DLA SMD-5962-87766 REV D-2008 MICROCIRCUIT DIGITAL ADVANCED SCHOTTKY TTL NAND DRIVER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Made technical changes in table I. Editorial changes throughout. 89-09-12 W. Heckman B Changes in accordance with NOR 5962-R112-92. -tvn 92-01-16 Monica L. Poelking C Update to reflect latest changes in format and requirements. Editorial changes

2、throughout. -les 01-07-17 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 08-11-07 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 PMIC N/A PREPARED B

3、Y Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim A. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTKY TTL, NAND DRIVER, AND AGE

4、NCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-05-16 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-87766 SHEET 1 OF 7 DSCC FORM 2233 APR 97 5962-E263-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

5、MICROCIRCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3853

6、5, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87766 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device

7、 type Generic number Circuit function 01 54AS804 Hex 2-input NAND driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Fla

8、t package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range (VIN) . -1.2 V dc at -18 mA to +7.0 V dc Storage temp

9、erature range . -65C to +150C Maximum power dissipation (PD) 1/ 149 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.

10、5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to the short circuit test, e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking perm

11、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stan

12、dards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification fo

13、r. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of

14、these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited

15、 herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix

16、 A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML produ

17、ct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or funct

18、ion of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical

19、dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified

20、on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall

21、be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For

22、packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PR

23、F-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI

24、RCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C 1/ Group A subgroups Limits Unit unless otherwise specified Min Max High level

25、output voltage VOHIOH= -2 mA 1, 2, 3 2.5 V IOH= -3 mA 1, 2, 3 2.4 V VCC= 4.5 V, VIL= 0.8 V, VIH= 2.0 V 2/ IOH= -40 mA 1, 2, 3 2.0 V Low level output voltage VOLVCC= 4.5 V, VIL= 0.8 V, VIH= 2.0 V, IOL=40 mA 2/ 1, 2, 3 0.5 V Input clamp voltage VICVCC= 4.5 V, IN= -18 mA 1, 2, 3 -1.2 V Low level input

26、current IILVCC= 5.5 V, VIN= 0.4 V, Inputs not under test = 4.5 V 1, 2, 3 -0.5 mA High level input current IIH1VCC= 5.5 V, VIN= 2.7 V, Inputs not under test = 0.0 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7.0 V, Inputs not under test = 0.0 V 1, 2, 3 0.1 mA Output current IOVCC= 5.5 V, VIN= 2.25 V 3/ 1, 2,

27、3 -50 -200 mA Supply current ICCHVCC= 5.5 V, VIN= 0.0 V 1, 2, 3 5 mA ICCLVCC= 5.5 V, VIN= 4.5 V 1, 2, 3 27 mA Functional tests GND VIL VOL, VOH VIH VCC, See 4.3.1c 7, 8 9 1 5 ns Propagation delay time, A, B to Y tPLH, tPHLVCC= 4.5 V to 5.5 V, CL= 50 pF, RL= 500 4/ 10, 11 1 5 ns 1/ Unused inputs that

28、 do not directly control the pin under test must be 2.5 V or 0.4 V, but shall not exceed 5.5 V or go less than 0.0 V and no inputs shall be floating. 2/ All outputs must be tested. In the case where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be perform

29、ed with each input being selected as the VILmaximum or VIHminimum input. 3/ The output conditions have been chosen to produce a current that closely approximates one half of the true short circuit output current, IOS. Not more than one output shall be tested at a time and the duration of the test sh

30、all not exceed one second. 4/ Propagation delay limits are based on single output switching. Unused outputs = 3.5 V or 0.3 V. The load circuit shall consist of the specified RLand CLin parallel, with RLand CLtied to GND. The device test point shall be the common node of CL, RL, and device output. Vo

31、ltage waveforms shall be in accordance with method 3003 of MIL-STD-883, with measurement points at 10 percent and 90 percent. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMB

32、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, and 2 Terminal number Terminal Symbol 1 1A 2 1B 3 1Y 4 2A 5 2B 6 2Y 7 3A 8 3B 9 3Y 10 GND11 4Y 12 4A 13 4B 14 5Y 15 5A 16 5B 17 6Y 18 6A 19 6B 20 VCCFIGURE 1. Terminal connections. Inputs O

33、utput A B Y H H L L X H X L H H = High level.L Low level. X = Irrelevant. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

34、REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing

35、as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microc

36、ircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicabl

37、e required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with

38、method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document re

39、vision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. In

40、terim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-

41、STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applie

42、s to subgroup 1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87766 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 4.3 Quality conformance inspectio

43、n. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, metho

44、d 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condit

45、ion A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance

46、with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES

47、6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a cont

48、ractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to