DLA SMD-5962-88534 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS DUAL J-K FLIP-FLOP WITH SET AND CLEAR TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device class V criteria. Add RHA data. Editorial changes throughout. -jak 98-02-04 Thomas M. Hess B Add vendor CAGE F8859. Add case outline X. Add table III, delta limits. Update boilerplate to MIL-PRF-38535 requirements. - jak. 01-07-13 Thom

2、as M. Hess C Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-05-15 Thomas M. Hess REV SHET REV C C SHET 15 16 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT

3、DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-02-12 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH SE

4、T AND CLEAR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88534 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E349-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5

5、962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of

6、case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 R 88534 01

7、E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.2.4)Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 R 88534 01 V E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCa

8、se outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appe

9、ndix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT109 Dual J-K positive edge-triggered flip-flop

10、 with TTL compatible inputs 02 54ACT11109 Dual J-K positive edge-triggered flip-flop with TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added afte

11、r the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircu

12、its in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432

13、18-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CDFP3-F16

14、 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input

15、voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current. 20 mA DC output current (per pin) 50 mA DC VCCor GND current (per pin) . 100 mA Maximum power dissipation (PD) . 500 mW Storage temperature range (TSTG) . -65C to +150C Le

16、ad temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 4/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) 4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOU

17、T). +0.0 V dc to VCCCase operating temperature range (TC). -55C to +125C Input rise or fall times (VCC= 4.5 V to 5.5 V) 0 to 8 ns/V Minimum setup time, Jn or Kn to CPn, (ts): TC= -55C and +125C, VCC= 4.5 V . 5.5 ns Minimum removal time, CDn or SDn to CPn, (trem): TC= -55C and +125C, VCC= 4.5 V 0.5 n

18、s Minimum pulse width CPn (tpw): TC= -55C and +125C, VCC= 4.5 V 5.0 ns Minimum pulse width CDn or SDn (tpw): TC= +25C, VCC = 4.5 V . 6.5 ns TC= -55C and +125C, VCC= 4.5 V 7.0 ns Minimum hold time, Jn or Kn to CPn (th): TC= -55C and +125C, VCC= 4.5 V 2.0 ns Maximum frequency, (fmax): TC= +25C, VCC =

19、4.5 V . 95 MHz TC= -55C and +125C, VCC= 4.5 V 85 MHz 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The

20、limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. P

21、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 1.5 Radiation features. Maximum total dose availabl

22、e (dose rate = 50 300 rads(Si)/s) 100k rads(Si) 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents

23、are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component

24、 Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Doc

25、ument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. EL

26、ECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA

27、22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3

28、. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit,

29、 or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions

30、shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figu

31、re 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEE

32、T 5 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be mainta

33、ined by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characterist

34、ics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in

35、table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the

36、 device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification

37、 mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-3

38、8535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compl

39、iance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.

40、7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device

41、class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option

42、to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group numbe

43、r 38 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Ele

44、ctrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V Device type and VCCGroup A subgroups Limits 4/ Unit unless otherwise specified Device class Min Max Positive input clamp voltage VIC+5/ For input under test, IIN= 1.0

45、 mA All V 0.0 V 1 0.4 1.5 V Negative input clamp voltage VIC-5/ For input under test, IIN= -1.0 mA All V Open 1 -0.4 -1.5 V High level output voltage VOH VIN= VIHminimum or VILmaximumIOH= -50 A All All 4.5 V 4.4 V 3006 5/ 6/ 5.5 V 1, 2, 3 5.4 VIN= VIHminimum or VILmaximumIOH= -24 mA All All 4.5 V 1,

46、 2, 3 3.7 All All 5.5 V 1, 2, 3 4.7 VIN= VIHminimum or VILmaximumIOH= -50 mA All All 5.5 V 1, 2, 3 3.85 Low level output voltage VOL VIN= VIHminimum or VILmaximumIOL= 50 A All All 4.5 V 1, 2, 3 0.1 V 3007 5/ 6/ All All 5.5 V 0.1 All All 4.5 V 1, 2, 3 0.5 VIN= VIHminimum or VILmaximumIOL= 24 mA All A

47、ll 5.5 V 1, 2, 3 0.5 VIN= VIHminimum or VILmaximum IOL= 50 mA All All 5.5 V 1, 2, 3 1.65 High level input voltage VIH 7/ All All 4.5 V 1, 2, 3 2.0 V Low level input voltage VIL 7/ All 4.5 V 1, 2, 3 0.8 V Input leakage current high 3010 IIH5/ VIN= 5.5 V All All 5.5 V 1, 2, 3 1.0 A Input leakage curre

48、nt low 3009 IIL5/ VIN= 0.0 V All All 5.5 V 1, 2, 3 -1.0 A Quiescent supply current delta, TTL input levels 3005 ICC 5/ 8/ For input under test VIN= VCC- 2.1 V For all other inputs VIN= VCCor GND All All 5.5 V 1, 2, 3 1.6 mA M, D All 1 1.6 P, L, R All 3.5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM