DLA SMD-5962-87760 REV J-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add case outlines L and 3. Add vendor CAGE 01295. Change vendor CAGE 07263 to 27014. Technical and editorial changes throughout. 91-04-22 M. A. Frye B Add B, S, Q, and V test limits. Change to one part-one part number format.

2、Add ground bounce and latch-up immunity tests. Add 10.1, substitution statement. Changes to table I. Editorial changes throughout. 92-07-09 Monica L. Poelking c Changes in accordance with NOR 5962-R161-93. 93-05-21 Monica L. Poelking D Make corrections to VOL3limits in table I. Update drawing to MIL

3、-PRF-38535 requirements. CFS 01-06-29 Thomas M. Hess E Add device type 03. Add radiation features for device type 01. Add vendor CAGE F8859. Add case outlines X and Z. Update boilerplate to MIL-PRF-38535 requirements. JAK 02-12-12 Thomas M. Hess F Add radiation hardness assurance level F for device

4、type 01. JAK 03-11-06 Thomas M. Hess G Add radiation features for device type 03 in section 1.5. Update the boilerplate to include radiation hardness assurance for device type 03. Editorial changes throughout. TVN 05-04-21 Thomas M. Hess H Update radiation hardness assurance boilerplate requirements

5、. Add appendix A to document. LTG 07-06-21 Thomas M. Hess J Update dimensions of case outline X to figure 1. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-12-19 Thomas M. Hess REV SHEET REV J J J J J J J J J J J J J J J SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27

6、 28 29 REV STATUS REV J J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND A

7、GENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH THREE- STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 87-12-23 REVISION LEVEL J SIZE A CAGE CODE 6726

8、8 5962-87760 SHEET 1 OF 29 DSCC FORM 2233 APR 97 5962-E089-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87760 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR

9、97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes B, Q, and M) and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (

10、PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 87760 01 S S A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (se

11、e 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

12、specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT244 Octal buffer/line driver with three-state outputs

13、, TTL compatible inputs 02 54ACT11244 Octal buffer/line driver with three-state outputs, TTL compatible inputs 03 54ACT244 Octal buffer/line driver with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product as

14、surance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q, or V Certification and qualification to MIL-PRF-38535 1.2.4 Ca

15、se outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line X See figure 1 20 Flat pack Z GDF

16、P1-G20 20 Flat pack with gullwing 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCC1-N28 28 Square leadless chip carrier Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87760 DLA LAND AND MARITIME COLUMBUS,

17、OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q, and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V

18、dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ Clamp diode current (IIK, IOK) . 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) . 200 mA Maximum power dissipation (PD) . 500 mW Storage temperature

19、range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds): Case outline X . +260C All other case outlines except case X +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) 175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC)

20、 +4.5 V dc to +5.5 V dc Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT). 0.0 V dc to VCCMinimum high level input voltage (VIH) . 2.0 V at VCC= 4.5 V and 5.5 V Maximum low level input voltage (VIL) 0.8 V at VCC= 4.5 V and 5.5 V Maximum high level output current (IOH) -24 mA Maxim

21、um low level output current (IOL) +24 mA Maximum input rise or fall time rate (t/v): VCC= 4.5 V 10 ns/V VCC= 5.5 V 8 ns/V Case operating temperature range (TC) . -55C to +125C 1.5 Radiation features. Device type 03: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 krads (Si) 5/ No s

22、ingle event latchup (SEL) occurs at LET (see 4.4.5.2) . 93 MeV-cm2/mg 5/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are refere

23、nced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low. 4/ The input negative voltage rating may be exceeded provided that the input clamp current rating is observ

24、ed. 5/ Limits obtained during technology characterization/qualification, guaranteed by design or process, but not production tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

25、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87760 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this

26、drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-ST

27、D-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at h

28、ttps:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the is

29、sues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. JESD78 - IC Latch-Up Test. (Copies of these documents are available online at http:/ww

30、w.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201-2107). ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of

31、this document is available online at http:/www.astm.org/ or from ASTM International, 100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawin

32、g takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified h

33、erein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class

34、 level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for devi

35、ce classes B, S, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87760 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHE

36、ET 5 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram.

37、The logic diagram shall be as specified on figure 4. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 5. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 6.

38、 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter l

39、imits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgr

40、oups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to

41、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accord

42、ance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes B, S, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of

43、compliance. For device classes B, S, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order

44、to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q, and V,

45、 the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes B, S, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix

46、A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that a

47、ffects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made

48、available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted withou

49、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87760 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V unless other