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本文(DLA SMD-5962-87744 REV A-2010 MICROCIRCUIT MEMORY DIGITAL NMOS 64K X 16-Bit (1M) UV ERASABLE PROGRAMMABLE READ ONLY MEMORY (UVEPROM) MONOLITHIC SILICON.pdf)为本站会员(lawfemale396)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-87744 REV A-2010 MICROCIRCUIT MEMORY DIGITAL NMOS 64K X 16-Bit (1M) UV ERASABLE PROGRAMMABLE READ ONLY MEMORY (UVEPROM) MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Boilerplate update, part of 5 year review. ksr 10-04-29 Charles F. Saffle The original first page of this drawing has been replaced REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED B

2、Y Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Di Cenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Robert P. Evans MICROCIRCUIT, MEMORY, DIGITAL, NMOS, 64K X 16-Bit (1M) UV ERASABL

3、E PROGRAMMABLE READ ONLY MEMORY (UVEPROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-10-09 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-87744 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E251-10 .Provided by IHSNot for ResaleNo reproduction or network

4、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class l

5、evel B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87744 01 Q_ A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device typ

6、e(s) identify the circuit function as follows: Device type 01 02 Generic number (See 6.6) (See 6.6) Circuit function 1M (64K x 16) UVEPROM 1M (64K x 16) UVEPROM Access time 200 ns 250 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descr

7、iptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 dual-in-line package 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -65

8、C to +125C All input or output voltage with respect to ground - - - - - - - - - - - - - - - - -0.6 V dc to +6.25 V dc Voltage on A9with respect to ground - - - - - - - - - - - - - - - - - - - - - - - - -0.6 V dc to +13.0 V dc VPPsupply voltage with respect to ground during programming - - - - - - -

9、- - - - - - - - - - - - - - - - - - - - - - - - - - - - -0.6 V dc to +14.0 V dc VCCsupply voltage with respect to ground - - - - - - - - - - - - - - - - - - - - -0.6 V dc to +7.0 V dc Power dissipation (PD) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1.1 W Lead temperature (s

10、oldering, 10 seconds) - - - - - - - - - - - - - - - - - - - - +300C Thermal resistance junction-to-case (JC) Case Q - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - -

11、 - - - - - +200C 1.4 Recommended operating conditions. Case operating temperature range (TC) - - - - - - - - - - - - - - - - - - - - - - - -55C to +125C Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5 V dc 10% _ 1/ Lid shall be transparent to permit ult

12、raviolet light erasure. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.

13、1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPE

14、CIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Sta

15、ndard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preceden

16、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requiremen

17、ts. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who ha

18、s been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modificati

19、ons to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.

20、2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as spe

21、cified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, or C (see 4.3), the devices shall be programmed by the manufacturer prior to test with a minimum

22、 of 50 percent of the total number of gates programmed or to any altered item drawing pattern which includes at least 25 percent of the total number of gates programmed. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Block diagram. T

23、he block diagram shall be as specified on figure 3. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply o

24、ver the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I.Provided by IHSNot for ResaleNo reproduction or networking permitted without

25、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= 5V 10% unless otherwise specified G

26、roup A subgroups Device type Limits Unit Min Max Input load current ILIVIN= 5.5 V 1,2,3 All 1 A Output leakage current ILOVOUT = 5.5 V 1,2,3 All 1 A VPPload current read IPP1VPP= 5.5 V 1,2,3 All 1 A VCCcurrent standby ISB= VIH1,2,3 All 50 mA VCCcurrent active ICC= = VIL1,2,3 All 200 mA Input low vol

27、tage VIL1,2,3 All -0.1 0.8 V Input high voltage VIH1,2,3 All 2.0 VCC+1 1/ V Output low voltage VOLIOL= 2.1 mA 1,2,3 All 0.45 V Output high voltage VOHIOH= -400 A 1,2,3 All 2.0 V Input capacitance CIN1/ TC= +25C VIN= 0 V, f =1 MHz 4 All 6 pF Output capacitance COUT1/ TC= +25C, f =1 MHz VOUT= 0 V 4 Al

28、l 12 pF VPPinput capacitance CVPP1/ TC= +25C, f =1 MHz VPP= 0 V 4 All 25 pF Address to output delay tACCSee figures 4 and 5 9,10,11 01 200 ns 02 250 to output delay tCESee figures 4 and 5 9,10,11 01 200 ns 02 250 to output delay tOESee figures 4 and 5 9,10,11 01 80 ns 02 85 high to output float tDF1

29、/ See figures 4 and 5 9,10,11 All 0 60 ns Output hold from addresses, or whichever occurred first tOH1/ See figures 4 and 5 9,10,11 All 0 ns 1/ Guaranteed but not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

30、IZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 Device types All Case outlines Q Terminal number Terminal symbol 1 VPP2 3 O154 O145 O136 O127 O118 O109 O910 O811 GND 12 O713 O614 O515 O416 O317 O218 O119 O020 21 A022 A123 A224

31、A325 A426 A527 A628 A729 A830 GND 31 A932 A1033 A1134 A1235 A1336 A1437 A1538 NC 39 40 VCCFIGURE 1. Terminal connections. Pin Names A0 A17Address Chip enable Output enable O0 O15Outputs Program NC No connection Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

32、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Pins A9A0 VPPVCCOutputs Mode Read VILVILX X(1) X X 5.0 V DOUTOutput disable VILVIHX X X X 5.0 V HIGH Z Standby VIHX X X X X 5.0 V HIGH Z Pr

33、ogramming VILVIHVILX X (Note 4) (Note 4) DINProgram verify VILVILVIHX X (Note 4) (Note 4) DOUTProgram inhibit VIHX X X X (Note 4) (Note 4) HIGH Z Intelligent Manufacturer (3) VILVILX VH(2) VILVCC5.0 V 0089 H Identifier Device (3) VILVILX VH(2) VIHVCC5.0 V OOFFH NOTES: 1. X can be VILor VIH. 2. VH= 1

34、2.0 V 0.5 V 3. A1-A8, A10-A15= VIL4. Contact vendor for VCCand VPPvoltages . FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-39

35、90 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Block diagram. FIGURE 4. Load circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

36、0 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. Typical values are for TC= 25C and nominal supply voltages. 2. This parameter is only sampled and is not 100 percent tested. 3. may be delayed up to tCE tOEafter the falling edge of without impact on tCE. FIGURE 5. Waveforms. Provided by IHS

37、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, a

38、ppendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.

39、5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow

40、option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply

41、 shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawi

42、ng. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus (DSCC), DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applica

43、ble required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to deliver. 3.10.1 Erasure of EPROMS. When specified

44、, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.10.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics provided as specified in 4.5. 3.10.3 Verification of erasu

45、re of programmability of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to b

46、e in the proper state shall constitute a device failure, and shall be removed from the lot. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-S

47、TD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

48、control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or

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