DLA SMD-5962-88562 REV F-2009 MICROCIRCUIT LINEAR FAST PLUS MINUS 150 mA POWER BUFFER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I, change maximum for VOSand correct VINrange in footnote 1. Update format. Editorial changes throughout. 89-10-20 M. A. FRYE B Under the AVtest conditions column, delete “VOUT= 19.95 V” and substitute “VOUT= +18.5 V to -19.5 V” as specifie

2、d under Table I. Changes in accordance with N.O.R. 5962-R124-94. 94-03-21 M. A. FRYE C Drawing updated to reflect current requirements. Redrawn. - ro 01-12-06 R. MONNIN D Update drawing as part of 5 year review. rrp 06-03-03 R. MONNIN E Make change to the min limit for dimension “e” on case outline

3、Y in figure 1. -rrp 06-10-17 R. MONNIN F Add a note and make a change to the dimension “e” limit on case outline X as specified under figure 1. - ro 09-04-28 J. RODENBECK THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1

4、 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY JOSEPH A. KERBY CHECKED BY RAY MONNIN DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT

5、 OF DEFENSE DRAWING APPROVAL DATE 88-05-10 MICROCIRCUIT, LINEAR, FAST 150 mA, POWER BUFFER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-88562 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E277-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

6、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in a

7、ccordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88562 01 X A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit

8、function as follows: Device type Generic number Circuit function 01 1010 Fast 150 mA power buffer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 4 Can Y See figure 1 4 Flange mo

9、unt 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Total supply voltage (VS) 22 V dc Input voltage range . V- + 0.5 V dc to V+ - 1.5 V dc Power dissipation (PD) : Case X . 3.1 W Case Y . 5 W Output short circuit duration Indefinite Stor

10、age temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Case X . 40C/W Case Y . 25C/W 1.4 Recommended operating conditions. Total supply voltage (VS) 15 V dc Case operating temperature range (TC

11、) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Govern

12、ment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATI

13、ON MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Mi

14、crocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In th

15、e event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The i

16、ndividual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been gr

17、anted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to th

18、e requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design,

19、 construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections

20、shall be as specified on figure 1. 3.2.3 Functional diagram. The functional diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full c

21、ase operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

22、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC+125C unless otherwise specified Group A subgroups Device

23、 type Limits Unit Min Max Output offset voltage VOSIL= 0 mA 1 01 20 110 mV 2,3 -10 220 VS= 15 V, IL= 0 mA, VIN= 0 V 1 40 90 Input bias current IIBIL= 0 mA 1 01 0 150 A 2,3 300 IL 150 mA 1 0 250 Output resistance ROUTIL= 1 mA 1 01 6 9 IL= 150 mA 1 6 9 2,3 12 Slew rate SR VS= 15 V, VIN= 10 V, VOUT= 8

24、V, RL= 100 , TC= +25C 4 01 75 V/s Supply current ISIL= 0 mA 1 01 8 mA 2,3 9 Large signal gain AVVS= 20 V, IOUT= 0 mA, VOUT= +18.5 V to -19.5 V 4,5,6 01 0.995 1.00 V/V Saturation resistance RSAT100 mV output clipping, 1 01 18 IL= 150 mA 2,3 24 See footnotes at end of table. Provided by IHSNot for Res

25、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Condi

26、tions 1/ -55C TC+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max V+SOS100 mV output clipping, 1 01 1.0 V Positive saturation offset voltage IL= 0 mA 2,3 1.1 V-SOS100 mV output clipping, 1 01 0.2 V Negative saturation offset voltage IL= 0 mA 2,3 0.3 Bias terminal vol

27、tage 2/ VBIASRBIAS= 20 1 01 750 810 mV 2,3 560 925 1/ Unless otherwise specified, specifications apply for 4.5 V VS 40 V, V- + 0.5 V VIN V+ - 1.5 V. 2/ With case Y package, output stage quiescent current can be increased by connecting a resistor between the bias pin and V+. The increase is equal to

28、the bias terminal voltage divided by this resistance. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number

29、 is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” s

30、hall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-10

31、3 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of confor

32、mance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the

33、 acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

34、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 Case outline X Symbol Dimensions Note Inches Millimeters Min Max Min Max A .165 .195 4.19 4.95 b .016 .019 0.41 0.48 D .350 .370 8.89 9.40 D1 .305 .33

35、5 7.75 8.51 e .200 BSC 5.08 BSC 1 e1 .100 - 2.54 - F - .050 - 1.27 k .028 .034 0.71 0.86 k1 .029 .040 0.74 1.02 L .500 - 12.70 - NOTE: Leads having a maximum diameter 0.019 inch (.482 mm) measured in gauging plane .054 inch (1.37 mm) + .001 inch (.025 mm) - .000 inch (.000 mm) below the base plane o

36、f the product shall be within .007 inch (.177 mm) of their true position relative to a maximum width tab. FIGURE 1. Case outlines and terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8856

37、2 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 Case outline Y Symbol Dimensions Inches Millimeters Min Max Min Max A .320 .350 8.13 8.89 b .038 .043 0.97 1.09 D .760 .775 19.30 19.69 e .440 .465 11.18 11.81 e1 .220 .235 5.59 5.97 F - .116 -

38、2.95 L .420 .480 10.67 12.19 P .152 .162 3.86 4.11 q 1.177 1.197 29.90 30.40 R1 .167 .177 4.24 4.50 FIGURE 1. Case outlines and terminal connections Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-

39、88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Functional diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY

40、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD

41、-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level co

42、ntrol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final

43、 electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-8

44、83 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. E

45、nd-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to t

46、he preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by met

47、hod 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88562 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical tes

48、t requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*,2,3,4,5,6 Group A test requirements (method 5005) 1,2,3,4,5,6 Groups C and D end-point electrical parameters (method 5005) 1,2,3 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance w