherwise specified Min Max Positive supply current ICC1 All 12 mA 2, 3 15Negative supply current IEE1 All -3.8 mA 2, 3 -5 “ON” resistance RON-10 V VSOURCE +10 V, 1 01 300 ISOURCE= 200 A 02 400 2, 3 01 40002 500“ON” resistance change with RON/ -10 V VSOURCE +10

24、V, 1 01 5 % change in source voltage VSOURCEISOURCE= 200 A 1/ 2 7 3 6 1 02 7 2 8 3 RONMATCH RONVSOURCE= 0 V, 1 01 15 % between switches MATCH ISOURCE= 200 A 1/, 2/ 2 20 3 181 02 202 23 3 23Digital input current IINVIN= 0.4 V to 15 V 1 All 10 A 2, 3 20 Digital “0” enable current IIN(EN)VIN(EN)= 0.4 V

25、 1 All 10 A 2, 3 20 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I.

26、 Electrical performance characteristics - continued. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A subgroups Device Limits Unit unless otherwise specified Min Max Source current ISOURCE VSOURCE= 10 V VIL= 0.8 V 1, 3 01 1 nA (Switch “OFF”) (OFF) VDRAIN= -10 V VIL= 0.7 V 2 25 3/

27、VIL= 0.8V 1 02 2 IL= 0.7 V 2 50 IL= 0.8 V 3 25 Drain current IDRAIN VSOURCE= 10 V VIL= 0.8V 1, 3 01 1 nA (Switch “OFF”) (OFF) VDRAIN= -10 V VIL= 0.7 V 2 100 3/ VIL= 0.8 V 1 02 2 IL= 0.7 V 2 500 IL= 0.8 V 3 100 Leakage current IDRAIN(ON)+ VIH= 2 V, 1, 3 01 1 nA (Switch “ON”) ISOURCE(ON) VSOURCE= VDRA

28、IN= +10 V 2 100 3/ 1 02 2 2 500 3 100 Analog voltage range VA 1/ 1, 2, 3 All 10 V Digital “0” input voltage VIL1/ 1, 3 All 0.8 V 2 0.7 Digital “1” input voltage VIH1/ 1, 2, 3 All 2.0 V Functional tests 4/ See 4.3.1c 1, 2, 3 All Switching time tPHL, tPLH VS1= +10 V, VS4= -10 V, RL= 10 M, CL= 10 pF 9

29、All 2.1 s See figures 4 and 7 10, 11 1/ 3.5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC F

30、ORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A subgroups Device Limits Unit unless otherwise specified Min Max Enable delay “ON” tON(EN) VS1= -1.0 V, CL= 10 pF, 9 All 2.0 s RL= 1 k, 10, 11 1/ 3.0 Enable

31、 delay “OFF” tOFF(EN) See figures 5 and 7 9 01 0.5 02 0.610, 11 1/ All 1.0 Break-before-make delay tOPENVS1= VS4= -1V, TA= 25C See figures 6 and 7 9 All 0.1 s 1/ Guaranteed, if not tested, to the specified limits. 2/ RONmatch specified as a percentage of RAVERAGEwhere: 1 N RAVERAGE= N Riwith N = num

32、ber of channels, Ri= each channels “ON” resistance. i = 1 3/ Conditions applied to leakage tests insure worst case leakages. 4/ Verified by leakage tests. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In additi

33、on, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on

34、 all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall

35、 be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the require

36、ments of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA

37、Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore docum

38、entation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM

39、 2234 APR 97 Device type 01 and 02 Case outline E Terminal number Terminal symbol 1 A02 ENABLE3 VEE 4 S1A5 S2A 6 S3A7 S4A 8 DRAIN A 9 DRAIN B 10 S4B 11 S3B12 S2B 13 S1B14 VCC15 GND 16 A1FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

40、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 A1 A0 ENABLE “ON” Channel X X L NONE L L H 1 L H H 2 H L H 3 H H H 4 FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for R

41、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Switching time test circuit. FIGURE 5. Enable delay test circuit. Provide

42、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 FIGURE 6. Break-before-make test circuit. FIGURE 7. Switching tim

43、e waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87718 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection.

44、Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a.

45、Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outpu

46、ts, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are op

47、tional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test r

48、equirements (method 5005) 1, 2, 3, 9, (10, 11)* Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 10 and 11 are guaranteed, if not tested, to the limits specified in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The follow

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1