DLA SMD-5962-88537 REV D-2011 MICROCIRCUIT LINEAR LOW-NOISE PRECISION HIGH SPEED OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change boilerplate to add device class V. Add case outline H for vendor CAGE 24355. Editorial changes throughout. 97-05-30 R. MONNIN B Made change to footnote 1/ in table IIA. Update boilerplate. -rrp 01-12-20 R. MONNIN C Change test symbol “IOS”

2、 to “IIO” in table IIB. -rrp 03-05-20 R. MONNIN D Update drawing to reflect current requirements. -rrp 11-02-09 C. SAFFLE REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rajesh Pithadia DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3

3、990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Rajesh Pithadia APPROVED BY Raymond Monnin MICROCIRCUIT, LINEAR, LOW-NOISE, PRECISION, HIGH SPEED OPERATIONAL AMPLIFIER, MONOLITHIC SILIC

4、ON DRAWING APPROVAL DATE 88-10-17 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88537 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E213-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88537 DLA LAND AN

5、D MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishe

6、s are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 88537 01 G A Federal stock class design

7、ator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 - 88537 01 V G A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lea

8、d finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA level

9、s and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 OP-37A Low-noise, precision, high-speed operational amplifier 02 OP-37B Low-n

10、oise, precision, high-speed operational amplifier 03 OP-37C Low-noise, precision, high-speed operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added a

11、fter the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microci

12、rcuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88537 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-399

13、0 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1

14、-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) . 22 V Internal power dissipation 500 mW 2/ Input voltage 22 V 3/

15、Output short-circuit duration Indefinite Differential input voltage . 0.7 V 4/ Differential input current . 25 mA 4/ Storage temperature range -65C to +150C Operating temperature range -55C to +125C Lead temperature (soldering, 60 seconds) +300C Junction temperature range (TJ) -65C to +150C Thermal

16、resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Cases G and H . 150C/W Case P 119C/W Case 2 110C/W 1.4 Recommended operating conditions. Supply voltage (VS) . 15 V Source resistor (RS) 50 Ambient operating temperature range (TA) . -55C to +125C 2. APP

17、LICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPAR

18、TMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. _ 1/ Stresses above the absolute maxim

19、um rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test, e.g., IOS. 3/ For supply voltages less than 22 V, the absolute maximum input voltage is equal to the s

20、upply voltages. 4/ The device inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise. If differential input voltage exceeds 0.7 V, the input current should be limited to 25 mA. Provided by IHSNot for ResaleNo reproduction or networking perm

21、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88537 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircui

22、t Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing

23、and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V

24、shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in

25、accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, app

26、endix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein . 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless oth

27、erwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified

28、in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitation

29、s, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535

30、, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes

31、 Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of

32、 supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herei

33、n or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits

34、delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review fo

35、r device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3

36、.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI

37、NG SIZE A 5962-88537 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset curre

38、nt IIO1 01 35 nA 2,3 50 1 02 50 2,3 85 1 03 75 2,3 135 Average input bias current IB1 01 40 nA 2,3 60 1 02 55 2,3 95 1 03 80 2,3 150 Common mode rejection ratio CMRR VCM= IVR = 11 V 2/ 1 01 114 dB VCM= IVR = 10 V 2/ 2,3 108 VCM= IVR = 11 V 2/ 1 02 106 VCM= IVR = 10 V 2/ 2,3 100 VCM= IVR = 11 V 2/ 1

39、03 100 VCM= IVR = 10 V 2/ 2,3 94 Power supply rejection ratio PSRR VS= 4.5 V to 18 V 1 01 10 V/V 2,3 16 1 02 10 2,3 20 1 03 20 2,3 51 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A

40、5962-88537 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Large signal volta

41、ge gain AVOVO= 10 V, RL 2 k 1 01 1000 V/mV 2,3 600 1 02 1000 2,3 500 1 03 700 2,3 300 Output voltage swing VORL 2 k 1 01 12 V 2,3 11.5 1 02 12 2,3 11 1 03 11.5 2,3 10.5 Power dissipation PDNo load, TA= +25C 1 01,02 140 mW 03 170 Offset voltage adjustment range VOSADJRP= 10 k, 3/ TA= +25C 1 All 0.5 m

42、V Supply current ISNo load, TA= +25C 1 01,02 4.67 mA 03 5.67 Output short-circuit current IOS+TA= +25C 1 All 80 mA IOS-80 Input offset voltage VIO4 01 25 V 5,6 60 4 02 60 5,6 200 4 03 100 5,6 300 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted with

43、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88537 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group

44、A subgroups Device type Limits Unit Min Max Slew rate SR VO= 7.5 V, RL= 2 k, CL= 50 pF, TA= +25C 7 All 11 V/s Average input offset voltage drift TCVOSUnnulled 4/ 8 01 0.6 V/C TA= -55C, +125C 02 1.3 03 1.8 1/ VS= 15 V, RS= 50 , unless otherwise specified. 2/ IVR is defined as the VCMrange used for th

45、e CMRR test. 3/ RPis a trim potentiometer used for adjustment of VOS. 4/ TCVOSis guaranteed, if not tested, to the limits specified. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in

46、 the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q a

47、nd V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality

48、conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, an