1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete subgroup 1 under the reverse breakdown temperature coefficient test as specified under Table I. In accordance with N.O.R. 5962-R260-92. 92-08-19 M. A. FRYE B Adding device type 03 for generic part number LM199A-20. Make changes to 1.2.1, 1
2、.2.2, table I, and 6.4. Redrawn. 93-04-27 M. A. FRYE C Drawing updated to reflect current requirements. - ro 08-04-03 R. HEBER THE ORIGNAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY CHARLES
3、E. BESORE DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. A. DiCENZO AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-07-26 MICROC
4、IRCUIT, LINEAR, PRECISION, 6.9 VOLT VOLTAGE REFERENCE, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88561 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E188-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI
5、T DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
6、 A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88561 01 X A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Gener
7、ic number Circuit function 01 LM199A Precision voltage reference 02 LM199 Precision voltage reference 03 LM199A-20 Precision voltage reference 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X
8、See figure 1 4 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Temperature stabilizer voltage (VH) 40 V Reverse breakdown current (IR) . 20 mA Forward current 1 mA Reference to substrate voltage . 40 V Power dissipation (PD) . 140 mW
9、 Storage temperature range . -65C to +150C Lead temperature (soldering, 60 seconds) . +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 200C/W 1.4 Recommended operating conditions. Ambient operating tempe
10、rature (TA) . -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENT
11、S 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE
12、 SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of
13、 Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19
14、111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.
15、REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manuf
16、acturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manageme
17、nt (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when
18、 the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal
19、 connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Elect
20、rical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 her
21、ein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shal
22、l be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or ne
23、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VH= 30 V Group
24、 A subgroups Device type Limits 1/ Unit unless otherwise specified Min Max Reverse breakdown voltage VR0.5 mA IR 10 mA 1,2,3 All 6.8 7.1 V Reverse breakdown change with current VR0.5 mA IR 10 mA 1,2,3 All 9 mV -55C TA +85C, 2,3 01,03 0.5 Reverse breakdown temperature coefficient VZ / T IR= 1 mA 02 1
25、 ppm / C +85C TA +125C, 01,03 10 IR= 1 mA 02 15 Reverse dynamic impedance ZRIR= 1 mA, TA= +25C 1 All 1 Forward voltage VFIR= 1 mA, TA= +25C 1 All -1.6 V Stabilized heater current IHVH= 30 V, (tested after 5 seconds of heater turn on time) 1 All 30 mA VH= 30 V, (still air) 2/ 2 14 3 85 Long term stab
26、ility Stabilized, 1000 hours, IR= 1 mA, 0.1 %, +22C TA +28C 1 03 20 ppm Zener peak noise voltage VNPK10 Hz frequency 10 kHz, IR= 1 mA, VH= 40 V, TA= +25C 1 All 80 V Zener RMS noise voltage VNRMS10 Hz frequency 10 kHz, IR= 1 mA, VH= 40 V, TA= +25C 1 All 20 V Peak heater current IHPKVH= 40 V, 1 % duty
27、 cycle, TA= +25C 4 All 200 mA ILVH= 40 V, TA= +25C 4 01,02 100 A Leakage zener to substrate 03 250 nA 1/ The algebraic convention, whereby the most negative value is a minimum and the most positive is maximum, is used in this table. Negative current shall be defined as conventional current flow out
28、of a device terminal. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218
29、-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHE
30、ET 6 DSCC FORM 2234 APR 97 Dimensions Inches Millimeters Notes Symbol Min Max Min Max A .224 .234 5.69 5.94 b .016 .019 0.41 0.48 2 b1 .016 .021 0.41 0.48 2 D .398 .419 10.11 10.39 e .100 BSC 2.54 BSC 4 e1 .050 BSC 1.27 BSC 4 F .010 BSC 0.25 BSC k .047 BSC 1.19 BSC k1 .008 BSC 0.20 BSC 3 L .400 - 10
31、.16 - L1 .200 - 5.08 - m .145 BSC 3.68 BSC m1 .175 BSC 4.44 BSC 45 BSC 45 BSC 4 NOTES: 1. Dimensions are in inches. 2. (All leads) b applies between L1and the seating plane. b1applies between L1and .400 (10.16 mm) from the seating plane. 3. Measured from the maximum diameter of the product. 4. Leads
32、 having a maximum diameter .019 (0.48 mm) measured in gauging plane .054 (1.37 mm) + .001 (0.03 mm) .000 (0.00 mm) below the base plane of the product shall be within .007 (0.18 mm) of their true-position relative to a maximum width tab. 5. The product may be measured by direct methods or by gauge.
33、6. Metric equivalents are given for general information only. FIGURE 1. Case outline continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R
34、EVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 CATHODE 2 ANODE 3 +VS4 -VSFIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE
35、 A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein
36、). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required
37、 in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activi
38、ty retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-3
39、8535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or
40、 D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the
41、 intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance in
42、spection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, 8, 9, 10, and
43、 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be ma
44、intained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005
45、 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88561 DEFENSE SUPPLY CENTER COLUMBUS
46、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004
47、) 1*, 2, 3, 4 Group A test requirements (method 5005) 1, 2, 3, 4 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6
48、.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination
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